NXP Semiconductors MCIMX6L2EVN10ABR
- Part No.:
- MCIMX6L2EVN10ABR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 432-TFBGA
- Datasheet:
-
MCIMX6L2EVN10ABR.pdf
- Description:
- IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6L2EVN10ABR from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, designed for industrial-grade embedded systems requiring extended temperature operation (−40°C to +105°C), DDR3-800 memory support, and integrated power management. It features 256 KB L2 cache, 128 KB on-chip RAM (OCRAM), and supports eMMC 4.41, USB 2.0 OTG/Host, 10/100 Mbps Ethernet, and five UARTs - deployed in barcode scanners and ruggedized handheld terminals.
For engineers reviewing the MCIMX6L2EVN10ABR datasheet, MCIMX6L2EVN10ABR pinout, MCIMX6L2EVN10ABR application, or MCIMX6L2EVN10ABR equivalent, key selection criteria include its −40°C to +105°C industrial temperature grade, absence of GPU and EPDC hardware blocks, 13×13 mm 0.5 mm pitch MAPBGA package, and full DVFS support for low-power operation in battery-constrained edge devices.
Technical Context
The MCIMX6L2EVN10ABR implements a single ARM Cortex-A9 core with TrustZone security, 32 KB L1 instruction and data caches per core, and a 256 KB unified L2 cache. Its memory subsystem includes a 32-bit DDR3-800 controller supporting up to 2 GB, plus 128 KB OCRAM for fast boot and real-time code execution.
It integrates a comprehensive peripheral set: four eCSPI interfaces, three I²C buses (400 kbps), five UARTs (one with 8-wire RS485 support), four PWMs, SSI audio interfaces, FEC Ethernet MAC, and SDMA controller with 32-channel time-division multiplexing - all managed via a centralized Clock Control Module (CCM) and General Power Controller (GPC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single ARM Cortex-A9 MPCore (r2p10) with TrustZone, 1 GHz max frequency - enables Linux-capable real-time processing without multicore complexity. |
| L2 Cache | 256 KB unified instruction/data cache - reduces external memory bandwidth demand and improves deterministic latency for industrial control tasks. |
| Memory Interface | 32-bit DDR3-800 / LPDDR2-800 - supports high-throughput data streaming for imaging or communication workloads in compact form factors. |
| Temperature Grade | −40°C to +105°C junction temperature - validated for deployment in uncontrolled industrial enclosures and outdoor kiosks. |
| Package | 13 × 13 mm, 0.5 mm pitch MAPBGA (RoHS, MSL3) - compatible with standard SMT reflow profiles and enables dense PCB layouts. |
| Power Management | Integrated PMU with DVFS, software state retention, and power gating - eliminates need for external PMIC in cost-sensitive designs. |
| Security Features | HABv4 secure boot, SNVS with tamper detection, CSU policy enforcement, and OCOTP fusing - meets baseline requirements for firmware integrity in certified devices. |
Pinout & Package
MCIMX6L2EVN10ABR is housed in a 289-ball MAPBGA package (13 × 13 mm, 0.5 mm pitch), with ball assignments defined in Section 6.2 of IMX6SLCEC Rev. 6. Pin functions follow standardized i.MX 6SoloLite signal naming convention (EB792 mapping), including dedicated VDD_SOC, VDD_ARM, VDD_PU, and VDD_DIG supply rails, along with configurable I/O banks supporting 1.8 V or 3.3 V logic levels.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_SOC | Main SoC domain supply | 1.2–1.3 V regulated input powering CCM, GPC, MMDC, and most digital logic - requires low-noise decoupling near package corner. |
| VDD_ARM | CPU core supply | Adjustable 0.9–1.25 V rail controlled by internal DCDC - dynamically scaled during DVFS transitions to match 1 GHz operation. |
| BOOT_MODE[1:0] | Boot configuration inputs | Pulled high/low at reset to select boot source (eMMC, SPI NOR, NAND, or USB recovery) - must be stable before POR release. |
| USB_OTG1_ID | OTG role detection | Grounded to enable host mode; floating for peripheral mode - determines USB PHY initialization sequence and descriptor enumeration. |
| ENET_REF_CLK | Ethernet reference clock input | 25 MHz differential clock required for FEC MAC timing compliance - sourced from external oscillator or PHY output. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-A9 + NEON MPE | Enables efficient audio decode, image filtering, and cryptographic operations without CPU-intensive software loops. |
| SDMA controller | Offloads CPU from memory-mapped peripheral transfers (e.g., camera sensor DMA, LCDIF frame buffering) using precompiled microcode scripts. |
| OCRAM (128 KB) | Provides zero-wait-state SRAM for boot code, interrupt handlers, and real-time buffers - critical for deterministic response in industrial PLCs. |
| Five UARTs with RS485 support | Enables simultaneous connection to legacy serial fieldbus (Modbus RTU), debug console, and auxiliary peripherals without external transceivers. |
| Secure Boot (HABv4) | Verifies signed firmware images using SHA-256 and 2048-bit RSA keys stored in eFUSE - prevents unauthorized firmware updates in deployed units. |
Applications
| Industrial Barcode Scanners | Rugged Handheld Terminals |
|---|---|
Use Scenario: High-speed linear and 2D barcode capture in warehouse logistics under variable lighting and vibration. IC Role / Device Role / Timing Role: Central applications processor executing real-time image acquisition, decoding algorithms, and wireless transmission stack. Use Value: Integrated USB 2.0 OTG and eMMC 4.41 support enable direct connection to imager modules and local firmware storage without bridge ICs. |
Use Scenario: Field service devices used for asset inspection, with GPS, cellular modem, and touchscreen UI in extreme ambient temperatures. IC Role / Device Role / Timing Role: Main system-on-chip managing display refresh, sensor fusion, and secure OTA updates over LTE. Use Value: −40°C to +105°C rating and on-die temperature monitoring (TEMPMON) ensure reliable operation without thermal throttling in sealed enclosures. |
| Fixed-Position Kiosks | Medical Data Loggers |
Use Scenario: Public-facing self-service kiosks running Linux-based UI with touch input, thermal receipt printing, and network connectivity. IC Role / Device Role / Timing Role: Applications processor driving LCDIF interface, managing USB printer interface, and handling encrypted HTTPS transactions. Use Value: Integrated FEC Ethernet MAC and dual USB 2.0 PHY eliminate need for external PHYs, reducing BOM count and EMI sources. |
Use Scenario: Portable diagnostic tools acquiring analog sensor data (ECG, SpO₂), storing locally, and transmitting via Bluetooth or Wi-Fi. IC Role / Device Role / Timing Role: Real-time data aggregator with secure boot, encrypted storage, and deterministic interrupt latency for sensor sampling. Use Value: OCRAM and SDMA enable glitch-free sensor data buffering and timestamped transfer to eMMC - meeting Class II medical device timing requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6L3EVN10AB | Includes GPU2Dv2 and OpenVG graphics accelerators; otherwise identical CPU, memory, and peripheral set. | Required when UI rendering demands hardware-accelerated 2D graphics (e.g., animated menus, vector icons). | Select MCIMX6L3EVN10AB only if GPU-dependent software stack is deployed; MCIMX6L2EVN10ABR reduces cost and power in headless or text/UI-light deployments. |
| i.MX 6ULL MCIMX6Y2DVM05AB | ARM Cortex-A7 core, 528 MHz max, lower power envelope, smaller 10×10 mm package, no EPDC or GPU. | Better suited for ultra-low-power, cost-sensitive IoT endpoints where Linux RT performance margin is acceptable. | Choose MCIMX6L2EVN10ABR over i.MX 6ULL when 1 GHz deterministic throughput, DDR3-800 bandwidth, or industrial temp grade is mandatory. |
Compared with MCIMX6L3EVN10AB, MCIMX6L2EVN10ABR removes GPU logic to reduce dynamic power and die area while retaining identical CPU performance and industrial temperature capability; versus i.MX 6ULL, it delivers 90% higher CPU throughput and broader memory/peripheral support at the cost of higher static power and larger footprint.
Availability
MCIMX6L2EVN10ABR is available at Aetrix Electronics and suitable for industrial barcode scanners, rugged handheld terminals, fixed-position kiosks, and medical data loggers requiring stable component supply across multi-year production cycles.
Supply support for MCIMX6L2EVN10ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6SoloLite product line targets cost-optimized, power-efficient consumer and industrial applications requiring Linux-capable processing without GPU or EPD overhead - emphasizing reliability, long-term availability, and simplified power architecture.
FAQ
What is the maximum operating frequency of the MCIMX6L2EVN10ABR?
The MCIMX6L2EVN10ABR operates at a maximum frequency of 1 GHz under industrial temperature conditions (−40°C to +105°C). This speed is sustained using Dynamic Voltage and Frequency Scaling (DVFS) with internal voltage regulation, and assumes proper thermal design and 24 MHz input clock for USB functionality as specified in the IMX6SLCEC datasheet Rev. 6.
Does the MCIMX6L2EVN10ABR include GPU or EPD controller hardware?
No, the MCIMX6L2EVN10ABR explicitly excludes both GPU2Dv2 and EPDC hardware blocks, as confirmed by Table 1 in the IMX6SLCEC datasheet. This distinguishes it from variants like MCIMX6L3EVN10AB (GPU-only) and MCIMX6L8DVN10AB (GPU + EPDC), making MCIMX6L2EVN10ABR optimal for non-graphical, non-ePaper applications.
Which memory types does the MCIMX6L2EVN10ABR support?
The MCIMX6L2EVN10ABR supports DDR3-800 and LPDDR2-800 (16/32-bit), NOR Flash (16/32-bit), PSRAM, Cellular RAM, and managed NAND including eMMC up to revision 4.41. Its MMDC controller handles up to 2 GB address space, and on-chip 128 KB OCRAM provides low-latency scratchpad memory for boot and real-time tasks.
What security features are implemented in the MCIMX6L2EVN10ABR?
The MCIMX6L2EVN10ABR includes HABv4 secure boot with SHA-256 hashing and 2048-bit RSA signature verification, Secure Non-Volatile Storage (SNVS) with tamper detection, Central Security Unit (CSU) policy enforcement, and One-Time Programmable (OCOTP) fusing for key storage and boot configuration. These features are active regardless of GPU/EPDC presence.
Is the MCIMX6L2EVN10ABR pin-compatible with other i.MX 6SoloLite variants?
Yes, all i.MX 6SoloLite MAPBGA variants - including MCIMX6L2EVN10ABR, MCIMX6L3EVN10AB, and MCIMX6L8DVN10AB - share identical 289-ball 13×13 mm 0.5 mm pitch package and pinout. Functional differences arise solely from fuse-enabled feature sets, not physical layout, enabling hardware reuse across performance grades.
MCIMX6L2EVN10ABR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 432-TFBGA
- Series:
- i.MX6SL
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (3)
- Voltage - I/O:
- 1.2V, 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 432-MAPBGA (13x13)
- Additional Interfaces:
- AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
MCIMX6L2EVN10ABR FAQ
1.How can I place an order for MCIMX6L2EVN10ABR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6L2EVN10ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6L2EVN10ABR reliable?
The price and inventory of MCIMX6L2EVN10ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L2EVN10ABR is usually 5 days.
3.What payment methods are accepted for MCIMX6L2EVN10ABR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L2EVN10ABR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6L2EVN10ABR?
MCIMX6L2EVN10ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6L2EVN10ABR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6L2EVN10ABR?
For technical support, including MCIMX6L2EVN10ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L2EVN10ABR requirements.
6.How does Aetrix verify that MCIMX6L2EVN10ABR is sourced from the original manufacturer or authorized distributors?
All MCIMX6L2EVN10ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L2EVN10ABR meets industry standards.
7.What is the process for return or replacement of MCIMX6L2EVN10ABR?
All MCIMX6L2EVN10ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L2EVN10ABR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6L2EVN10ABR part is unused and in its original packaging.
Return procedure for MCIMX6L2EVN10ABR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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