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NXP Semiconductors MCIMX6G2CVM05ABR

Part No.:
MCIMX6G2CVM05ABR
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
289-LFBGA
Datasheet:
AetrixMCIMX6G2CVM05ABR.pdf
Description:
IC MPU I.MX6G 528MHZ 289MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,081

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Product details

Overview

MCIMX6G2CVM05ABR from NXP Semiconductors is an automotive-grade i.MX 6UltraLite single-core ARM Cortex-A7 application processor operating at 528 MHz, featuring 128 KB L2 cache, dual 10/100 Mbps Ethernet controllers, dual FlexCAN interfaces, dual 12-bit ADCs (10 total channels), and integrated power management. It targets telematics and HMI systems requiring AEC-Q100 Grade 2 qualification (-40 °C to +125 °C).

For engineers reviewing the MCIMX6G2CVM05ABR datasheet, MCIMX6G2CVM05ABR pinout, MCIMX6G2CVM05ABR application, or MCIMX6G2CVM05ABR equivalent, key selection criteria include automotive temperature range compliance, dual CAN and dual Ethernet support, LPDDR2/DDR3/LPDDR3 memory interface capability, PXP pixel processing pipeline for display acceleration, and CAAM cryptographic acceleration with 32 KB secure RAM.

Technical Context

The MCIMX6G2CVM05ABR implements a single ARM Cortex-A7 core with TrustZone security, 32 KB L1 instruction and data caches, and a unified 128 KB L2 cache. Its memory subsystem supports 16-bit LPDDR2-800, DDR3-800, and LV-DDR3-800, alongside NAND flash with up to 40-bit BCH ECC via GPMI.

It integrates dual FlexCAN 2.0B controllers, dual 10/100 Mbps IEEE 1588-compliant Ethernet MACs, three SAI audio interfaces, and hardware accelerators including PXP for 2D image processing and ASRC for asynchronous sample rate conversion across up to 10 channels.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Single ARM Cortex-A7 with TrustZone, 32 KB L1 I/D cache, 128 KB unified L2 cache
Operating Frequency 528 MHz - fixed maximum clock speed per automotive qualification
Temperature Range -40 °C to +125 °C junction - AEC-Q100 Grade 2 qualified for automotive under-hood use
Memory Interfaces LPDDR2/DDR3/LV-DDR3 (16-bit), NAND (with 40-bit BCH ECC), NOR, Quad SPI, eMMC 4.5
Connectivity Peripherals Dual 10/100 Mbps Ethernet (IEEE 1588), dual FlexCAN 2.0B, 8 UARTs, 4 I2C, 4 eCSPI, 3 SAI
Multimedia Acceleration PXP for color-space conversion/scaling/alpha-blending; ASRC supporting 10-channel concurrent sample rate conversion
Security Features CAAM with AES/SHA/RNG, SNVS with secure RTC, CSU, A-HAB v4 boot, 1536-bit eFUSE array

Pinout & Package

MCIMX6G2CVM05ABR uses a 14 × 14 mm plastic BGA package with 0.8 mm pitch and 361 I/O balls. Pin assignments follow the i.MX 6UltraLite Automotive Applications Processors reference layout (IMX6ULRM), with dedicated ball groups for DDR, Ethernet, CAN, USB, and display interfaces.

Pin/Terminal Circuit Role Design Meaning
ENET1_TXD0–3 / ENET1_RXD0–3 Ethernet MAC1 Data Interface Direct connection to external PHY; supports 10/100 Mbps MII/RMII operation
FLEXCAN1_TX / FLEXCAN1_RX FlexCAN Controller 1 Differential Pair Requires external CAN transceiver; compliant with ISO 11898-2 physical layer
CSI_D0–23 / CSI_VSYNC / CSI_HSYNC Parallel Camera Sensor Interface Supports BT.656 and 24-bit RGB/YUV input up to 148.5 MHz pixel clock
LCD_DATA0–23 / LCD_CLK / LCD_ENABLE Parallel LCD Interface Drives WXGA (1366×768) displays at 60 Hz; supports 8/16/18/24-bit RGB modes
VDD_ARM / VDD_SOC / VDDA / VDDIO Power Supply Domains Separate regulated inputs for core (1.0–1.25 V), SoC (1.0–1.25 V), analog (1.0–1.25 V), and I/O (1.8/3.3 V)

Key Features

Feature Design Value
Integrated Power Management Unit (PMU) On-die LDOs reduce external regulator count; simplifies power sequencing for automotive cold-crank conditions
PXP Pixel Processing Pipeline Hardware-accelerated 2D operations (rotation, CSC, alpha-blend) offload CPU; enables smooth UI rendering on resource-constrained HMIs
CAAM Cryptographic Accelerator Hardware AES-128/256, SHA-1/256, RNG, and 32 KB secure RAM enable fast secure boot and DRM without software overhead
Dual FlexCAN 2.0B Controllers Independent CAN buses support simultaneous vehicle network communication (e.g., powertrain + infotainment domains)
ASRC Asynchronous Sample Rate Converter Simultaneous conversion of up to 10 audio streams between independent clock domains - essential for multi-source automotive audio systems

Applications

Automotive Telematics Gateway Instrument Cluster HMI

Use Scenario: Central gateway aggregating cellular modem, GPS, Bluetooth, and vehicle bus data for OTA updates and remote diagnostics.

IC Role / Device Role / Timing Role: Main application processor executing Linux-based middleware, managing dual CAN/Ethernet routing, and synchronizing time-critical telemetry via IEEE 1588.

Use Value: Dual Ethernet enables isolated diagnostic and infotainment networks; 1536-bit eFUSE supports secure provisioning of unique device identities.

Use Scenario: Real-time digital instrument cluster rendering speed, RPM, navigation, and ADAS alerts on TFT-LCD with minimal latency.

IC Role / Device Role / Timing Role: Display controller with PXP acceleration handling overlay composition and color-space conversion for mixed analog/digital sources.

Use Value: PXP delivers 1-pixel/clock throughput for 1366×768@60Hz rendering; ASRC synchronizes audio alerts across multiple clock domains without jitter.

Connected Rear-Seat Entertainment Automotive Head Unit Audio Processor

Use Scenario: Multi-zone entertainment system decoding video/audio streams while accepting touch input and managing USB peripherals.

IC Role / Device Role / Timing Role: Application processor running Android Automotive OS, driving dual displays via LCDIF, and managing dual SDIO card ports for media expansion.

Use Value: Dual 12-bit ADCs monitor battery voltage and thermal sensors; eMMC 4.5 interface enables fast app loading from embedded storage.

Use Scenario: High-fidelity audio processing unit mixing Bluetooth, tuner, and USB sources into multi-channel amplifier outputs.

IC Role / Device Role / Timing Role: Audio subsystem controller using three SAI interfaces and ASRC to align sample rates from diverse sources before DSP processing.

Use Value: ASRC achieves <−120 dB THD+N across 10 channels; CAAM accelerates Dolby Digital encoding for surround sound output.

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX6G2CVM07AB Higher 696 MHz core frequency; same 1536-bit eFUSE, dual CAN/Ethernet, and peripheral set Required for compute-intensive tasks like real-time video analytics or multi-display compositing Select MCIMX6G2CVM07AB when >528 MHz performance headroom is needed without changing PCB layout or firmware abstraction layer
MCIMX6Y2CVM08AB i.MX 6SoloX dual-core (Cortex-A9 + Cortex-M4); different architecture, larger 196-ball BGA, no PXP or ASRC Targets asymmetric workloads where M4 handles real-time control while A9 runs Linux GUI Choose MCIMX6Y2CVM08AB only if partitioned real-time + application processing is mandatory; not drop-in compatible

Compared with MCIMX6G2CVM05ABR, MCIMX6G2CVM07AB offers higher deterministic throughput for display/audio pipelines, while MCIMX6Y2CVM08AB trades multimedia acceleration for heterogeneous core flexibility - neither shares identical pinout or register-level compatibility.

Availability

MCIMX6G2CVM05ABR is available at Aetrix Electronics and suitable for automotive telematics gateways, digital instrument clusters, and head unit HMIs requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6G2CVM05ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and automotive qualification.

The i.MX 6UltraLite family - including MCIMX6G2CVM05ABR - was designed specifically for cost-sensitive, power-efficient automotive HMI and telematics applications requiring AEC-Q100 Grade 2 reliability and hardware-accelerated multimedia.

FAQ

What is the qualified temperature range for MCIMX6G2CVM05ABR?

The MCIMX6G2CVM05ABR is rated for −40 °C to +125 °C junction temperature and meets AEC-Q100 Grade 2 automotive qualification. This enables deployment in under-hood and dashboard environments where ambient temperatures exceed commercial-grade limits. The part's thermal design requires adherence to NXP's recommended PCB copper pour and thermal vias per the i.MX 6UltraLite Hardware Development Guide.

Does MCIMX6G2CVM05ABR support LPDDR3 memory?

Yes, MCIMX6G2CVM05ABR supports LPDDR3-800 via its 16-bit MMDC interface, as confirmed in Section 4.10 of the IMX6ULAEC datasheet. It also supports LPDDR2-800 and DDR3-800 with identical timing constraints. Memory initialization must follow NXP's DDR stress test tool sequence to ensure signal integrity at automotive temperature extremes.

How many CAN interfaces does MCIMX6G2CVM05ABR integrate?

MCIMX6G2CVM05ABR integrates two FlexCAN 2.0B controllers (FLEXCAN1 and FLEXCAN2), each with full message buffering, ID filtering, and loopback/self-test modes. Both interfaces require external CAN transceivers and support bit rates up to 1 Mbps. They are electrically isolated in routing to prevent coupling in high-noise automotive environments.

Is MCIMX6G2CVM05ABR pin-compatible with MCIMX6G1AVM05AA?

No, MCIMX6G2CVM05ABR is not pin-compatible with MCIMX6G1AVM05AA. Although both use the 14×14 mm BGA package, MCIMX6G2CVM05ABR has 361 balls versus 289 for the G1 variant, and signal ball assignments differ significantly - especially for Ethernet, LCD, and CSI interfaces. Migration requires PCB redesign and firmware adaptation.

What security features are implemented in MCIMX6G2CVM05ABR?

MCIMX6G2CVM05ABR includes CAAM for AES/SHA acceleration, SNVS with tamper-detect RTC, CSU-enforced security policies, A-HABv4 secure boot with SHA-256 and 2048-bit RSA, and 1536-bit eFUSE for key storage and configuration locking. These features collectively enable secure firmware updates, encrypted storage, and runtime attestation - all validated per NXP's i.MX 6UltraLite Security Reference Manual (IMX6ULSRM).

MCIMX6G2CVM05ABR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
289-LFBGA
Series:
i.MX6G
Packaging:
Tape & Reel (TR)
Product Status:
Active
Core Processor:
ARM® Cortex®-A7
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
528MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS
Ethernet:
10/100Mbps (2)
SATA:
-
USB:
USB 2.0 + PHY (2)
Voltage - I/O:
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Supplier Device Package:
289-MAPBGA (14x14)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART

MCIMX6G2CVM05ABR FAQ

1.How can I place an order for MCIMX6G2CVM05ABR through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6G2CVM05ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6G2CVM05ABR reliable?

The price and inventory of MCIMX6G2CVM05ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6G2CVM05ABR is usually 5 days.

3.What payment methods are accepted for MCIMX6G2CVM05ABR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6G2CVM05ABR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6G2CVM05ABR?

MCIMX6G2CVM05ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6G2CVM05ABR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6G2CVM05ABR?

For technical support, including MCIMX6G2CVM05ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6G2CVM05ABR requirements.

6.How does Aetrix verify that MCIMX6G2CVM05ABR is sourced from the original manufacturer or authorized distributors?

All MCIMX6G2CVM05ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6G2CVM05ABR meets industry standards.

7.What is the process for return or replacement of MCIMX6G2CVM05ABR?

All MCIMX6G2CVM05ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6G2CVM05ABR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6G2CVM05ABR part is unused and in its original packaging.

Return procedure for MCIMX6G2CVM05ABR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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