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NXP Semiconductors MCIMX6L2DVN10AB

Part No.:
MCIMX6L2DVN10AB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
432-TFBGA
Datasheet:
AetrixMCIMX6L2DVN10AB.pdf
Description:
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,984

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Product details

Overview

MCIMX6L2DVN10AB from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, designed for cost-sensitive consumer electronics with no integrated GPU or EPD controller. It supports DDR3-800 and LPDDR2-800 memory, includes 256 KB L2 cache, and delivers multimedia acceleration via NEON MPE and SDMA-used in entry-level tablets and barcode scanners requiring deterministic real-time I/O handling.

For engineers reviewing the MCIMX6L2DVN10AB datasheet, MCIMX6L2DVN10AB pinout, MCIMX6L2DVN10AB application, or MCIMX6L2DVN10AB equivalent, key selection criteria include its 13×13 mm MAPBGA package, commercial temperature grade (0°C to +95°C), absence of GPU/EPDC hardware, DVFS support for power-constrained deployments, and full peripheral muxing flexibility across UART, eCSPI, I2C, USB OTG, and LCDIF interfaces.

Technical Context

The MCIMX6L2DVN10AB implements a single ARM Cortex-A9 core with TrustZone security, 32 KB L1 instruction and data caches, and a 256 KB unified L2 cache. Its memory subsystem integrates MMDC supporting 16-/32-bit DDR3-800 and LPDDR2-800, plus 128 KB on-chip OCRAM for low-latency code execution.

Peripheral connectivity includes two HS USB 2.0 OTG ports with integrated PHYs, five UARTs (one with 8-wire support), four eCSPI controllers, three I2C buses (400 kbps), 10/100 Mbps FEC Ethernet, and LCDIF supporting up to WUXGA resolution at 60 Hz-configured via IOMUXC with software-selectable alternate functions per pin.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Single ARM Cortex-A9 MPCore @ 1 GHz - enables Linux/Android boot with deterministic real-time response for embedded UI tasks.
L2 Cache 256 KB unified I/D cache - reduces external memory bandwidth demand and improves instruction/data throughput for multimedia workloads.
Memory Interface 16-/32-bit DDR3-800 / LPDDR2-800 - supports up to 2 GB external RAM with configurable timing for low-power mobile operation.
USB Interfaces 2× HS USB 2.0 OTG + 1× HS USB host - enables dual-role peripheral connectivity and inter-chip USB without external PHY components.
Temperature Grade 0°C to +95°C junction - validated for commercial indoor applications including handheld scanners and portable HMI terminals.
Package 13×13 mm MAPBGA, 0.5 mm pitch, 289-ball - compatible with standard SMT reflow profiles and supports high-density PCB routing.
Security Features ARM TrustZone, HABv4 secure boot, SNVS, CSU, DCP - enables encrypted firmware loading, tamper detection, and runtime isolation for trusted execution environments.

Pinout & Package

MCIMX6L2DVN10AB uses a 13×13 mm, 0.5 mm pitch MAPBGA package with 289 solder balls. Pin assignments follow NXP's standardized signal naming convention (IMX6 Series Signal Name Mapping EB792) and are fully documented in Section 6.2 of IMX6SLCEC Rev. 6.

Pin/Terminal Circuit Role Design Meaning
VDD_ARM Core voltage supply 1.1–1.3 V input for ARM core domain; requires dedicated low-noise LDO regulation per power sequencing requirements.
VDD_SOC SoC logic voltage 1.2–1.3 V supply for system logic, CCM, GPC, and peripheral domains; shares regulator with DDR I/O in some configurations.
DDR_DQ[0:15] DDR data bus 16-bit bidirectional data lines for DDR3/LPDDR2 interface; require matched trace lengths and controlled impedance (50 Ω ±10%).
USB_OTG1_DP/DM USB differential pair Full-speed/HS-capable differential signals routed to USB connector; require 90 Ω differential impedance and ESD protection.
UART1_TXD/RXD Primary debug UART Default console interface for bootloader and kernel messages; supports RS232 level translation via external transceiver.
BOOT_MODE[0:1] Boot configuration Pull-up/pull-down resistors set boot source (eMMC, NAND, SPI NOR); must be stable before POR release.

Key Features

Feature Design Value
Dynamic Voltage and Frequency Scaling (DVFS) Reduces core voltage and clock frequency during idle or low-MIPS tasks-enabling sub-200 mW active power in audio decode scenarios.
Smart DMA (SDMA) Engine Offloads CPU from memory-mapped peripheral transfers using 32-channel time-division multiplexing-reducing interrupt latency by >60% in camera sensor streaming.
IOMUX Flexibility Each pad supports ≥3 alternate functions (e.g., UART2_RXD / eCSPI1_MISO / GPIO4_IO21)-allowing single-board reuse across multiple product variants.
Secure Boot (HABv4) Verifies signed firmware images using 2048-bit RSA keys stored in eFUSE-prevents unauthorized code execution and enforces chain-of-trust in production firmware updates.
Temperature Monitoring On-die thermal sensor feeds TEMPMON module to trigger automatic throttling or system shutdown above 95°C junction-ensuring reliability in sealed enclosures.

Applications

Barcode Scanner Terminal Industrial HMI Panel

Use Scenario: Handheld or fixed-mount scanner processing 1D/2D barcodes in retail or warehouse environments.

IC Role / Device Role / Timing Role: Central applications processor executing real-time image capture, decoding, and USB HID report generation.

Use Value: Integrated USB OTG and SDMA enable zero-latency camera frame transfer and direct HID-class enumeration-eliminating external bridge ICs.

Use Scenario: Fanless panel PC controlling PLCs, sensors, and actuators in factory automation cabinets.

IC Role / Device Role / Timing Role: Deterministic I/O coordinator managing UART-based Modbus RTU, PWM-driven status indicators, and LCDIF-driven 7-inch WVGA display.

Use Value: Five UARTs with 4-wire/8-wire support and programmable FIFO thresholds ensure reliable serial protocol timing-even under 100% CPU load.

Entry-Level Tablet Connected Medical Reader

Use Scenario: Low-cost educational tablet running Android Go with basic web browsing and document viewing.

IC Role / Device Role / Timing Role: Single-core application processor delivering sufficient MIPS for AOSP framework while maintaining thermal envelope.

Use Value: DDR3-800 interface and 256 KB L2 cache sustain 300+ MB/s memory bandwidth-supporting smooth 720p video playback and app launch responsiveness.

Use Scenario: Portable patient vitals reader aggregating Bluetooth LE sensor data and displaying results on monochrome LCD.

IC Role / Device Role / Timing Role: Secure data aggregator with HABv4-verified firmware and SNVS-backed RTC for audit-trail timestamping.

Use Value: Integrated DCP co-processor accelerates AES-128 encryption of PHI data prior to BLE transmission-meeting HIPAA-aligned data-at-rest requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX6L3DVN10AB Includes GPU2Dv2 and GPUVG graphics accelerators; otherwise identical CPU, memory, and peripheral specs. Required for GUI-intensive applications (e.g., animated menus, vector icons) where MCIMX6L2DVN10AB lacks hardware rendering capability. Select when display pipeline demands OpenVG 1.1 or BitBLT acceleration-adds ~$1.20 BOM cost but eliminates software rendering overhead.
MCIMX6Y2DVM09AB ARM Cortex-A7 core @ 950 MHz, 128 KB L2 cache, 10×10 mm 272-ball BGA, no GPU/EPDC-lower power, smaller footprint. Better suited for ultra-low-power battery-operated devices (<500 mW typical) where 1 GHz peak performance is unnecessary. Choose for size- and power-constrained designs needing same peripheral count but reduced thermal design complexity.

Compared with MCIMX6L2DVN10AB, MCIMX6L3DVN10AB adds graphics acceleration at higher cost and thermal load, while MCIMX6Y2DVM09AB trades peak performance for lower static power and smaller package-making each suitable for distinct tiers of cost, power, and UI complexity requirements.

Availability

MCIMX6L2DVN10AB is available at Aetrix Electronics and suitable for barcode scanner terminals, industrial HMI panels, and entry-level tablets requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for MCIMX6L2DVN10AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications-with over 40 years of microcontroller and SoC innovation.

The i.MX 6SoloLite product line targets cost-optimized consumer electronics, delivering ARM Cortex-A9 performance with integrated power management and multimedia peripherals-designed specifically for eReaders, entry tablets, and portable scanners where GPU/EPDC functionality is optional.

FAQ

What is the maximum DDR3 memory speed supported by MCIMX6L2DVN10AB?

MCIMX6L2DVN10AB supports DDR3-800 (400 MHz clock, 800 MT/s data rate) across 16- or 32-bit interfaces. This is confirmed in Section 4.10 of the IMX6SLCEC datasheet, which specifies tAC, tRCD, and tRP timing parameters aligned to JEDEC DDR3-800 standards. The MMDC controller handles all PHY-level training and calibration automatically during boot.

Does MCIMX6L2DVN10AB include hardware graphics acceleration?

No, MCIMX6L2DVN10AB explicitly omits GPU2Dv2 and GPUVG hardware accelerators-as indicated in Table 1 of the IMX6SLCEC datasheet under "Options" for this part number ("no GPU, no EPDC"). Graphics rendering must be performed in software or via external GPU, unlike MCIMX6L3DVN10AB which includes both units.

What boot devices are supported by MCIMX6L2DVN10AB?

MCIMX6L2DVN10AB supports boot from eMMC (rev 4.4/4.41), NAND Flash, SPI NOR Flash, and SD/MMC cards-configured via BOOT_MODE[0:1] pins. Section 5.2 of IMX6SLCEC Rev. 6 details interface allocation, including mandatory 24 MHz crystal requirement for USB-enabled boot sources.

Is MCIMX6L2DVN10AB pin-compatible with other i.MX 6SoloLite variants?

Yes, all i.MX 6SoloLite MAPBGA packages-including MCIMX6L2DVN10AB, MCIMX6L3DVN10AB, and MCIMX6L7DVN10AB-share identical 289-ball 13×13 mm layout and ball mapping. Signal compatibility is maintained across variants; functional differences (e.g., GPU presence) are enabled/disabled via fuse settings, not pin assignment.

What security features are implemented in MCIMX6L2DVN10AB?

MCIMX6L2DVN10AB includes ARM TrustZone, HABv4 secure boot with SHA-256/2048-bit RSA verification, SNVS with secure RTC, CSU-enforced security policy, and DCP for AES/SHA acceleration-all documented in the i.MX 6SoloLite Security Reference Manual (IMX6SLSRM). These features remain active regardless of GPU/EPDC disablement.

MCIMX6L2DVN10AB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
432-TFBGA
Series:
i.MX6SL
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
USB 2.0 + PHY (3)
Voltage - I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
0°C ~ 95°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Supplier Device Package:
432-MAPBGA (13x13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

MCIMX6L2DVN10AB FAQ

1.How can I place an order for MCIMX6L2DVN10AB through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6L2DVN10AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6L2DVN10AB reliable?

The price and inventory of MCIMX6L2DVN10AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L2DVN10AB is usually 5 days.

3.What payment methods are accepted for MCIMX6L2DVN10AB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L2DVN10AB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6L2DVN10AB?

MCIMX6L2DVN10AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6L2DVN10AB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6L2DVN10AB?

For technical support, including MCIMX6L2DVN10AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L2DVN10AB requirements.

6.How does Aetrix verify that MCIMX6L2DVN10AB is sourced from the original manufacturer or authorized distributors?

All MCIMX6L2DVN10AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L2DVN10AB meets industry standards.

7.What is the process for return or replacement of MCIMX6L2DVN10AB?

All MCIMX6L2DVN10AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L2DVN10AB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6L2DVN10AB part is unused and in its original packaging.

Return procedure for MCIMX6L2DVN10AB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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