NXP Semiconductors MCIMX6L2EVN10AB

Overview

MCIMX6L2EVN10AB from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, designed for industrial-grade embedded systems requiring extended temperature operation (−40°C to +105°C). It integrates 256 KB L2 cache, DDR3-800 and LPDDR2-800 memory controllers, five UARTs, four eCSPI, three I²C, 10/100 Mbps Ethernet, and dual USB 2.0 OTG with integrated PHY - all in a 13 × 13 mm, 0.5 mm pitch MAPBGA package. It targets cost-sensitive, low-power consumer and industrial HMI applications without GPU or EPD controller.

For engineers reviewing the MCIMX6L2EVN10AB datasheet, MCIMX6L2EVN10AB pinout, MCIMX6L2EVN10AB application, or MCIMX6L2EVN10AB equivalent, key selection criteria include its −40°C to +105°C industrial temperature grade, absence of GPU/EPDC hardware, 1 GHz deterministic performance under DVFS, DDR3/LPDDR2 interface timing compliance, and BGA-289 pin mapping for thermal and signal integrity planning.

Technical Context

The MCIMX6L2EVN10AB implements a single ARM Cortex-A9 MPCore CPU with TrustZone security, 32 KB L1 instruction and data caches per core, and a unified 256 KB L2 cache. Its memory subsystem supports 16-/32-bit DDR3-800 and LPDDR2-800 interfaces with up to 2 GB addressable space, while its clock architecture includes integrated PLLs, 32.768 kHz oscillator support, and dynamic voltage/frequency scaling (DVFS) for active power management.

Peripheral integration includes five UARTs (one with 8-wire RS485 support), four eCSPI controllers, three I²C buses (400 kbps), FEC Ethernet MAC, dual USB 2.0 OTG with HS PHY, and SDIO/eMMC host controllers supporting UHS-I SDR104 and HS200 modes. No GPU2Dv2, GPUVG, or EPDC modules are enabled - confirmed by ordering code "2" (no GPU, no EPDC) and temperature grade "E".

Key Specifications

Pinout & Package

MCIMX6L2EVN10AB uses a 13 × 13 mm, 0.5 mm pitch MAPBGA package with 289 balls (17 × 17 array). Pin assignments follow i.MX 6SoloLite standard ball map; specific signal-to-ball mapping is defined in Section 6.2 of IMX6SLCEC Rev. 6. Ball pitch and pad layout comply with IPC-7351B Class B standards for automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6L3EVN10AB, MCIMX6L2EVN10AB removes GPU/EPDC to reduce cost and power, making it optimal for non-graphics HMI; versus i.MX 6ULL, it delivers 90% higher Dhrystone MIPS at same thermal envelope but with narrower peripheral availability and older BSP maintenance window.

Availability

MCIMX6L2EVN10AB is available at Aetrix Electronics and suitable for industrial HMI terminals, rugged handheld scanners, medical device UIs, smart energy meters, and cold-chain logistics equipment requiring stable component supply across extended temperature ranges.

Supply support for MCIMX6L2EVN10AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 6SoloLite product line delivers cost-optimized, low-power ARM-based applications processors targeting entry-level consumer and industrial embedded devices where graphics acceleration is unnecessary but deterministic 1 GHz performance and industrial temperature resilience are critical.

FAQ

What is the maximum DDR3 memory speed supported by MCIMX6L2EVN10AB?

MCIMX6L2EVN10AB supports DDR3-800 (400 MHz clock, 800 MT/s data rate) with 16- or 32-bit bus width. Timing compliance is guaranteed across the full −40°C to +105°C junction temperature range when using JEDEC-standard DDR3-800 components and adhering to i.MX 6SoloLite MMDC register programming guidelines in the reference manual. The memory controller does not support DDR3L or DDR4.

Does MCIMX6L2EVN10AB include hardware graphics acceleration?

No, MCIMX6L2EVN10AB excludes GPU2Dv2, GPUVG, and EPDC modules - confirmed by its "2" suffix in the part number nomenclature (Table 1, page 3 of IMX6SLCEC Rev. 6). It relies on CPU-based rendering for UI elements. For hardware-accelerated 2D graphics, MCIMX6L3EVN10AB or MCIMX6L8DVN10AB must be selected instead.

What boot devices are supported by MCIMX6L2EVN10AB?

MCIMX6L2EVN10AB supports boot from eMMC (v4.41), NAND Flash, SPI NOR Flash, and SD/MMC cards via its BOOT_MODE pins and internal ROM bootloader. Boot device selection is configured at power-on reset using BOOT_MODE[1:0] strap pins. USB MSD and SATA boot are not supported - those require i.MX 6Quad or i.MX 8 series processors.

Is MCIMX6L2EVN10AB pin-compatible with other i.MX 6SoloLite variants?

Yes, all i.MX 6SoloLite MAPBGA-289 packages including MCIMX6L2EVN10AB, MCIMX6L3EVN10AB, and MCIMX6L8DVN10AB share identical mechanical footprint, ball pitch, and signal-to-ball mapping. However, unused or differently muxed signals (e.g., EPDC vs GPU pins) require PCB design verification per variant's specific signal list in Section 6.2 of IMX6SLCEC.

What security features are implemented in MCIMX6L2EVN10AB?

MCIMX6L2EVN10AB implements ARM TrustZone, A-HABv4 secure boot with SHA-256/2048-bit RSA, SNVS with tamper detection, CSU policy enforcement, and DCP cryptographic co-processor. These features are fully functional regardless of GPU/EPDC presence. Secure JTAG access is controlled via eFUSE-configurable SJC security modes, and OCOTP fuses store immutable keys and boot policies.