My Inquiry
My Account
NXP Semiconductors MCIMX6L2DVN10AA
- Part No.:
- MCIMX6L2DVN10AA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 432-TFBGA
- Datasheet:
-
MCIMX6L2DVN10AA.pdf
- Description:
- IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,112
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6L2DVN10AA from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, featuring 256 KB L2 cache, DDR3-800/ LPDDR2-800 memory interface, and integrated power management. It delivers 128 KB on-chip RAM (OCRAM), supports five UARTs (up to 5 Mbps), four eCSPI, three I²C (400 kbps), 10/100 Mbps Ethernet, and USB 2.0 OTG + host with PHY - optimized for cost-sensitive, low-power embedded consumer devices.
For engineers reviewing the MCIMX6L2DVN10AA datasheet, MCIMX6L2DVN10AA pinout, MCIMX6L2DVN10AA application, or MCIMX6L2DVN10AA equivalent, key selection considerations include its absence of GPU and EPDC hardware blocks, commercial temperature grade (0°C to +95°C), 13×13 mm 0.5 mm pitch MAPBGA package, and support for secure boot via HABv4 with SHA-256 and 2048-bit RSA.
Technical Context
The MCIMX6L2DVN10AA implements a single ARM Cortex-A9 core (r2p10) with TrustZone security, 32 KB L1 instruction and data caches per core, and a unified 256 KB L2 cache. Its memory subsystem includes boot ROM (96 KB), OCRAM (128 KB), and external interfaces for DDR3/LPDDR2, NOR Flash, PSRAM, and eMMC up to HS200 mode (200 MB/s).
Power management is handled by an integrated PMU with DVFS, software state retention, clock gating, and thermal monitoring via TEMPMON. Peripheral connectivity includes LCDIF (WUXGA@60 Hz), parallel camera port (66 MHz), four MMC/SDIO ports (UHS-I SDR-104), SPDIF, AUDMUX, and GPIO with dual-rail (1.8 V / 3.3 V) configurability - all muxed through IOMUXC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single ARM Cortex-A9 MPCore (r2p10) with TrustZone, 1 GHz max frequency - enables Linux/Android execution with hardware security isolation. |
| L2 Cache | 256 KB unified instruction/data cache - reduces memory bandwidth pressure and improves deterministic latency for real-time tasks. |
| Memory Interface | 16/32-bit DDR3-800 or LPDDR2-800 - supports up to 2 GB external RAM with sub-15 ns access timing for multimedia buffering. |
| On-Chip RAM | 128 KB OCRAM - provides low-latency, non-cacheable memory for boot code, firmware, or real-time ISR handling. |
| USB Interfaces | Two HS USB 2.0 OTG + one HS USB 2.0 host with integrated PHY - enables device/host dual-role operation without external transceivers. |
| Security Features | HABv4 (SHA-256, 2048-bit RSA), SNVS, CSU, DCP, RNG - enables authenticated boot, encrypted storage, and tamper-evident RTC operation. |
| Temperature Grade | Commercial: 0°C to +95°C junction - validated for indoor consumer electronics with passive cooling only. |
Pinout & Package
MCIMX6L2DVN10AA is housed in a 13 × 13 mm, 0.5 mm pitch, 289-ball MAPBGA package (RoHS-compliant, MSL3). Ball map follows i.MX 6SoloLite standard signal naming convention per IMX6SLSRM and EB792 mapping documents.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.0–1.25 V input for CPU core domain; requires tight regulation and local decoupling for stable 1 GHz operation. |
| VDD_SOC | SoC Logic Power Supply | 1.2–1.3 V supply for L2 cache, MMDC, CCM, and peripheral logic - shared rail with DDR termination voltage. |
| DDR_DQ[0:15] | DDR Data Bus (x16) | 16-bit bidirectional data lines for DDR3/LPDDR2; require matched trace length and controlled impedance (40–50 Ω) for signal integrity. |
| BOOT_MODE[0:1] | Boot Configuration Inputs | Pull-up/pull-down resistors set primary boot source (eMMC, NAND, SPI NOR, SD); sampled at reset release. |
| USB_OTG1_ID | OTG Role Detection | Direct connection to USB ID pin determines host/device role; internal pull-up enables A-device detection without external circuitry. |
| ENET_REF_CLK | Ethernet Reference Clock | 25 MHz differential input from external crystal or oscillator - required for 10/100 Mbps MAC timing compliance. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | DVFS + dynamic power gating reduce active power by >40% vs fixed-frequency operation while maintaining full 1 GHz capability under load. |
| Secure Boot Architecture | HABv4 enforces cryptographic signature verification of boot image before execution - prevents unauthorized firmware loading in production units. |
| Multilevel Memory System | L1/L2 caches + OCRAM + DDR3 coherency enable deterministic response for audio/video pipelines and real-time control loops. |
| Flexible I/O Multiplexing | IOMUXC allows any of 128 GPIO pins to be assigned to UART, I²C, eCSPI, PWM, or ADC functions - simplifies PCB layout reuse across variants. |
| Hardware Accelerated Security | DCP performs AES-128/256, SHA-1/256, and RSA operations in <10 μs per 128-bit block - offloads crypto from CPU for secure OTA updates. |
Applications
| Barcode Scanners | Entry-Level Tablets |
|---|---|
Use Scenario: Handheld industrial scanners requiring fast decode latency, battery life >8 hours, and ruggedized firmware update capability. IC Role / Device Role / Timing Role: Central applications processor executing Zebra-compatible scanning SDK, managing CMOS sensor interface, and driving USB HID-class output. Use Value: Integrated USB PHY and 5 UARTs eliminate transceiver ICs; DVFS extends runtime by scaling voltage/frequency during idle scan intervals. | Use Scenario: Low-cost educational tablets with 7-inch WVGA display, Wi-Fi/BT module, and Android Go OS targeting emerging markets. IC Role / Device Role / Timing Role: Main SoC running Linux-based UI stack, driving LCDIF at 60 Hz, and coordinating eMMC HS200 boot and storage I/O. Use Value: 128 KB OCRAM hosts bootloader and kernel decompressor - avoids slow NAND read penalties; DDR3-800 sustains 1.2 GB/s peak bandwidth for UI rendering. |
| Smart Retail Kiosks | Industrial HMIs |
Use Scenario: Self-service retail terminals with touch LCD, thermal printer, and secure payment processing in ambient temperatures up to +50°C. IC Role / Device Role / Timing Role: Secure applications processor hosting EMV L2 kernel, managing I²C-connected payment reader, and driving 10/100 Mbps Ethernet for cloud sync. Use Value: SNVS-backed RTC maintains audit logs across power cycles; HABv4 ensures only signed payment firmware executes - meeting PCI PTS v6.0 requirements. | Use Scenario: Panel-mounted human-machine interface in factory automation, requiring deterministic response to Modbus RTU over RS485 and local display refresh. IC Role / Device Role / Timing Role: Real-time controller interfacing with PLC via UART1 (9-bit RS485), updating 800×480 LCD at 30 Hz using LCDIF, and logging events to eMMC. Use Value: Four independent PWMs generate precise 1–100 kHz control signals for LED indicators; GPT timers provide sub-1 μs timestamping for event correlation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6L3DVN10AB | Includes GPU2Dv2 and GPUVGv2 graphics accelerators; otherwise identical CPU, memory, and peripheral configuration. | Required for UIs with OpenGL ES 1.1 or OpenVG 1.1 rendering; adds ~150 mW active power and 1.2 mm² die area. | Select when hardware-accelerated 2D vector graphics or BitBLT operations are mandatory for display performance. |
| MCIMX6L2EVN10AB | Same feature set as MCIMX6L2DVN10AA but rated for -40°C to +105°C junction temperature. | Suitable for automotive cabin modules or outdoor kiosks where extended thermal range is required. | Choose for deployments outside commercial temperature envelope; no PCB or firmware changes needed. |
Compared with MCIMX6L2DVN10AA, MCIMX6L3DVN10AB adds graphics acceleration at higher power and cost, while MCIMX6L2EVN10AB extends thermal reliability without functional change - enabling direct substitution in harsh environments.
Availability
MCIMX6L2DVN10AA is available at Aetrix Electronics and suitable for barcode scanners, entry-level tablets, and industrial HMIs requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for MCIMX6L2DVN10AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The i.MX 6SoloLite product line targets cost-optimized, low-power consumer electronics - delivering balanced performance, security, and peripheral integration without GPU or EPDC overhead.
FAQ
What is the maximum DDR3 speed supported by MCIMX6L2DVN10AA?
MCIMX6L2DVN10AA supports DDR3-800 (400 MHz clock, 800 MT/s data rate) with 16-bit or 32-bit bus width. This enables sustained memory bandwidth up to 1.2 GB/s for multimedia buffering and OS execution. The MMDC controller includes programmable timing registers compliant with JEDEC DDR3 standards, and validation covers 2 GByte address space with CL = 5–7 latencies.
Does MCIMX6L2DVN10AA include hardware graphics acceleration?
No, MCIMX6L2DVN10AA explicitly omits GPU2Dv2 and GPUVGv2 hardware blocks per Table 1 of the IMX6SLCEC datasheet. It relies on CPU-based rendering or external GPU for graphical workloads. This distinguishes it from MCIMX6L3DVN10AB (GPU-enabled) and aligns with its target use in text/UI-light applications like barcode scanners and basic HMIs.
What boot devices are supported by MCIMX6L2DVN10AA?
MCIMX6L2DVN10AA supports boot from eMMC (HS200 mode), NAND Flash, SPI NOR Flash, SD/MMC cards, and OneNAND via configurable BOOT_MODE pins. The 96 KB boot ROM includes HABv4 for authenticated loading, and secondary boot loaders can be stored in OCRAM or external memory. USB serial download is also available for recovery.
Is MCIMX6L2DVN10AA pin-compatible with other i.MX 6SoloLite variants?
Yes, all i.MX 6SoloLite MAPBGA packages (including MCIMX6L2DVN10AA, MCIMX6L3DVN10AB, and MCIMX6L2EVN10AB) share identical 289-ball 13×13 mm layout and signal ball map. Pin-to-pin compatibility is confirmed in Section 6.2 of IMX6SLCEC Rev. 6, enabling hardware reuse across performance, graphics, and temperature variants.
What security features are implemented in MCIMX6L2DVN10AA?
MCIMX6L2DVN10AA integrates HABv4 (SHA-256, 2048-bit RSA), SNVS with tamper-detect RTC, CSU-enforced security policy, DCP for AES/SHA/RSA acceleration, and RNG. These features enable secure boot, encrypted storage, and firmware authentication - validated per NXP's i.MX 6SoloLite Security Reference Manual (IMX6SLSRM) and aligned with Common Criteria EAL4+ requirements.
MCIMX6L2DVN10AA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 432-TFBGA
- Series:
- i.MX6SL
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (3)
- Voltage - I/O:
- 1.2V, 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 432-MAPBGA (13x13)
- Additional Interfaces:
- AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
MCIMX6L2DVN10AA FAQ
1.How can I place an order for MCIMX6L2DVN10AA through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6L2DVN10AA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6L2DVN10AA reliable?
The price and inventory of MCIMX6L2DVN10AA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L2DVN10AA is usually 5 days.
3.What payment methods are accepted for MCIMX6L2DVN10AA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L2DVN10AA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6L2DVN10AA?
MCIMX6L2DVN10AA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6L2DVN10AA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6L2DVN10AA?
For technical support, including MCIMX6L2DVN10AA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L2DVN10AA requirements.
6.How does Aetrix verify that MCIMX6L2DVN10AA is sourced from the original manufacturer or authorized distributors?
All MCIMX6L2DVN10AA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L2DVN10AA meets industry standards.
7.What is the process for return or replacement of MCIMX6L2DVN10AA?
All MCIMX6L2DVN10AA units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L2DVN10AA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6L2DVN10AA part is unused and in its original packaging.
Return procedure for MCIMX6L2DVN10AA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6L2DVN10AA Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
