Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MCIMX6L2EVN10ACR

Part No.:
MCIMX6L2EVN10ACR
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
432-TFBGA
Datasheet:
AetrixMCIMX6L2EVN10ACR.pdf
Description:
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,688

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MCIMX6L2EVN10ACR from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, with no integrated GPU or EPD controller, rated for -40°C to +105°C industrial temperature range, in a 13 × 13 mm, 0.5 mm pitch MAPBGA package, designed for cost-sensitive embedded HMI and industrial control systems requiring DDR3-800 memory support and dual USB 2.0 OTG interfaces.

For engineers reviewing the MCIMX6L2EVN10ACR datasheet, MCIMX6L2EVN10ACR pinout, MCIMX6L2EVN10ACR application, or MCIMX6L2EVN10ACR equivalent, key selection criteria include industrial-grade thermal rating, absence of GPU/EPDC hardware blocks, 1 GHz core frequency under DVFS, DDR3/LPDDR2 memory interface compatibility, and peripheral mix including FEC Ethernet, five UARTs, and four eCSPI channels.

Technical Context

The MCIMX6L2EVN10ACR implements a single ARM Cortex-A9 MPCore CPU with TrustZone security, 32 KB L1 instruction and data caches per core, and a shared 256 KB unified L2 cache. It integrates a full-system power management unit (PMU) with on-die LDOs, DVFS support, and software state retention across multiple low-power modes.

Its memory subsystem supports 16-/32-bit DDR3-800 and LPDDR2-800 interfaces up to 2 GB address space, while its I/O includes five UARTs (one with 8-wire RS485 support), three I²C buses (400 kbps), four eCSPI controllers, and a 10/100 Mbps FEC Ethernet controller - all routed through a configurable IOMUXC block with dual-voltage (1.8 V / 3.3 V) GPIO pads.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture ARM Cortex-A9 single-core with TrustZone, r2p10 revision
Max Operating Frequency 1 GHz - enables Linux-based real-time HMI execution with headroom for burst workloads
Temperature Grade -40°C to +105°C junction - qualified for uncooled industrial control cabinets and outdoor edge nodes
Memory Interface 16-/32-bit DDR3-800 or LPDDR2-800 - supports up to 2 GB external RAM with 800 MT/s throughput
USB Interfaces Two HS USB 2.0 OTG ports with integrated PHY - enables simultaneous host/peripheral operation without external transceivers
Ethernet 10/100 Mbps FEC controller - requires external PHY but provides IEEE 802.3-compliant MAC layer with RMII/MII options
Security Features HABv4 secure boot, CSU policy enforcement, SNVS with tamper detection - enables root-of-trust chain for firmware validation

Pinout & Package

MCIMX6L2EVN10ACR uses a 289-ball MAPBGA package (13 × 13 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3). Ball map follows i.MX 6SoloLite standard signal naming convention per IMX6SLSRM and EB792 mapping documents.

Pin/Terminal Circuit Role Design Meaning
VDD_ARM ARM Core Power Supply 1.0–1.25 V input for Cortex-A9 core domain; requires tight regulation and local decoupling
VDD_SOC SoC Logic Power Supply 1.2–1.3 V supply for L2 cache, MMDC, CCM, and IOMUXC; shared rail with DDR I/O
DDR_DQ[0:15] DDR Data Bus (Lower Half) 16-bit bidirectional data lines for DDR3/LPDDR2; require matched-length routing and termination
USB_OTG1_DP/DM USB 2.0 OTG Differential Pair Integrated HS PHY signals - direct connection to USB connector; no external magnetics needed
FEC_RXD[0:3]/TXD[0:3] Ethernet MAC Data Interface 4-bit RMII receive/transmit bus - requires external 50 MHz reference clock and PHY IC
BOOT_MODE[0:1] Boot Configuration Inputs Pulled high/low at reset to select boot source (eMMC, NAND, SPI NOR, or SD); sampled once at POR

Key Features

Feature Design Value
Dynamic Voltage and Frequency Scaling (DVFS) Reduces core voltage and frequency during idle or low-MIPS tasks - cuts active power by up to 40% vs fixed-frequency operation
Smart DMA (SDMA) Engine Offloads CPU from memory-mapped peripheral transfers - supports 32-channel time-division multiplexing and CRC generation
Dual-Voltage GPIO Pads Configurable 1.8 V / 3.3 V I/O - eliminates level shifters when interfacing with mixed-voltage sensors and logic
Secure Boot (HABv4) Enforces cryptographic signature verification of boot image using 2048-bit RSA keys - prevents unauthorized firmware execution
Industrial Temperature Range Validated operation from -40°C to +105°C - supports deployment in fanless enclosures and wide-ambient environments

Applications

Industrial HMI Terminal Barcode Scanner Controller

Use Scenario: Fanless panel-mounted display with touch interface in factory automation line.

IC Role / Device Role / Timing Role: Main applications processor executing Linux Qt-based UI, managing serial barcode reader, and driving 800×480 RGB LCD via LCDIF.

Use Value: 1 GHz Cortex-A9 delivers responsive GUI rendering; industrial temp grade ensures reliability in unconditioned plant floors; integrated PMU reduces external power components.

Use Scenario: Handheld battery-powered scanner with Bluetooth LE connectivity and OLED status display.

IC Role / Device Role / Timing Role: Central controller handling CMOS camera capture, image preprocessing via SDMA, and USB HID report generation to host PC.

Use Value: No GPU/EPDC simplifies BOM and lowers power draw; dual USB OTG supports both charging and host-mode data upload; DVFS extends battery life during standby.

Edge Gateway Node Ruggedized Point-of-Sale Terminal

Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU sensors and forwarding data via Ethernet to cloud platform.

IC Role / Device Role / Timing Role: Real-time Linux host running protocol converters, managing dual UARTs for RS485 sensor networks, and FEC Ethernet uplink.

Use Value: Five UARTs (one 8-wire RS485) eliminate external transceivers; -40°C to +105°C rating enables operation inside electrical cabinets; secure boot protects firmware integrity.

Use Scenario: Drop-resistant retail terminal with capacitive touchscreen, thermal printer interface, and contactless payment module.

IC Role / Device Role / Timing Role: Applications processor running Android-based POS OS, coordinating I²C-connected NFC chip, SPI-driven thermal printer, and audio feedback via SSI.

Use Value: Four eCSPI channels support concurrent printer/NFC/audio peripherals; integrated audio mux (AUDMUX) routes voice prompts without external codecs; industrial temp grade withstands retail environment extremes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX6L3EVN10AC Includes GPU2Dv2 and OpenVG graphics accelerators; otherwise identical core, memory, and I/O specs Required for GUI-intensive applications needing hardware-accelerated 2D rendering or vector graphics Select MCIMX6L3EVN10AC only if display pipeline offload is needed; MCIMX6L2EVN10ACR saves cost and power where software rendering suffices.
i.MX 6ULL MCIMX6Y2DVM05AC ARM Cortex-A7 core, 528 MHz max, lower power envelope, smaller 10 × 10 mm package Better suited for ultra-low-power, space-constrained IoT endpoints rather than full HMI or gateway roles Choose MCIMX6Y2DVM05AC for battery-operated devices with modest UI requirements; MCIMX6L2EVN10ACR retains higher performance headroom for multi-tasking.

Compared with MCIMX6L3EVN10AC, MCIMX6L2EVN10ACR removes GPU/EPDC logic to reduce die size, dynamic power, and BOM cost - ideal for non-graphic-centric industrial control. Against i.MX 6ULL, it trades lower power for higher deterministic throughput and broader peripheral integration, especially in UART, eCSPI, and Ethernet domains.

Availability

MCIMX6L2EVN10ACR is available at Aetrix Electronics and suitable for industrial HMI terminals, ruggedized barcode scanners, edge gateway nodes, and point-of-sale terminals requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6L2EVN10ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based applications processors and edge AI acceleration.

The i.MX 6SoloLite product line targets cost-optimized, low-power consumer and industrial applications - delivering balanced performance, graphics capability (select variants), and robust security features in compact BGA packages.

FAQ

What is the maximum DDR3 memory speed supported by MCIMX6L2EVN10ACR?

MCIMX6L2EVN10ACR supports DDR3-800 memory operation, meaning it interfaces with DDR3 SDRAM modules rated for 800 MT/s data transfer rates. This corresponds to a 400 MHz clock frequency with double-data-rate signaling. The MMDC controller handles timing calibration, read/write leveling, and refresh management - enabling reliable access to up to 2 GB of external DDR3 memory space.

Does MCIMX6L2EVN10ACR include an integrated GPU or EPD controller?

No, MCIMX6L2EVN10ACR explicitly omits both the GPU2Dv2 graphics accelerator and the EPDC (Electrophoretic Display Controller). This is confirmed by its part number suffix "2" (per Figure 1 nomenclature) and Table 1 ordering information. Its feature set is optimized for general-purpose HMI and control applications where software-rendered UIs or simple segment displays suffice - reducing silicon area, power consumption, and licensing overhead.

What boot sources does MCIMX6L2EVN10ACR support?

MCIMX6L2EVN10ACR supports boot from eMMC, NAND Flash, SPI NOR Flash, and SD/MMC cards - selected via BOOT_MODE[1:0] pin states at power-on reset. The internal 96 KB ROM executes HABv4-verified boot code, which can load second-stage bootloaders (e.g., U-Boot) from any of these media. Secure boot enforces cryptographic signature validation before transferring control to user firmware.

How many UART interfaces does MCIMX6L2EVN10ACR provide, and what are their capabilities?

MCIMX6L2EVN10ACR integrates five UART modules. Each supports up to 5.0 Mbps operation and standard RS232 signaling. UART1 uniquely supports 8-wire RS485 multidrop mode with automatic direction control, while the other four operate in standard 4-wire configuration. All UARTs include FIFOs and programmable baud rate generators - making them suitable for industrial serial communication, debug console, and peripheral bridging.

Is MCIMX6L2EVN10ACR pin-compatible with other i.MX 6SoloLite variants?

Yes, MCIMX6L2EVN10ACR shares the same 289-ball 13 × 13 mm MAPBGA package and identical ball map with all other i.MX 6SoloLite parts listed in Table 1 (e.g., MCIMX6L3EVN10AC, MCIMX6L7DVN10AB). Signal assignments, power/ground ball locations, and mechanical footprint are fully consistent - enabling PCB reuse across variants when selecting different feature sets or temperature grades.

MCIMX6L2EVN10ACR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
432-TFBGA
Series:
i.MX6SL
Packaging:
Tape & Reel (TR)
Product Status:
Active
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
USB 2.0 + PHY (3)
Voltage - I/O:
1.2V, 1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Supplier Device Package:
432-MAPBGA (13x13)
Additional Interfaces:
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART

MCIMX6L2EVN10ACR FAQ

1.How can I place an order for MCIMX6L2EVN10ACR through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6L2EVN10ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6L2EVN10ACR reliable?

The price and inventory of MCIMX6L2EVN10ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L2EVN10ACR is usually 5 days.

3.What payment methods are accepted for MCIMX6L2EVN10ACR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L2EVN10ACR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6L2EVN10ACR?

MCIMX6L2EVN10ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6L2EVN10ACR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6L2EVN10ACR?

For technical support, including MCIMX6L2EVN10ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L2EVN10ACR requirements.

6.How does Aetrix verify that MCIMX6L2EVN10ACR is sourced from the original manufacturer or authorized distributors?

All MCIMX6L2EVN10ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L2EVN10ACR meets industry standards.

7.What is the process for return or replacement of MCIMX6L2EVN10ACR?

All MCIMX6L2EVN10ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L2EVN10ACR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6L2EVN10ACR part is unused and in its original packaging.

Return procedure for MCIMX6L2EVN10ACR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MCIMX6L2EVN10ACR Tags

  • MCIMX6L2EVN10ACR
  • MCIMX6L2EVN10ACR PDF
  • MCIMX6L2EVN10ACR Datasheet
  • MCIMX6L2EVN10ACR Specifications
  • MCIMX6L2EVN10ACR Images
  • NXP Semiconductors
  • NXP Semiconductors MCIMX6L2EVN10ACR
  • Buy MCIMX6L2EVN10ACR
  • MCIMX6L2EVN10ACR Price
  • MCIMX6L2EVN10ACR Distributor
  • MCIMX6L2EVN10ACR Supplier
  • MCIMX6L2EVN10ACR Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER