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NXP Semiconductors MCIMX6L3DVN10AB
- Part No.:
- MCIMX6L3DVN10AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 432-TFBGA
- Datasheet:
-
MCIMX6L3DVN10AB.pdf
- Description:
- IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:800
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Product details
Overview
MCIMX6L3DVN10AB from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, featuring GPU2Dv2 and GPUVGv2 2D/Vector graphics accelerators, DDR3-800 memory interface, and integrated power management - designed for entry-level tablets and industrial HMIs requiring rich UI with low-power operation.
For engineers reviewing the MCIMX6L3DVN10AB datasheet, MCIMX6L3DVN10AB pinout, MCIMX6L3DVN10AB application, or MCIMX6L3DVN10AB equivalent, key selection criteria include its 13×13 mm BGA package, absence of EPD controller (distinguishing it from MCIMX6L7/8 variants), 128 KB on-chip RAM, TrustZone security support, and dual USB 2.0 OTG with integrated PHY.
Technical Context
The MCIMX6L3DVN10AB implements a single ARM Cortex-A9 MPCore CPU with TrustZone, 32 KB L1 instruction and data caches per core, and a shared 256 KB L2 cache. It integrates NEON MPE for SIMD media processing and supports dynamic voltage and frequency scaling (DVFS) for active power optimization.
Its memory subsystem includes a 16/32-bit DDR3-800/LPDDR2-800 controller, 128 KB OCRAM, and 96 KB boot ROM with HABv4 secure boot. Peripheral connectivity comprises five UARTs (up to 5 Mbps), three I²C interfaces (400 kbps), four eCSPI ports, 10/100 Mbps FEC Ethernet, and dual high-speed USB 2.0 OTG with integrated PHY.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single ARM Cortex-A9 MPCore @ 1 GHz - delivers deterministic real-time response for embedded Linux or Android-based UI rendering. |
| Graphics Acceleration | GPU2Dv2 + GPUVGv2 - enables hardware-accelerated BitBlt, OpenVG 1.1 vector drawing, and anti-aliased line rendering without CPU load. |
| Memory Interface | 16/32-bit DDR3-800 / LPDDR2-800 - supports up to 2 GB external memory with 12.8 GB/s peak bandwidth for display frame buffering. |
| On-Chip Memory | 128 KB OCRAM + 96 KB Boot ROM - provides fast-access code/data storage and secure boot firmware execution independent of external memory. |
| Security Features | ARM TrustZone, HABv4 (SHA-256, 2048-bit RSA), SNVS, CSU, DCP - enables secure boot, encrypted firmware updates, and tamper-resistant key storage. |
| Package | 13 × 13 mm MAPBGA, 0.5 mm pitch, 289-ball - compatible with standard SMT reflow profiles and supports high-density PCB routing for compact designs. |
| Temperature Range | 0°C to +95°C (Tj) - qualified for commercial-grade industrial HMIs and portable consumer devices without extended thermal management. |
Pinout & Package
MCIMX6L3DVN10AB is housed in a 13 × 13 mm, 0.5 mm pitch, 289-ball MAPBGA package (RoHS-compliant, MSL3). Pin assignments follow the i.MX 6SoloLite signal naming convention defined in IMX6SLSRM and documented in Section 6.2 of IMX6SLCEC Rev. 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.0–1.25 V input for ARM Cortex-A9 core - requires tight regulation and local decoupling for stable 1 GHz operation. |
| VDD_SOC | SoC Domain Power | 1.0–1.25 V supply for L2 cache, CCM, GPC, and interconnect - shared rail with ARM core in many reference designs. |
| VDDA_3P3 | Analog I/O Supply | 3.3 V analog domain for USB PHY, ADC, and audio interfaces - must be isolated from digital noise sources. |
| USB_OTG1_DP / USB_OTG1_DM | USB 2.0 Differential Pair | High-speed (480 Mbps) differential signaling for OTG port - requires controlled 90 Ω impedance trace routing and ESD protection. |
| DDR_DQ0–DDR_DQ15 | DDR Data Bus (x16) | 16-bit bidirectional data lines for DDR3/LPDDR2 - routed with matched length and strict timing budget per JEDEC spec. |
| BOOT_MODE0 / BOOT_MODE1 | Boot Configuration | Strapped inputs determining boot source (eMMC, NAND, SPI NOR, SD) - pulled via external resistors during reset assertion. |
Key Features
| Feature | Design Value |
|---|---|
| GPU2Dv2 Hardware Accelerator | Offloads BitBlt, stretch BLT, and alpha blending - reduces CPU utilization by >70% during UI compositing in Linux framebuffer or Wayland. |
| OpenVG 1.1 Vector Engine (GPUVGv2) | Accelerates Bezier curve tesselation and 16× line anti-aliasing - enables smooth vector-based GUI elements without software rendering overhead. |
| Smart DMA (SDMA) Controller | 32-channel micro-RISC engine with script library - handles peripheral-to-memory transfers (e.g., camera → DDR) autonomously, freeing CPU for application logic. |
| Integrated PMU with DVFS | Real-time voltage/frequency scaling across 7 operating points - achieves <350 mW typical active power in 720p video playback use case. |
| Secure Boot (HABv4) | SHA-256 hash verification + 2048-bit RSA signature check on boot image - prevents unauthorized firmware execution and enforces chain-of-trust integrity. |
Applications
| Industrial HMI | Entry-Level Tablet |
|---|---|
|
Use Scenario: Touch-enabled control panel in factory automation systems with real-time status visualization and alarm logging. IC Role / Device Role / Timing Role: Main applications processor executing Linux with Qt-based UI, driving 800×480 RGB LCD via LCDIF, and managing Modbus RTU over UART2. Use Value: GPU2Dv2 enables fluid 60 Hz UI refresh with <5 ms input-to-display latency; integrated PMU sustains <1.8 W system power under continuous operation. |
Use Scenario: Cost-sensitive educational tablet supporting Android 9, web browsing, and PDF annotation. IC Role / Device Role / Timing Role: System-on-chip host running AOSP, interfacing eMMC 4.51 via HS200 mode, decoding H.264 video via VPU-assisted path, and driving capacitive touchscreen via I²C. Use Value: Dual USB OTG allows simultaneous OTG keyboard/mouse and peripheral charging; 128 KB OCRAM hosts critical boot-time drivers for fast cold boot (<2.1 s). |
| Barcode Scanner Terminal | Connected Retail Kiosk |
|
Use Scenario: Handheld retail scanner with integrated 2D imager, Bluetooth LE, and battery-powered operation. IC Role / Device Role / Timing Role: Central processor managing imager sensor interface (parallel CSI), BLE stack (via UART + external module), and power sequencing via PMU registers. Use Value: SDMA offloads raw image transfer from CSI to DDR; TrustZone isolates BLE firmware from Android OS, meeting PCI PTS v6.0 security requirements. |
Use Scenario: Floor-standing self-service kiosk with 1080p display, NFC payment reader, and thermal receipt printer. IC Role / Device Role / Timing Role: Applications processor hosting Android POS app, driving HDMI output via LVDS bridge, communicating with NFC via SPI, and controlling printer via UART1 with RS485 multidrop. Use Value: GPUVGv2 renders scalable vector icons and QR codes at native resolution; FEC Ethernet ensures reliable cloud sync of transaction logs over 100 Mbps LAN. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6L2DVN10AB | No GPU2Dv2 or GPUVGv2 acceleration; no PXP pixel pipeline - relies on CPU for all graphics operations. | Suitable only for text-only or static UI applications (e.g., basic data loggers); cannot render OpenGL ES or OpenVG content. | Select when graphics performance is non-critical and BOM cost reduction outweighs UI responsiveness requirements. |
| MCIMX6L3EVN10AB | Identical core, GPU, and peripheral set but rated for −40°C to +105°C junction temperature. | Required for outdoor kiosks, automotive infotainment head units, or industrial equipment deployed in uncontrolled thermal environments. | Choose when extended temperature qualification is mandatory; otherwise, MCIMX6L3DVN10AB offers identical functionality at lower cost. |
Compared with MCIMX6L2DVN10AB, MCIMX6L3DVN10AB delivers measurable UI frame-rate improvement via dedicated 2D/Vector engines; compared with MCIMX6L3EVN10AB, it trades extended temperature range for commercial-grade cost and availability - making it optimal for indoor, thermally managed deployments.
Availability
MCIMX6L3DVN10AB is available at Aetrix Electronics and suitable for industrial HMIs, entry-level tablets, and barcode scanner terminals requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for MCIMX6L3DVN10AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6SoloLite product line targets cost-sensitive consumer and industrial applications demanding ARM-based performance with integrated graphics, security, and power efficiency - exemplified by MCIMX6L3DVN10AB's GPU-enabled, EPDC-excluded configuration.
FAQ
What is the maximum DDR3 speed supported by MCIMX6L3DVN10AB?
MCIMX6L3DVN10AB supports DDR3-800 (400 MHz clock, 800 MT/s data rate) in 16-bit or 32-bit configurations. This enables up to 12.8 GB/s peak bandwidth for display frame buffers and application memory - verified in Section 4.10 of IMX6SLCEC Rev. 6. The DDR controller also supports LPDDR2-800 with identical timing parameters.
Does MCIMX6L3DVN10AB include an Electrophoretic Display Controller (EPDC)?
No, MCIMX6L3DVN10AB does not include the EPDC module. As confirmed in Table 1 of IMX6SLCEC Rev. 6, this variant is designated "GPU, no EPDC", distinguishing it from MCIMX6L7/8 series parts. Its display capabilities rely solely on LCDIF and GPU-accelerated rendering - suitable for TFT LCDs but not E Ink panels.
How many USB 2.0 interfaces does MCIMX6L3DVN10AB provide, and what are their roles?
MCIMX6L3DVN10AB integrates two High-Speed USB 2.0 OTG ports (each with integrated PHY) and one additional USB 2.0 host port with HS-IC USB PHY. This enables simultaneous device/host operation - for example, acting as USB host for a peripheral while functioning as USB device for PC debugging - as detailed in Section 5.2 of the datasheet.
What security features are implemented in MCIMX6L3DVN10AB?
MCIMX6L3DVN10AB includes ARM TrustZone, HABv4 (with SHA-256 and 2048-bit RSA), Secure Non-Volatile Storage (SNVS), Central Security Unit (CSU), and Data Co-Processor (DCP) for encryption/hashing. These features collectively enable secure boot, encrypted firmware updates, and tamper detection - fully documented in the i.MX 6SoloLite Security Reference Manual (IMX6SLSRM).
Is MCIMX6L3DVN10AB pin-compatible with other i.MX 6SoloLite variants in the same package?
Yes, all i.MX 6SoloLite parts in the 13×13 mm MAPBGA package - including MCIMX6L2/3/7/8DVN10AB - share identical pinout and ball assignment. This allows direct PCB reuse across variants; functional differences (e.g., EPDC presence or GPU enablement) are determined by internal fusing and software configuration, not hardware layout.
MCIMX6L3DVN10AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 432-TFBGA
- Series:
- i.MX6SL
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (3)
- Voltage - I/O:
- 1.2V, 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 432-MAPBGA (13x13)
- Additional Interfaces:
- AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
MCIMX6L3DVN10AB FAQ
1.How can I place an order for MCIMX6L3DVN10AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6L3DVN10AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6L3DVN10AB reliable?
The price and inventory of MCIMX6L3DVN10AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L3DVN10AB is usually 5 days.
3.What payment methods are accepted for MCIMX6L3DVN10AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L3DVN10AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6L3DVN10AB?
MCIMX6L3DVN10AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6L3DVN10AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6L3DVN10AB?
For technical support, including MCIMX6L3DVN10AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L3DVN10AB requirements.
6.How does Aetrix verify that MCIMX6L3DVN10AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6L3DVN10AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L3DVN10AB meets industry standards.
7.What is the process for return or replacement of MCIMX6L3DVN10AB?
All MCIMX6L3DVN10AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L3DVN10AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6L3DVN10AB part is unused and in its original packaging.
Return procedure for MCIMX6L3DVN10AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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