NXP Semiconductors MCIMX6L3DVN10AC
- Part No.:
- MCIMX6L3DVN10AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 432-TFBGA
- Datasheet:
-
MCIMX6L3DVN10AC.pdf
- Description:
- IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6L3DVN10AC from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, featuring GPU2Dv2 and GPUVGv2 graphics accelerators, 256 KB L2 cache, DDR3-800 memory interface, and integrated power management. It targets entry-level tablets and barcode scanners requiring low-power multimedia processing with 2D graphics acceleration and USB 2.0 OTG support.
For engineers reviewing the MCIMX6L3DVN10AC datasheet, MCIMX6L3DVN10AC pinout, MCIMX6L3DVN10AC application, or MCIMX6L3DVN10AC equivalent, key selection criteria include GPU presence (no EPDC), commercial temperature grade (0°C to +95°C), 13×13 mm 0.5 mm pitch MAPBGA package, and i.MX 6SoloLite family compatibility for embedded Linux-based portable devices.
Technical Context
The MCIMX6L3DVN10AC implements a single ARM Cortex-A9 MPCore CPU with TrustZone security, 32 KB L1 instruction and data caches per core, and a unified 256 KB L2 cache. Its memory subsystem supports 16/32-bit DDR3-800 and LPDDR2-800 interfaces with up to 2 GB addressable space.
It integrates dual high-speed USB 2.0 OTG controllers with on-die PHYs, five UARTs (one supporting 8-wire RS485), three I²C interfaces (400 kbps), four eCSPI ports, and a 10/100 Mbps Ethernet controller. Graphics acceleration includes GPU2Dv2 (BitBLT) and GPUVGv2 (OpenVG 1.1), but excludes EPDC-confirmed by ordering code "3" (GPU, no EPDC) in Table 1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A9 single-core with TrustZone, r2p10 revision |
| Max Frequency | 1 GHz - enables Android/Linux boot within 2 sec and sustained video decode at 720p30 |
| L2 Cache | 256 KB unified - reduces external memory bandwidth demand by ~40% in UI rendering workloads |
| Graphics | GPU2Dv2 + GPUVGv2 - hardware-accelerated 2D BitBLT and OpenVG 1.1 vector graphics, no EPDC |
| Memory Interface | 16/32-bit DDR3-800 - supports up to 2 GB density; requires 1.5 V VDD_DDR supply |
| USB | 2× HS USB 2.0 OTG + 1× HS USB host - all with integrated PHY; 480 Mbps per link |
| Package | 13×13 mm MAPBGA, 0.5 mm pitch, 361-ball - RoHS-compliant, MSL3 moisture sensitivity |
Pinout & Package
MCIMX6L3DVN10AC uses a 361-ball MAPBGA package (13×13 mm, 0.5 mm pitch), RoHS-compliant and moisture sensitivity level 3 (MSL3). Ball map and signal assignments are defined in Section 6.2 of IMX6SLCEC Rev. 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | CPU core supply | 1.0–1.25 V input; requires external PMIC regulation and decoupling per Section 4.2 |
| VDD_SOC | SoC logic supply | 1.2–1.3 V; powers CCM, GPC, OCRAM, and peripheral logic domains |
| VDD_DDR | DDR I/O supply | 1.5 V ±3%; must be sequenced after VDD_SOC and before VDD_ARM during power-up |
| USB_OTG1_DP/DM | Differential USB 2.0 data pair | Integrated HS PHY; requires 24 MHz crystal reference and series 27 Ω resistors |
| ENET_MDIO/MDC | Ethernet management interface | IEEE 802.3-compliant MDIO bus for PHY configuration; operates at ≤2.5 MHz |
| SD1_CMD/CLK/DATA0–3 | eMMC/SDIO host interface | Supports UHS-I SDR104 (104 MB/s); 1.8 V I/O signaling with internal pull-ups |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage/Frequency Scaling (DVFS) | Reduces active power by up to 35% during audio playback or idle UI states via real-time voltage/frequency adjustment |
| Smart DMA (SDMA) | Offloads CPU for camera sensor frame transfers and audio buffering using 32-channel time-division multiplexing |
| Secure Boot (A-HAB v4) | Enables SHA-256 signature verification and 2048-bit RSA key enforcement during ROM-based boot sequence |
| GPIO Dual-Rail Support | Configurable 1.8 V / 3.3 V I/O pads allow direct interfacing with legacy peripherals without level shifters |
| PXP Pixel Pipeline | Performs real-time color-space conversion and alpha blending at 1 pixel/clock for display compositing |
Applications
| Barcode Scanners | Entry-Level Tablets |
|---|---|
Use Scenario: Handheld industrial scanner capturing 1D/2D barcodes in retail or warehouse environments. IC Role / Device Role / Timing Role: Central applications processor executing real-time image capture, decoding, and Bluetooth LE transmission. Use Value: GPU2Dv2 accelerates QR code region detection; USB OTG enables direct HID keyboard emulation to host PCs without drivers. | Use Scenario: Cost-sensitive Android tablet for education or point-of-sale kiosks with 7–10 inch LCD displays. IC Role / Device Role / Timing Role: Main SoC managing touch UI, HDMI output, and Wi-Fi/BT coexistence via shared SDIO bus. Use Value: DDR3-800 interface sustains 720p video playback at <120 ms frame latency; PXP enables smooth multi-layer UI transitions. |
| Industrial HMI Terminals | Portable Medical Data Loggers |
Use Scenario: Panel-mounted human-machine interface with resistive touchscreen and serial fieldbus connectivity. IC Role / Device Role / Timing Role: Real-time control processor running Linux with deterministic UART/I²C response for PLC communication. Use Value: Five UARTs (including RS485-capable UART1) eliminate external transceivers; DVFS maintains <1.2 W typical power at 600 MHz under load. | Use Scenario: Battery-powered patient monitor collecting ECG, SpO₂, and temperature over 24+ hours. IC Role / Device Role / Timing Role: Low-power applications processor handling sensor fusion, local storage, and BLE telemetry upload. Use Value: Integrated PMU and software state retention reduce standby current to 18 µA; secure boot ensures firmware integrity in regulated environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6L2DVN10AC | No GPU or EPDC; identical CPU, memory, and peripheral set except graphics units disabled | Suitable only for non-graphical UI or text-only HMI where GPU acceleration is unnecessary | Select when BOM cost reduction outweighs need for 2D graphics acceleration |
| MCIMX6Y2DVM09AC | i.MX 6ULL variant; ARM Cortex-A7 @ 900 MHz, smaller 10×10 mm BGA, no GPUVGv2 or PXP | Targeted at ultra-low-cost IoT gateways; lacks OpenVG and pixel pipeline required for rich UI | Choose for headless Linux edge nodes where UI rendering is absent and footprint is critical |
Compared with MCIMX6L3DVN10AC, MCIMX6L2DVN10AC removes GPU functionality while retaining identical CPU performance and package, whereas MCIMX6Y2DVM09AC trades graphics capability and thermal headroom for lower cost and smaller footprint-making MCIMX6L3DVN10AC optimal for GPU-dependent portable UIs.
Availability
MCIMX6L3DVN10AC is available at Aetrix Electronics and suitable for barcode scanners, entry-level tablets, and industrial HMI terminals requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6L3DVN10AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The i.MX 6SoloLite product line delivers cost-optimized, low-power ARM-based applications processors targeting battery-operated portable devices with graphical user interfaces and peripheral-rich I/O requirements.
FAQ
What is the maximum DDR3 memory speed supported by MCIMX6L3DVN10AC?
The MCIMX6L3DVN10AC supports DDR3-800 operation, meaning it interfaces with DDR3 SDRAM modules rated for 800 MT/s data rates (400 MHz clock). This requires strict PCB layout adherence to JEDEC AC timing parameters and proper termination per Section 4.10 of the IMX6SLCEC datasheet. The MMDC controller handles 16- or 32-bit bus widths and supports up to 2 GB total addressable space.
Does MCIMX6L3DVN10AC include an Electrophoretic Display Controller (EPDC)?
No, MCIMX6L3DVN10AC does not include EPDC functionality. Per Table 1 in the IMX6SLCEC datasheet, the "3" in the part number suffix denotes "GPU, no EPDC". Only variants with suffix "7" (e.g., MCIMX6L7DVN10AC) or "8" (e.g., MCIMX6L8DVN10AC) enable the EPDC module for E Ink display driving.
What USB configurations are available on MCIMX6L3DVN10AC?
The MCIMX6L3DVN10AC integrates two high-speed USB 2.0 On-The-Go (OTG) controllers with on-die PHYs and one additional high-speed USB 2.0 host controller with integrated HS-IC USB PHY. All three support 480 Mbps operation and require a 24 MHz crystal reference. USB_OTG1 supports device/host role switching; USB_OTG2 is host-only in default configuration.
Is MCIMX6L3DVN10AC compatible with the i.MX 6SoloLite reference design schematics?
Yes, MCIMX6L3DVN10AC shares identical pinout, power sequencing, and signal definitions with other i.MX 6SoloLite variants in the 13×13 mm MAPBGA package (e.g., MCIMX6L8DVN10AC), as confirmed in Section 6.2 of IMX6SLCEC Rev. 6. Reference designs such as the i.MX6SoloLite EVK can be used directly, though GPU-specific register initialization must be retained and EPDC-related signals left unconnected.
What security features are enabled in MCIMX6L3DVN10AC?
MCIMX6L3DVN10AC includes ARM TrustZone, Advanced High Assurance Boot (A-HAB v4) with SHA-256 and 2048-bit RSA, Secure Non-Volatile Storage (SNVS), Central Security Unit (CSU), and System JTAG Controller (SJC) with eFUSE-configurable access modes. These features collectively support secure boot, encrypted firmware updates, tamper detection, and debug port protection-all active regardless of GPU/EPDC configuration.
MCIMX6L3DVN10AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 432-TFBGA
- Series:
- i.MX6SL
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (3)
- Voltage - I/O:
- 1.2V, 1.8V, 3.0V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 432-MAPBGA (13x13)
- Additional Interfaces:
- AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
MCIMX6L3DVN10AC FAQ
1.How can I place an order for MCIMX6L3DVN10AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6L3DVN10AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6L3DVN10AC reliable?
The price and inventory of MCIMX6L3DVN10AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L3DVN10AC is usually 5 days.
3.What payment methods are accepted for MCIMX6L3DVN10AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L3DVN10AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6L3DVN10AC?
MCIMX6L3DVN10AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6L3DVN10AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6L3DVN10AC?
For technical support, including MCIMX6L3DVN10AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L3DVN10AC requirements.
6.How does Aetrix verify that MCIMX6L3DVN10AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6L3DVN10AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L3DVN10AC meets industry standards.
7.What is the process for return or replacement of MCIMX6L3DVN10AC?
All MCIMX6L3DVN10AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L3DVN10AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6L3DVN10AC part is unused and in its original packaging.
Return procedure for MCIMX6L3DVN10AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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