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NXP Semiconductors MCIMX6L3EVN10AB
- Part No.:
- MCIMX6L3EVN10AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 432-TFBGA
- Datasheet:
-
MCIMX6L3EVN10AB.pdf
- Description:
- IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:647
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Product details
Overview
MCIMX6L3EVN10AB from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, featuring GPU2Dv2 and GPUVGv2 graphics accelerators, 256 KB L2 cache, DDR3-800 memory interface, and integrated power management. It supports eMMC 4.41, USB 2.0 OTG/Host with PHY, 10/100 Mbps Ethernet, and EPD controller disabled-targeted for industrial HMI and extended-temperature embedded computing.
For engineers reviewing the MCIMX6L3EVN10AB datasheet, MCIMX6L3EVN10AB pinout, MCIMX6L3EVN10AB application, or MCIMX6L3EVN10AB equivalent, key selection criteria include its -40°C to +105°C industrial temperature grade, absence of EPDC (enabling simplified display subsystem design), GPU-enabled 2D/OpenVG acceleration, 13×13 mm MAPBGA package with 0.5 mm pitch, and support for secure boot via A-HAB v4 with SHA-256 and 2048-bit RSA.
Technical Context
The MCIMX6L3EVN10AB implements a single ARM Cortex-A9 MPCore core with TrustZone security, 32 KB L1 instruction and data caches per core, and a shared 256 KB unified L2 cache. Its clock architecture includes multiple PLLs supporting independent domain scaling, with on-chip 32.768 kHz oscillator and external 24 MHz crystal requirement for USB compliance.
Power management integrates linear regulators (PMU), DVFS control, software state retention, and hardware power gating across CPU, MPE, and peripherals. Memory subsystem supports 16/32-bit DDR3-800 and LPDDR2-800 up to 2 GB, plus 128 KB on-chip OCRAM and 96 KB boot ROM with HABv4 secure boot enforcement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single ARM Cortex-A9 MPCore @ 1 GHz - delivers deterministic real-time response for industrial control tasks without multicore scheduling overhead. |
| L2 Cache | 256 KB unified I/D cache - reduces external memory bandwidth demand and improves deterministic latency in deterministic OS environments. |
| Graphics | GPU2Dv2 + GPUVGv2 - enables hardware-accelerated UI rendering (BitBLT, OpenVG 1.1) without CPU load, critical for smooth HMI operation. |
| Memory Interface | 32-bit DDR3-800 - supports up to 1.6 GB/s peak bandwidth for high-resolution display buffering and video decode pipelines. |
| Temperature Grade | -40°C to +105°C junction - qualified for fanless industrial enclosures, automotive under-hood auxiliary systems, and outdoor kiosks. |
| Security | A-HAB v4 with SHA-256 & 2048-bit RSA - enforces authenticated, encrypted boot chain; prevents unauthorized firmware execution at power-on reset. |
| Package | 13×13 mm MAPBGA, 0.5 mm pitch, 289 balls - compatible with standard SMT reflow profiles and IPC Class 3 assembly requirements. |
Pinout & Package
MCIMX6L3EVN10AB is housed in a 13×13 mm, 0.5 mm pitch, 289-ball MAPBGA package (RoHS-compliant, MSL3). Pin assignments follow the i.MX 6SoloLite signal naming convention defined in IMX6SLSRM and documented in Section 6.2 of IMX6SLCEC Rev. 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.0–1.25 V input; requires dedicated low-noise LDO regulation and local decoupling for stable 1 GHz operation. |
| VDD_SOC | System-on-Chip Power Supply | 1.0–1.25 V input; powers L2 cache, CCM, GPC, and most digital logic; shares regulator domain with VDD_ARM in many designs. |
| DDR_DQ[0:31] | DDR3 Data Bus | 32-bit bidirectional data lines; require controlled impedance (40 Ω ±10%), length-matched routing, and on-die termination calibration. |
| USB_OTG1_DP/DM | USB 2.0 OTG Differential Pair | Integrated HS PHY; requires 90 Ω differential impedance trace and 1.5 kΩ pull-up on DP for host detection. |
| ENET_MDIO/MDC | IEEE 802.3 Management Interface | Open-drain MDIO with 1.5 kΩ pull-up; MDC driven at 2.5 MHz max; used for PHY register configuration and status polling. |
Key Features
| Feature | Design Value |
|---|---|
| GPU2Dv2 Acceleration | Hardware BitBLT, stretch BLT, and alpha blending offload CPU for fast GUI redraws in resource-constrained HMI systems. |
| Secure Boot (A-HAB v4) | Enforces cryptographic signature verification of boot image using eFUSE-programmed keys-prevents field firmware tampering. |
| DVFS Support | Dynamic voltage/frequency scaling enables runtime power reduction during idle or low-MIPS tasks (e.g., audio decode only). |
| OCRAM (128 KB) | On-chip SRAM accessible at full CPU speed-used for time-critical ISR code, real-time buffers, and secure key storage. |
| EPDC Disabled | Removes E Ink display controller logic-reduces gate count, lowers static power, and simplifies layout for LCD-only or no-display applications. |
Applications
| Industrial HMI Panels | Medical Diagnostic Terminals |
|---|---|
Use Scenario: Fanless wall-mounted operator interface in factory automation cabinets exposed to ambient temperatures from -25°C to +70°C. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based Qt UI, managing touch input, driving 1024×600 RGB LCD, and communicating via Modbus TCP over Ethernet. Use Value: The -40°C to +105°C rating ensures reliable startup and sustained operation; GPU2Dv2 enables fluid 60 Hz UI updates without frame drops under concurrent network and display loads. | Use Scenario: Portable ultrasound imaging console requiring deterministic real-time processing of sensor data and overlaying DICOM annotations on display. IC Role / Device Role / Timing Role: Host processor running RTOS for time-critical acquisition, coordinating SDMA transfers from ADC, and rendering overlays via GPU2Dv2 to LCDIF. Use Value: 256 KB L2 cache and 128 KB OCRAM reduce memory latency for time-sensitive DMA buffers; DDR3-800 interface sustains >1.2 GB/s throughput for raw image streaming. |
| Ruggedized Retail Kiosks | Smart Energy Gateways |
Use Scenario: Outdoor self-service kiosk deployed in uncontrolled environments with wide thermal cycling and ESD exposure. IC Role / Device Role / Timing Role: Central controller handling PCI-compliant payment processing, multi-language UI, camera-based ID verification, and 4G/LTE modem interfacing. Use Value: A-HAB v4 secures boot path against physical firmware replacement; GPIOs with dual-rail (1.8 V/3.3 V) support simplify interface to legacy peripherals and smart card readers. | Use Scenario: DIN-rail mounted gateway aggregating data from smart meters, PLCs, and environmental sensors in utility substations. IC Role / Device Role / Timing Role: Secure edge node running Linux with TLS-secured MQTT, performing local analytics, and managing time-synchronized data logging via RTC in SNVS. Use Value: SNVS-integrated Secure RTC maintains accurate time stamping during brownouts; eCSPI-4 supports isolated SPI communication with metering ICs without additional level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6L2EVN10AB | No GPU2Dv2 or GPUVGv2; no graphics acceleration hardware. | Suitable only for headless or text-only UI applications; cannot render vector graphics or accelerated BitBLT. | Select when display requirements are limited to basic framebuffer output and cost sensitivity outweighs UI performance needs. |
| MCIMX6Y2DVM08AB | ARM Cortex-A7 core @ 800 MHz; smaller 10×10 mm BGA; no EPDC or GPUVGv2; lower power envelope. | Targeted for ultra-low-power portable devices; lacks OpenVG 1.1 and advanced 2D acceleration features. | Choose for battery-powered edge nodes where thermal budget and PCB area constrain use of i.MX 6SoloLite's larger package and higher performance. |
Compared with MCIMX6L2EVN10AB, MCIMX6L3EVN10AB adds GPU2Dv2/GPUVGv2 for rich UI acceleration while retaining identical temperature grade and package; versus MCIMX6Y2DVM08AB, it delivers higher deterministic throughput and broader peripheral support at the cost of higher power and larger footprint.
Availability
MCIMX6L3EVN10AB is available at Aetrix Electronics and suitable for industrial HMI panels, medical diagnostic terminals, ruggedized retail kiosks, and smart energy gateways requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX6L3EVN10AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6SoloLite product line was designed for cost-sensitive, power-efficient consumer and industrial applications requiring rich multimedia capability without multicore complexity-emphasizing single-core determinism, graphics acceleration, and extended-temperature reliability.
FAQ
What is the maximum DDR3 memory speed supported by MCIMX6L3EVN10AB?
MCIMX6L3EVN10AB supports DDR3-800 (400 MHz clock, 800 MT/s data rate) across a 32-bit bus. This provides up to 3.2 GB/s theoretical bandwidth. The memory controller includes on-die termination calibration and dynamic read leveling to maintain signal integrity at this speed in industrial PCB layouts with controlled impedance routing.
Does MCIMX6L3EVN10AB include an integrated EPD controller?
No, MCIMX6L3EVN10AB does not include the Electrophoretic Display Controller (EPDC). Per Table 1 in the IMX6SLCEC datasheet, the "3" in the part number denotes GPU enabled but EPDC disabled. This distinguishes it from MCIMX6L7EVN10AB (EPDC enabled, no GPU) and MCIMX6L8EVN10AB (both GPU and EPDC enabled).
What security features are implemented in MCIMX6L3EVN10AB?
MCIMX6L3EVN10AB implements A-HAB v4 secure boot with SHA-256 hashing and 2048-bit RSA signature verification, TrustZone-enabled memory isolation, Secure Non-Volatile Storage (SNVS) with tamper detection, Central Security Unit (CSU) policy enforcement, and System JTAG Controller (SJC) with configurable debug access modes-all enforced at silicon level and configured via eFUSEs during manufacturing.
Can MCIMX6L3EVN10AB operate without an external 24 MHz crystal?
No. MCIMX6L3EVN10AB requires an external 24 MHz crystal for USB 2.0 compliance. While the SoC includes an internal 32.768 kHz oscillator for RTC, the USB PHY mandates precise 24 MHz reference timing. Omitting this crystal disables USB OTG and host functionality, and may cause boot failure if USB is selected as primary boot device.
What is the thermal design power (TDP) range for MCIMX6L3EVN10AB?
MCIMX6L3EVN10AB has no fixed TDP value published; its power consumption is highly use-case dependent. Under typical industrial HMI workloads (Linux + Qt + 720p LCD + Ethernet), measured power draw is 1.8–2.4 W. Peak transient power can reach ~3.1 W during sustained 1 GHz CPU + GPU2Dv2 + DDR3 activity, requiring a heatsink or thermal pad for continuous operation above 70°C ambient.
MCIMX6L3EVN10AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 432-TFBGA
- Series:
- i.MX6SL
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (3)
- Voltage - I/O:
- 1.2V, 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 432-MAPBGA (13x13)
- Additional Interfaces:
- AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
MCIMX6L3EVN10AB FAQ
1.How can I place an order for MCIMX6L3EVN10AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6L3EVN10AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6L3EVN10AB reliable?
The price and inventory of MCIMX6L3EVN10AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L3EVN10AB is usually 5 days.
3.What payment methods are accepted for MCIMX6L3EVN10AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L3EVN10AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6L3EVN10AB?
MCIMX6L3EVN10AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6L3EVN10AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6L3EVN10AB?
For technical support, including MCIMX6L3EVN10AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L3EVN10AB requirements.
6.How does Aetrix verify that MCIMX6L3EVN10AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6L3EVN10AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L3EVN10AB meets industry standards.
7.What is the process for return or replacement of MCIMX6L3EVN10AB?
All MCIMX6L3EVN10AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L3EVN10AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6L3EVN10AB part is unused and in its original packaging.
Return procedure for MCIMX6L3EVN10AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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