NXP Semiconductors MCIMX6G3DVK05AA-NXP

Overview

MCIMX6G3DVK05AA from NXP Semiconductors is a single-core ARM Cortex-A7 applications processor operating at 528 MHz, packaged in a 9 × 9 mm, 0.5 mm pitch MAPBGA. It integrates 128 KB L2 cache, dual 10/100 Mbps Ethernet controllers (ENET1/ENET2), two FlexCAN interfaces, and a Pixel Processing Pipeline (PXP) for real-time 2D image processing. It targets cost-sensitive, power-efficient embedded HMI and IoT gateway designs requiring parallel LCDIF, CSI camera input, and secure boot.

For engineers reviewing the MCIMX6G3DVK05AA datasheet, MCIMX6G3DVK05AA pinout, MCIMX6G3DVK05AA application, or MCIMX6G3DVK05AA equivalent, key selection criteria include confirmed 9×9 mm BGA package compatibility, dual Ethernet + dual CAN support, L2 cache presence, industrial temperature grade (0 to +95 °C), and verified PXP/ASRC multimedia acceleration - all explicitly specified for the G3 variant in IMX6ULCEC Rev. 2.2.

Technical Context

The MCIMX6G3DVK05AA implements ARM Cortex-A7 with TrustZone security, featuring private timer, NEON MPE co-processor, and Snoop Control Unit (SCU). Its memory subsystem includes 32 KB L1 instruction/data caches, 128 KB unified L2 cache, 128 KB OCRAM, and 96 KB boot ROM with HABv4 secure boot.

It supports dual 10/100 Mbps IEEE 1588-compliant Ethernet MACs, two FlexCAN 2.0B controllers, one parallel CSI interface (up to 148.5 MHz pixel clock), and LCDIF driving WXGA (1366 × 768) at 60 Hz. Power management includes integrated LDOs, DVFS, and SW state retention for ARM/NEON domains.

Key Specifications

Pinout & Package

MCIMX6G3DVK05AA uses a 9 × 9 mm, 0.5 mm pitch MAPBGA package (VK suffix), with 289 balls (BGA-289). Pin assignments follow the i.MX 6UltraLite VK package layout defined in Section 6.2 of IMX6ULCEC Rev. 2.2 (pages 116–128), including dedicated ball groups for DDR, VDD_SOC/VDD_ARM power domains, differential clocks, and high-speed interfaces (USB, CSI, LCDIF).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6G2DVK05AA, MCIMX6G3DVK05AA adds critical dual Ethernet and dual CAN for network-isolated or fault-tolerant systems; versus MCIMX6Y2DVK05AA, it trades CPU speed for verified multimedia acceleration and deterministic I/O concurrency essential in display- and sensor-rich edge devices.

Availability

MCIMX6G3DVK05AA is available at Aetrix Electronics and suitable for industrial HMI terminals, smart home gateways, POS terminals, and telematics control units requiring stable component supply, long-term lifecycle assurance, and NXP-qualified production silicon.

Supply support for MCIMX6G3DVK05AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 6UltraLite product line was designed specifically for cost-optimized, power-efficient consumer and industrial applications requiring Linux-capable processing with integrated security, display, and connectivity - with the G3 variant targeting dual-network edge devices.

FAQ

What is the maximum operating frequency of the MCIMX6G3DVK05AA?

The MCIMX6G3DVK05AA operates at a fixed maximum frequency of 528 MHz, as specified in Table 1 of the IMX6ULCEC Rev. 2.2 datasheet. This frequency applies across the full 0 to +95 °C junction temperature range and is not user-configurable beyond factory settings. The MCIMX6G3DVK05AA does not support higher-speed grades like 696 MHz (07 suffix) or overclocking.

Does the MCIMX6G3DVK05AA include L2 cache, and how does it impact system performance?

Yes, the MCIMX6G3DVK05AA includes 128 KB of unified L1/L2 cache, a feature confirmed for G2 and G3 variants in Section 1.2 of IMX6ULCEC Rev. 2.2. This cache significantly reduces DDR bandwidth pressure during concurrent display (LCDIF), camera (CSI), and audio (ASRC) operations - enabling smoother real-time multimedia workflows without CPU bottlenecks in the MCIMX6G3DVK05AA.

What security features are implemented in hardware on the MCIMX6G3DVK05AA?

The MCIMX6G3DVK05AA integrates multiple hardware security blocks: HABv4 for secure boot with SHA-256 and 2048-bit RSA; CAAM for cryptographic acceleration (AES/SHA/DES) and NIST-certified random number generation; SNVS for secure RTC and tamper detection; and CSU/TZASC for TrustZone-based memory and peripheral access control - all documented in the i.MX 6UltraLite Security Reference Manual and confirmed for G3 devices.

Can the MCIMX6G3DVK05AA support dual-display output?

No, the MCIMX6G3DVK05AA supports only a single parallel LCD interface (LCDIF) with up to WXGA (1366 × 768) resolution at 60 Hz, as stated in Section 7 of IMX6ULCEC Rev. 2.2. It lacks secondary display controllers such as LVDS or HDMI transmitters. Dual-display capability requires higher-tier i.MX 6Quad or i.MX 8 processors - the MCIMX6G3DVK05AA is optimized for single-display HMI use cases.

What is the package type and ball count for the MCIMX6G3DVK05AA?

The MCIMX6G3DVK05AA uses a 9 × 9 mm, 0.5 mm pitch MAPBGA package (VK suffix) with 289 solder balls, as defined in Section 6.2 of IMX6ULCEC Rev. 2.2 (pages 116–128). This compact footprint is distinct from the larger 14 × 14 mm VM package used in DVM-suffix variants and requires specific PCB layout rules for signal integrity and thermal dissipation.