NXP Semiconductors MCIMX6G2DVM05AB
- Part No.:
- MCIMX6G2DVM05AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 289-LFBGA
- Datasheet:
-
MCIMX6G2DVM05AB.pdf
- Description:
- IC MPU I.MX6UL 528MHZ 289MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:814
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Product details
Overview
MCIMX6G2DVM05AB from NXP Semiconductors is a single-core ARM Cortex-A7 applications processor operating at 528 MHz, housed in a 14 × 14 mm, 0.8 mm pitch BGA package. It integrates 128 KB L2 cache, dual 10/100 Mbps Ethernet controllers (ENET1/ENET2), two FlexCAN interfaces, and supports LPDDR2, DDR3, DDR3L, NAND, NOR, eMMC, and Quad SPI memory interfaces. It targets cost-sensitive industrial HMI and IoT gateway designs requiring secure boot and hardware-accelerated multimedia.
For engineers reviewing the MCIMX6G2DVM05AB datasheet, MCIMX6G2DVM05AB pinout, MCIMX6G2DVM05AB application, or MCIMX6G2DVM05AB equivalent, key selection criteria include confirmed dual Ethernet + dual CAN support, 128 KB L2 cache presence, 14×14 BGA package compatibility, and verified i.MX 6UltraLite G2-series peripheral configuration per Table 2 of IMX6ULCEC Rev. 2.2.
Technical Context
The MCIMX6G2DVM05AB implements ARM Cortex-A7 with TrustZone security, 32 KB L1 instruction and data caches, and a dedicated Snoop Control Unit (SCU). Its memory subsystem includes 128 KB unified L2 cache - present only on G2/G3 derivatives - and internal OCRAM (128 KB) plus secure RAM (32 KB).
It features hardware accelerators including PXP for 2D image processing (color-space conversion, alpha-blending, rotation), ASRC for asynchronous audio sample rate conversion across up to 10 channels, and CAAM for cryptographic acceleration with NIST-certified PRNG and 32 KB secure RAM. Power management includes DVFS, SW state retention, and integrated LDOs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A7 single core with TrustZone, 32 KB L1 I/D cache, private timer, NEON MPE co-processor |
| Max Operating Frequency | 528 MHz - defines real-time throughput ceiling for Linux-based HMI and gateway applications |
| L2 Cache | 128 KB unified - enables deterministic latency for multimedia pipelines and concurrent peripheral handling |
| Memory Interfaces | LPDDR2-800 / DDR3-800 / DDR3L-800, Raw/Managed NAND (BCH up to 40-bit), NOR, eMMC 4.5, Quad SPI - supports mixed-boot and field-upgradable storage |
| Ethernet & CAN | Dual 10/100 Mbps IEEE 1588-compliant ENET controllers + dual FlexCAN 2.0B modules - enables redundant industrial networking and vehicle telematics integration |
| Security Features | HABv4 with SHA-256/2048-bit RSA, CAAM crypto engine, SNVS secure RTC, CSU policy enforcement, TZASC address space control - meets secure boot and DRM requirements |
| Package | BGA, 14 × 14 mm, 0.8 mm pitch, 289-ball - compatible with standard PCB assembly processes and thermal vias for industrial ambient operation |
Pinout & Package
MCIMX6G2DVM05AB uses a 289-ball MAPBGA package (14 × 14 mm, 0.8 mm pitch), with ball assignments defined in Section 6.1 of IMX6ULCEC Rev. 2.2. Pin functions are highly muxed; critical signals include ENET1/ENET2 MDIO/MDC, FLEXCAN1/FLEXCAN2 TX/RX, UART1–UART4, and LCDIF data/control lines. Power domains (VDD_ARM, VDD_SOC, VDDA_3P3, etc.) require strict sequencing per Section 4.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.0–1.25 V input for ARM Cortex-A7 core; requires low-noise regulation and tight transient response |
| VDD_SOC | SoC logic voltage | 1.0–1.25 V for L2 cache, MMDC, and interconnect; shares regulator with VDD_ARM in many designs |
| ENET1_MDC / ENET1_MDIO | PHY management interface | Open-drain I²C-like bus for configuring external 10/100 PHY (e.g., KSZ8081); requires pull-up to 3.3 V |
| FLEXCAN1_TX / FLEXCAN1_RX | CAN transceiver interface | Differential pair routed to external CAN transceiver (e.g., TJA1042); must be length-matched and shielded |
| BOOT_MODE0 / BOOT_MODE1 | Boot configuration inputs | Strapped at power-on to select boot source (eMMC, QSPI, SD, NAND); weak internal pull-downs |
| USB_OTG1_ID | OTG role detection | Grounded for device mode, floating for host mode; used by USB PHY to configure OTG controller behavior |
Key Features
| Feature | Design Value |
|---|---|
| 128 KB L2 cache | Reduces average memory access latency by >40% vs. L1-only execution; essential for real-time video overlay and multi-threaded GUI rendering |
| Dual 10/100 Ethernet + dual FlexCAN | Enables simultaneous industrial protocol bridging (e.g., Modbus TCP over ENET1, CANopen over FLEXCAN2) without software arbitration |
| PXP pixel pipeline | Offloads CPU for 2D graphics operations - scaling, alpha-blending, rotation - at up to 1 pixel/clock, enabling smooth WXGA (1366×768) UI updates |
| CAAM cryptographic engine | Accelerates AES-256, SHA-256, RSA-2048, and HMAC operations in hardware; eliminates CPU overhead for secure firmware updates and TLS handshake |
| ASRC with 10-channel concurrency | Supports independent sample rate conversion for multiple audio streams (e.g., VoIP + local playback + telemetry), eliminating clock domain conflicts |
Applications
| Industrial HMI | IoT Gateway |
|---|---|
|
Use Scenario: Touch-enabled panel in factory automation system displaying real-time PLC status, alarms, and recipe controls. IC Role / Device Role / Timing Role: Main applications processor executing Linux Qt-based GUI, driving parallel RGB LCD via LCDIF, sampling resistive touch via TSC, and communicating with PLC over ENET1. Use Value: 128 KB L2 cache ensures <100 ms UI frame refresh; PXP enables hardware-accelerated widget animation; dual Ethernet allows isolated control and monitoring networks. |
Use Scenario: Edge node aggregating sensor data from Modbus RTU, CAN bus, and BLE peripherals before forwarding to cloud via cellular/Wi-Fi. IC Role / Device Role / Timing Role: Central protocol translator running embedded Linux, hosting Modbus TCP server, CANopen master stack, and MQTT client; manages secure OTA updates via CAAM. Use Value: Dual FlexCAN + dual Ethernet enables concurrent fieldbus and backhaul connectivity; ASRC handles audio telemetry; HABv4 ensures signed firmware integrity. |
| Smart Access Control Panel | Telematics Control Unit |
|
Use Scenario: Secure entry terminal with RFID/NFC reader, keypad, and biometric sensor, enforcing EMV-compliant smart card authentication. IC Role / Device Role / Timing Role: Root-of-trust processor managing secure boot, validating EMV SIM1/SIM2 transactions, encrypting credential storage in SNVS, and controlling door lock actuator via GPIO/PWM. Use Value: CSU-enforced security policy prevents unauthorized debug access; CAAM performs EMV-certified cryptographic operations; secure RTC enables time-bound access tokens. |
Use Scenario: In-vehicle unit collecting GPS, accelerometer, and CAN bus diagnostics for fleet management and driver behavior analytics. IC Role / Device Role / Timing Role: Real-time data concentrator interfacing with u-blox GPS module (UART), ST LIS3DH (I2C), and vehicle CAN network (FLEXCAN1/FLEXCAN2), logging to eMMC with wear-leveling. Use Value: Dual CAN ports allow simultaneous powertrain and body network monitoring; 528 MHz Cortex-A7 sustains concurrent GNSS parsing, sensor fusion, and LTE upload; ECC NAND support ensures log integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6G3DVM05AB | Same 528 MHz Cortex-A7 core, identical 14×14 BGA package, but adds CSI camera interface and second LCDIF channel | Required for dual-display or parallel camera input use cases; not needed for single-HMI or gateway-only designs | Select MCIMX6G3DVM05AB only if CSI or secondary display interface is mandatory; otherwise MCIMX6G2DVM05AB offers lower BOM cost and reduced layout complexity |
| MCIMX6Y2DVM05AB | i.MX 6SoloX variant: dual-core (Cortex-A9 + Cortex-M4), no L2 cache, different peripheral set (single ENET, no FlexCAN2), same 14×14 BGA | Suitable for asymmetric multiprocessing (AMP) where M4 handles real-time control while A9 runs Linux; lacks dual CAN/Ethernet redundancy | Choose MCIMX6Y2DVM05AB when deterministic real-time control (M4) is required alongside rich OS (A9); avoid if dual industrial networking is critical |
Compared with MCIMX6G3DVM05AB, MCIMX6G2DVM05AB reduces silicon cost and power by omitting CSI and secondary LCDIF, making it optimal for single-interface HMI. Against MCIMX6Y2DVM05AB, it delivers deterministic dual-networking capability without AMP complexity - ideal for Linux-based gateways needing guaranteed ENET+CAN concurrency.
Availability
MCIMX6G2DVM05AB is available at Aetrix Electronics and suitable for industrial HMI, IoT gateway, and telematics control unit designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for production ramp.
Supply support for MCIMX6G2DVM05AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and edge AI.
The i.MX 6UltraLite family - including MCIMX6G2DVM05AB - was designed specifically for cost-optimized, power-efficient consumer and industrial applications requiring Linux-capable processing, hardware security, and rich peripheral integration without multicore overhead.
FAQ
What is the maximum operating temperature range for MCIMX6G2DVM05AB?
The MCIMX6G2DVM05AB is rated for a junction temperature range of 0 °C to +95 °C, classified as commercial grade ('D' suffix per i.MX 6UltraLite part numbering nomenclature). This makes it suitable for indoor industrial environments and consumer electronics enclosures without active cooling, provided board-level thermal design meets the 2048 mW max power dissipation limit under worst-case conditions.
Does MCIMX6G2DVM05AB support secure boot, and how is it implemented?
Yes, MCIMX6G2DVM05AB supports Advanced High Assurance Boot (A-HAB) v4 with SHA-256 hashing, 2048-bit RSA signature verification, version control, and warm boot capability. Boot ROM enforces chain-of-trust starting from signed bootloader images stored in eMMC or QSPI flash, with CSU and TZASC ensuring runtime memory isolation and CAAM accelerating cryptographic operations during validation.
Which memory types are supported by MCIMX6G2DVM05AB for primary application storage?
MCIMX6G2DVM05AB supports LPDDR2-800, DDR3-800, and DDR3L-800 for main system memory, plus managed NAND (eMMC 4.5), raw NAND (with BCH up to 40-bit ECC), NOR flash, and Quad SPI flash for boot and firmware storage. The MMDC controller handles all DRAM timing, while GPMI manages NAND I/O and error correction.
Can MCIMX6G2DVM05AB drive a WXGA (1366×768) display, and what interface does it use?
Yes, MCIMX6G2DVM05AB can drive WXGA resolution at 60 Hz using its LCDIF parallel display interface, supporting up to 85 MHz pixel clock and 24-bit RGB888 format. The integrated PXP accelerator enables real-time scaling and alpha-blending for overlays, reducing CPU load during dynamic UI rendering - a key capability confirmed for G2-series devices in Table 2 of IMX6ULCEC Rev. 2.2.
How many CAN interfaces does MCIMX6G2DVM05AB include, and are they fully compliant?
MCIMX6G2DVM05AB includes two FlexCAN modules (FLEXCAN1 and FLEXCAN2), both fully compliant with CAN 2.0B specification supporting standard and extended message frames, bit rates up to 1 Mbps, and hardware message filtering. This dual-CAN capability is explicitly listed for G2 derivatives in Table 2 of IMX6ULCEC Rev. 2.2 and enables redundant or multi-domain vehicle/industrial network communication.
MCIMX6G2DVM05AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 289-LFBGA
- Series:
- i.MX6UL
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A7
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 528MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3, DDR3L
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD, LVDS
- Ethernet:
- 10/100Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 289-MAPBGA (14x14)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
MCIMX6G2DVM05AB FAQ
1.How can I place an order for MCIMX6G2DVM05AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6G2DVM05AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6G2DVM05AB reliable?
The price and inventory of MCIMX6G2DVM05AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6G2DVM05AB is usually 5 days.
3.What payment methods are accepted for MCIMX6G2DVM05AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6G2DVM05AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6G2DVM05AB?
MCIMX6G2DVM05AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6G2DVM05AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6G2DVM05AB?
For technical support, including MCIMX6G2DVM05AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6G2DVM05AB requirements.
6.How does Aetrix verify that MCIMX6G2DVM05AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6G2DVM05AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6G2DVM05AB meets industry standards.
7.What is the process for return or replacement of MCIMX6G2DVM05AB?
All MCIMX6G2DVM05AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6G2DVM05AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6G2DVM05AB part is unused and in its original packaging.
Return procedure for MCIMX6G2DVM05AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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