My Inquiry
My Account
NXP Semiconductors MCIMX6DP6AVT8AB
- Part No.:
- MCIMX6DP6AVT8AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6DP6AVT8AB.pdf
- Description:
- IC MPU I.MX6DP 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,785
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6DP6AVT8AB from NXP Semiconductors is an automotive-grade i.MX 6DualPlus applications processor featuring dual Arm Cortex-A9 cores operating at 852 MHz, integrated 3D/2D/OpenVG graphics accelerators (OpenGL ES 3.0), 1080p video processing unit (VPU), and dual FlexCAN 1 Mbps interfaces. It delivers high-performance multimedia and real-time control for reconfigurable instrument clusters and infotainment systems.
For engineers reviewing the MCIMX6DP6AVT8AB datasheet, MCIMX6DP6AVT8AB pinout, MCIMX6DP6AVT8AB application, or MCIMX6DP6AVT8AB equivalent, key selection criteria include automotive temperature range (–40°C to +125°C), FCPBGA-624 package with 0.8 mm pitch, DDR3/DDR3L/LPDDR2 memory interface, and hardware-accelerated security (CAAM, TrustZone, A-HAB v4).
Technical Context
The MCIMX6DP6AVT8AB implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, NEON MPE co-processor, and Snoop Control Unit. It integrates dedicated hardware accelerators including VPU, dual IPUv3H image processors, GPU3Dv6 (198 MTri/s), GPU2Dv3, and GPUVG.
Its system architecture includes a 64-bit DDR3/DDR3L/LPDDR2 memory controller (up to DDR3-1066), four uSDHC ports supporting UHS-I SDR-104, PCIe v2.0 x1 root/endpoint, Gigabit Ethernet (IEEE 1588 compliant), HDMI 1.4, MIPI DSI/CSI-2, ESAI audio interface, ASRC, and two FlexCAN controllers - all qualified for automotive operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 852 MHz - enables concurrent real-time HMI rendering and vehicle subsystem control without OS scheduling bottlenecks. |
| Graphics Acceleration | GPU3Dv6 (OpenGL ES 3.0) + GPU2Dv3 + GPUVG - supports simultaneous 3D navigation UI, 2D instrumentation overlays, and vector-based dashboard graphics. |
| Video Processing | Integrated VPU with 1080p encode/decode - offloads CPU for multi-stream camera input (e.g., rearview + surround-view) in ADAS-adjacent systems. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to 1066 MHz - provides ≥8.5 GB/s bandwidth for high-resolution display buffering and video frame storage. |
| Automotive Interfaces | Dual FlexCAN 1 Mbps + MLB 150 Mbps + ESAI + ASRC - enables deterministic communication with ECUs, audio domain controllers, and multi-source infotainment head units. |
| Security | CAAM (16 KB secure RAM), TrustZone, A-HAB v4 (SHA-256, 2048-bit RSA), SNVS - meets ISO 26262 ASIL-B functional safety requirements for secure boot and firmware updates. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - supports automotive thermal cycling reliability and board-level rework compatibility. |
Pinout & Package
MCIMX6DP6AVT8AB is housed in a 21 mm × 21 mm FCPBGA package with 624 solder balls and 0.8 mm pitch. The lidded construction enhances thermal dissipation and mechanical robustness for under-hood and dashboard mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M | Primary crystal oscillator input | Mandatory 24 MHz reference for USB PHY operation and system clock generation; limits max SoC frequency to 996 MHz when used. |
| VDD_ARM | Core voltage supply (ARM domain) | Requires regulated 1.2 V ±3% supply; powers Cortex-A9 cores, L1/L2 caches, and SCU - critical for DVFS stability. |
| VDD_SOC | SoC logic voltage supply | 1.35 V ±3% supply for interconnect fabric, peripherals, and memory controllers; decoupling must meet ≤100 mΩ impedance target. |
| CAN1_TX / CAN1_RX | FlexCAN 1 differential transceiver interface | Direct connection to external CAN transceiver (e.g., TJA1043); supports ISO 11898-2 compliant 1 Mbps bus timing. |
| ENET_MDIO / ENET_MDC | Ethernet management interface | Provides IEEE 802.3-compliant MDIO/MDC access to external PHY registers for link negotiation and diagnostics. |
| SD1_CMD / SD1_CLK / SD1_DATA0–3 | uSDHC1 SD/SDIO interface | Supports UHS-I SDR104 mode (104 MB/s) for high-speed eMMC boot or infotainment storage expansion. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and software state retention reduce active-mode power by >40% vs. fixed-frequency operation while maintaining real-time response. |
| Dual IPUv3H Image Processors | Enable parallel de-warping, scaling, and blending of up to four camera inputs - essential for seamless 360° surround-view display composition. |
| Hardware AES/SHA/RNG (CAAM) | Offloads cryptographic operations from CPU; enables <50 ms secure boot verification and OTA firmware signature validation at runtime. |
| HDMI 1.4 + LVDS + MIPI DSI support | Allows simultaneous driving of primary cluster display (LVDS), rear-seat entertainment (HDMI), and digital dash overlay (MIPI DSI) without external muxing. |
| ASRC with 10-channel concurrency | Resolves sample rate mismatches between multiple audio sources (e.g., Bluetooth A2DP, tuner, navigation TTS) without CPU intervention or buffer underruns. |
Applications
| Reconfigurable Instrument Cluster | High-Performance Infotainment Head Unit |
|---|---|
|
Use Scenario: Digital cockpit with animated gauges, ADAS warnings, and navigation map overlay rendered on a single 12.3" LCD. IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS, managing GPU/VPU pipelines, and synchronizing display refresh via LVDS timing controller. Use Value: Dual Cortex-A9 cores isolate safety-critical cluster rendering (ASIL-B) from infotainment services, while GPU3Dv6 delivers 60 FPS 3D map rotation with <5 ms input-to-display latency. |
Use Scenario: In-vehicle system integrating voice assistant, wireless CarPlay/Android Auto, and multi-zone audio with HDMI output to rear displays. IC Role / Device Role / Timing Role: Central multimedia hub coordinating USB OTG/HSIC for smartphone mirroring, HDMI TX for video output, and ESAI/ASRC for multi-source audio mixing. Use Value: Integrated VPU enables simultaneous decode of two 1080p streams (e.g., navigation + media), while CAAM secures OTA updates and DRM-protected content playback. |
| Vehicle Telematics Control Unit (TCU) | Advanced Driver Assistance Systems (ADAS) Pre-Processor |
|
Use Scenario: Cellular-connected gateway aggregating CAN bus data, GNSS positioning, and remote diagnostics for fleet management. IC Role / Device Role / Timing Role: Real-time data concentrator interfacing with dual FlexCAN buses, GPS module via UART, and LTE modem via PCIe or USB. Use Value: Hardware-accelerated crypto (CAAM) enables TLS 1.2 handshake in <100 ms, while GPMI NAND controller stores firmware and log buffers with 40-bit BCH ECC for field reliability. |
Use Scenario: Front-facing camera pre-processing unit feeding object detection results to a separate AI accelerator (e.g., NPU). IC Role / Device Role / Timing Role: Low-latency image pipeline manager handling MIPI CSI-2 capture, ISP-level correction (via IPUv3H), and metadata tagging before forwarding to AI engine. Use Value: Dual IPUv3H units perform real-time lens distortion correction and dynamic range compression on 1920×1080@30 fps input, reducing AI inference load by 35%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP6AVT8AB | Quad-core Cortex-A9 @ 852 MHz; adds two additional CPU cores and enhanced VPU capabilities. | Better suited for concurrent multi-OS environments (e.g., hypervisor-based cluster + infotainment separation) requiring higher compute throughput. | Select MCIMX6QP6AVT8AB only if dual-core performance headroom is insufficient for target workload concurrency and real-time deadlines. |
| S32G274A | Arm Cortex-A53 + Cortex-M7 heterogeneous architecture; automotive ASIL-D certified; integrated Ethernet switch and hardware firewall. | Targeted at zonal gateways and central compute requiring functional safety certification, time-sensitive networking (TSN), and secure vehicle-to-cloud connectivity. | Choose S32G274A when ISO 26262 ASIL-D compliance, hardware-enforced network segmentation, or TSN synchronization are mandatory design requirements. |
Compared with MCIMX6DP6AVT8AB, MCIMX6QP6AVT8AB offers higher CPU parallelism but identical graphics and automotive peripheral sets, while S32G274A shifts focus from multimedia performance to safety-critical networking - making MCIMX6DP6AVT8AB optimal for cost-sensitive, graphics-intensive automotive HMI where dual-core determinism suffices.
Availability
MCIMX6DP6AVT8AB is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6DP6AVT8AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and automotive qualification standards.
The i.MX 6DualPlus product line was designed specifically for high-fidelity human-machine interfaces in automotive environments, balancing graphics performance, real-time responsiveness, and ASIL-B-ready security features within a thermally constrained footprint.
FAQ
What is the maximum operating temperature range for MCIMX6DP6AVT8AB?
The MCIMX6DP6AVT8AB is rated for automotive junction temperature operation from –40°C to +125°C, validated per AEC-Q100 Grade 2 requirements. This range ensures reliable function in under-dash and center-console locations where ambient temperatures exceed 85°C and thermal cycling is frequent. The FCPBGA package's lid and copper core aid heat dissipation under sustained 852 MHz operation.
Does MCIMX6DP6AVT8AB support secure boot with hardware root-of-trust?
Yes, MCIMX6DP6AVT8AB implements Advanced High Assurance Boot (A-HAB) v4 with SHA-256 hashing, 2048-bit RSA signature verification, and version control. Boot ROM validates signed images using keys fused into OCOTP, and CAAM provides secure key storage and cryptographic acceleration - establishing a hardware-enforced root-of-trust for firmware integrity.
Can MCIMX6DP6AVT8AB drive multiple displays simultaneously?
Yes, MCIMX6DP6AVT8AB supports up to four concurrent displays via its integrated interfaces: one parallel RGB/LVDS port (225 Mpixels/sec), one HDMI 1.4 port, one MIPI DSI port (2-lane, 1 Gbps), and one LVDS serial port. Total raw pixel throughput reaches 450 Mpixels/sec at 24 bpp, enabling independent rendering for digital cluster, center display, and rear-seat screens.
What memory types does MCIMX6DP6AVT8AB support natively?
MCIMX6DP6AVT8AB supports DDR3-1066, DDR3L-1066, and LPDDR2-800 via its 64-bit MMDC controller, plus NAND Flash (MLC/SLC, BCH up to 40-bit), NOR Flash, PSRAM, and OneNAND. It does not support DDR4 or LPDDR3/4. External memory configuration is managed through fuses and runtime software initialization per the i.MX 6DualPlus Reference Manual.
Is MCIMX6DP6AVT8AB pin-compatible with other i.MX 6DualPlus variants?
Yes, MCIMX6DP6AVT8AB shares identical FCPBGA-624 pinout and ball mapping with all i.MX 6DualPlus automotive-grade parts (e.g., MCIMX6DP4AVT8AB, MCIMX6DP6AVT1AB), differing only in fuse settings, speed grade, and feature enablement. PCB designs can be reused across these variants, provided power delivery and thermal layout accommodate the full-feature configuration.
MCIMX6DP6AVT8AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6DP
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3L, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6DP6AVT8AB FAQ
1.How can I place an order for MCIMX6DP6AVT8AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6DP6AVT8AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6DP6AVT8AB reliable?
The price and inventory of MCIMX6DP6AVT8AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6DP6AVT8AB is usually 5 days.
3.What payment methods are accepted for MCIMX6DP6AVT8AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6DP6AVT8AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6DP6AVT8AB?
MCIMX6DP6AVT8AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6DP6AVT8AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6DP6AVT8AB?
For technical support, including MCIMX6DP6AVT8AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6DP6AVT8AB requirements.
6.How does Aetrix verify that MCIMX6DP6AVT8AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6DP6AVT8AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6DP6AVT8AB meets industry standards.
7.What is the process for return or replacement of MCIMX6DP6AVT8AB?
All MCIMX6DP6AVT8AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6DP6AVT8AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6DP6AVT8AB part is unused and in its original packaging.
Return procedure for MCIMX6DP6AVT8AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6DP6AVT8AB Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
