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NXP Semiconductors MCIMX6DP6AVT8ABR
- Part No.:
- MCIMX6DP6AVT8ABR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6DP6AVT8ABR.pdf
- Description:
- IC MPU I.MX6DP 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,313
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Product details
Overview
MCIMX6DP6AVT8ABR from NXP Semiconductors is an automotive-grade i.MX 6DualPlus applications processor featuring dual Arm® Cortex®-A9 cores, 852 MHz maximum CPU frequency, integrated VPU and GPU, and FCPBGA-624 (21 × 21 mm, 0.8 mm pitch) packaging. It delivers full multimedia acceleration-including OpenGL ES 3.0 3D graphics (198 MTri/s), 1080p video encode/decode, dual IPUv3H, and ASRC-for reconfigurable instrument clusters and high-performance infotainment systems.
For engineers reviewing the MCIMX6DP6AVT8ABR datasheet, MCIMX6DP6AVT8ABR pinout, MCIMX6DP6AVT8ABR application, or MCIMX6DP6AVT8ABR equivalent, key selection criteria include automotive temperature range (−40°C to +125°C), DDR3/DDR3L/LPDDR2 memory interface support, dual FlexCAN 2.0B ports, HDMI 1.4 and MIPI DSI/CSI-2 connectivity, and hardware-accelerated security (CAAM, TrustZone, HABv4).
Technical Context
The MCIMX6DP6AVT8ABR implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, NEON MPE co-processor, and Snoop Control Unit. It integrates dedicated accelerators including VPU (H.264/H.265), GPU3Dv6 (OpenGL ES 3.0), GPU2Dv3, GPUVG (OpenVG 1.1), and two IPUv3H units for real-time image processing.
Its system architecture supports multiple concurrent display outputs (parallel LCD, HDMI 1.4, LVDS, MIPI DSI) at up to 450 Mpixels/sec total raw pixel rate, dual MIPI CSI-2 camera interfaces (up to 4 lanes, 800 Mbps/lane), and automotive-specific peripherals: two FlexCAN 2.0B controllers (1 Mbps), MLB 150 interface, ESAI audio subsystem, and ASRC for multi-channel asynchronous sample rate conversion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 852 MHz - enables deterministic real-time HMI rendering and parallel OS task handling |
| Graphics Acceleration | GPU3Dv6 (OpenGL ES 3.0, 198 MTri/s) + GPU2Dv3 + GPUVG - supports smooth 3D navigation UIs and 2D compositing without CPU load |
| Video Processing | VPU with H.264/H.265 decode/encode up to 1080p60 - enables simultaneous rear-view camera feed and media playback |
| Memory Interface | 64-bit DDR3/DDR3L-1066 & LPDDR2-800 - provides ≥17 GB/s bandwidth for multi-display frame buffers and video pipelines |
| Automotive Interfaces | 2× FlexCAN 2.0B (1 Mbps), MLB 150, ESAI, ASRC - meets CAN bus integration, multi-source audio routing, and ECU communication requirements |
| Security Engine | CAAM (16 KB secure RAM), TrustZone, A-HABv4 (SHA-256, 2048-bit RSA) - enables secure boot, encrypted firmware updates, and DRM-compliant content playback |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive underhood environments with thermal dissipation design margin |
| Temperature Range | −40°C to +125°C junction - certified for AEC-Q100 Grade 2 operation in instrument cluster and head unit deployments |
Pinout & Package
MCIMX6DP6AVT8ABR is housed in a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and integrated heat spreader lid. Pin assignments follow NXP's standardized signal naming convention (per IMX6 Series Standardized Signal Name Map EB792) and are documented in Section 6 of IMX6DQPAEC Rev. 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN_24M | Primary Oscillator Input | 24 MHz crystal reference required for USB PHY operation and system clock derivation |
| VDD_ARM | Core Voltage Supply | 1.1–1.3 V regulated supply for Arm Cortex-A9 cores and L1/L2 caches |
| VDD_SOC | System-on-Chip Voltage | 1.2–1.35 V supply powering MMDC, GPC, CCM, and peripheral logic |
| DDR_DQ[0:63] | DDR Data Bus | 64-bit bidirectional data interface supporting DDR3/DDR3L/LPDDR2 burst transfers |
| CAN1_TX / CAN1_RX | FlexCAN Channel 1 I/O | Differential CAN bus signals compliant with ISO 11898-2, supporting 1 Mbps data rate |
| HDMI_CEC / HDMI_SCL / HDMI_SDA | HDMI Auxiliary Interface | Consumer Electronics Control and DDC bus for display EDID readout and power coordination |
| CSI_MCLK / CSI_DATA[0:3] | MIPI CSI-2 Clock & Data | 4-lane MIPI CSI-2 receiver supporting up to 800 Mbps/lane for high-resolution camera input |
| MLB_CLK / MLB_DATA | MediaLB Interface | 150 Mbps MOST-compatible serial bus for audio/video network interconnection |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamic voltage and frequency scaling (DVFS) across CPU, GPU, VPU, and memory domains reduces active power by >40% vs. fixed-frequency operation |
| Multi-Display Support | Simultaneous drive of four independent displays (e.g., cluster LCD + HUD + rear-seat HDMI + MIPI DSI) via dedicated display controllers and pixel pipelines |
| Hardware Security Boot | A-HABv4 with SHA-256 signature verification, 2048-bit RSA key enforcement, and eFUSE-based CSU policy locking prevents unauthorized firmware execution |
| Real-Time Image Pipeline | Dual IPUv3H units perform concurrent de-interlacing, color space conversion, scaling, and overlay composition with sub-frame latency |
| Automotive Audio Architecture | ESAI + ASRC + AUDMUX enable synchronized multi-source, multi-rate audio routing (e.g., Bluetooth A2DP + tuner + navigation TTS) to 7.1 channel output |
| Industrial-Grade Reliability | Integrated temperature sensor, watchdog timers (2× WDOG), and SNVS-RTC ensure fail-safe operation and time-stamped diagnostics in safety-critical systems |
Applications
| Reconfigurable Digital Instrument Cluster | Automotive Head Unit Infotainment |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, ADAS alerts, and navigation turn-by-turn on a 12.3" TFT-LCD with animated transitions. IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS, driving display controller and decoding camera feeds for surround-view synthesis. Use Value: Dual Cortex-A9 + GPU3Dv6 enables 60 fps UI rendering while VPU processes 1080p rear-view video with <50 ms end-to-end latency. | Use Scenario: Concurrent playback of HD video, Bluetooth hands-free calling, SiriusXM radio streaming, and voice-controlled navigation on a 10.25" capacitive touchscreen. IC Role / Device Role / Timing Role: Central multimedia hub managing HDMI output to rear-seat displays, MIPI CSI-2 input from front camera, and FlexCAN messaging with HVAC and body control modules. Use Value: Integrated CAAM and TrustZone isolate secure payment transactions and DRM-protected media, while ASRC synchronizes audio streams from 5+ sources without jitter. |
| Advanced Driver Assistance System (ADAS) Display Processor | Commercial Vehicle Telematics Gateway |
Use Scenario: Fusion of radar, ultrasonic, and camera inputs into a unified 3D visualization dashboard showing blind-spot detection, lane departure, and forward collision warnings. IC Role / Device Role / Timing Role: Vision pre-processing engine using IPUv3H for sensor alignment and GPU2Dv3 for real-time overlay generation onto live camera feeds. Use Value: Hardware-accelerated image stitching and alpha-blending offloads CPU, enabling <100 ms display update from sensor capture to rendered output. | Use Scenario: Fleet management gateway aggregating GPS location, engine diagnostics (J1939 over CAN), driver ID (RFID), and cellular telemetry for remote monitoring and OTA updates. IC Role / Device Role / Timing Role: Secure edge node running Linux with dual FlexCAN interfaces for J1939 and CAN FD diagnostics, plus PCIe v2.0 for LTE modem expansion. Use Value: CAAM-secured boot and eMMC encryption protect fleet configuration data; SNVS-RTC maintains accurate timestamps for regulatory compliance logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP6AVT8ABR | Quad-core Cortex-A9 (vs. dual-core); identical VPU/GPU/IPU features, same package and temperature grade | Better suited for multi-OS virtualization (e.g., Android Auto + RTOS partition) and higher concurrent workload density | Select when >2 independent display pipelines or >4 camera inputs are required; otherwise MCIMX6DP6AVT8ABR offers optimal cost/performance balance |
| MCIMX8MQ6CVTIZAB | Arm Cortex-A53 quad-core + Cortex-M4 real-time core; newer 14 nm process; lacks MLB and ASRC; adds USB 3.0 and PCIe Gen3 | Targets next-gen digital cockpits with AI inference (via NPU) but requires redesign for legacy CAN/MLB-based audio networks | Choose for greenfield designs prioritizing long-term roadmap and neural processing; retain MCIMX6DP6AVT8ABR for CAN/MLB ecosystem compatibility and AEC-Q100 qualification continuity |
Compared with MCIMX6QP6AVT8ABR, the MCIMX6DP6AVT8ABR delivers lower power and cost for dual-display instrument clusters, while MCIMX8MQ6CVTIZAB introduces architectural discontinuity with no MLB/ASRC support-making MCIMX6DP6AVT8ABR the preferred choice for incremental upgrades within existing automotive platforms.
Availability
MCIMX6DP6AVT8ABR is available at Aetrix Electronics and suitable for automotive instrument clusters, head unit infotainment systems, and ADAS display processors requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6DP6AVT8ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based SoCs and automotive functional safety.
The i.MX 6DualPlus family, including MCIMX6DP6AVT8ABR, was designed specifically for high-reliability automotive human-machine interfaces-integrating graphics, vision, audio, and CAN/MLB connectivity into a single AEC-Q100 qualified SoC.
FAQ
What is the maximum operating frequency of the MCIMX6DP6AVT8ABR?
The MCIMX6DP6AVT8ABR operates at a maximum CPU frequency of 852 MHz. This speed grade is validated for automotive temperature range (−40°C to +125°C) and requires a 24 MHz crystal input for USB functionality. The actual achievable frequency may be limited to 792 MHz if the 24 MHz clock is used for USB PHY operation, per IMX6DQPAEC Rev. 3 erratum guidance.
Does the MCIMX6DP6AVT8ABR support HDMI 1.4 output?
Yes, the MCIMX6DP6AVT8ABR integrates a native HDMI 1.4 transmitter supporting up to 1080p60 resolution with HDCP 1.4 compliance. It includes dedicated HDMI_CEC, HDMI_SCL, and HDMI_SDA pins for display EDID communication and consumer electronics control, as confirmed in the i.MX 6DualPlus/6QuadPlus Automotive Applications Processors Reference Manual.
How many CAN interfaces does the MCIMX6DP6AVT8ABR provide?
The MCIMX6DP6AVT8ABR provides two fully independent FlexCAN 2.0B controllers (FlexCAN-1 and FlexCAN-2), each supporting 1 Mbps data rate and message filtering. These interfaces are automotive-qualified and support both standard and extended CAN identifiers, enabling direct connection to vehicle chassis and powertrain ECUs without external transceivers.
Is the MCIMX6DP6AVT8ABR qualified for automotive use?
Yes, the MCIMX6DP6AVT8ABR is AEC-Q100 Grade 2 qualified (−40°C to +125°C junction temperature) and designed for automotive applications including instrument clusters and infotainment systems. Its qualification is documented in the i.MX 6DualPlus/6QuadPlus Automotive Applications Processors datasheet (IMX6DQPAEC Rev. 3) and supported by NXP's automotive reliability testing program.
What type of external memory interfaces does the MCIMX6DP6AVT8ABR support?
The MCIMX6DP6AVT8ABR supports DDR3-1066, DDR3L-1066, and LPDDR2-800 memory interfaces with 64-bit data bus width. It also supports NAND Flash (with BCH up to 40-bit ECC), NOR Flash, PSRAM, and eMMC 4.41 via its GPMI and EIM peripherals-enabling flexible boot and storage configurations for automotive software-defined vehicles.
MCIMX6DP6AVT8ABR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6DP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3L, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6DP6AVT8ABR FAQ
1.How can I place an order for MCIMX6DP6AVT8ABR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6DP6AVT8ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6DP6AVT8ABR reliable?
The price and inventory of MCIMX6DP6AVT8ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6DP6AVT8ABR is usually 5 days.
3.What payment methods are accepted for MCIMX6DP6AVT8ABR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6DP6AVT8ABR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6DP6AVT8ABR?
MCIMX6DP6AVT8ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6DP6AVT8ABR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6DP6AVT8ABR?
For technical support, including MCIMX6DP6AVT8ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6DP6AVT8ABR requirements.
6.How does Aetrix verify that MCIMX6DP6AVT8ABR is sourced from the original manufacturer or authorized distributors?
All MCIMX6DP6AVT8ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6DP6AVT8ABR meets industry standards.
7.What is the process for return or replacement of MCIMX6DP6AVT8ABR?
All MCIMX6DP6AVT8ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6DP6AVT8ABR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6DP6AVT8ABR part is unused and in its original packaging.
Return procedure for MCIMX6DP6AVT8ABR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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