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NXP Semiconductors MCIMX6L3EVN10AC
- Part No.:
- MCIMX6L3EVN10AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 432-TFBGA
- Datasheet:
-
MCIMX6L3EVN10AC.pdf
- Description:
- IC MPU I.MX6SL 1.0GHZ 432MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:800
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Product details
Overview
MCIMX6L3EVN10AC from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, featuring GPU2Dv2 and GPUVGv2 graphics accelerators, 256 KB L2 cache, DDR3-800 memory interface, and integrated power management. It supports EPD display control (disabled in this variant), operates across –40°C to +105°C, and targets industrial-grade portable devices requiring deterministic multimedia performance and extended temperature resilience.
For engineers reviewing the MCIMX6L3EVN10AC datasheet, MCIMX6L3EVN10AC pinout, MCIMX6L3EVN10AC application, or MCIMX6L3EVN10AC equivalent, key selection criteria include its extended-temperature BGA package, absence of EPDC hardware enablement, GPU-accelerated 2D/OpenVG rendering, DVFS support for thermal-aware operation, and compatibility with i.MX 6SoloLite reference designs and Yocto BSPs.
Technical Context
The MCIMX6L3EVN10AC implements a single ARM Cortex-A9 MPCore CPU with TrustZone security, 32 KB L1 instruction and data caches per core, and a unified 256 KB L2 cache. Its memory subsystem includes 128 KB on-chip RAM (OCRAM), boot ROM with HABv4 secure boot, and a 16/32-bit DDR3-800/LPDDR2-800 controller supporting up to 2 GB external memory.
It integrates dedicated hardware accelerators - GPU2Dv2 for BitBlt/stretched BLT, GPUVGv2 for OpenVG 1.1 vector graphics, and PXP for pixel processing - alongside five UARTs (up to 5 Mbps), four eCSPI, three I²C (400 kbps), 10/100 Mbps FEC, USB 2.0 OTG + host with integrated PHY, and an 8×8 keypad port. Power management includes DVFS, software state retention, and on-die temperature monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A9 single-core, r2p10 revision, with TrustZone and NEON MPE co-processor |
| Max Operating Frequency | 1 GHz - enables real-time execution of Linux-based UI stacks and multimedia codecs without throttling under full thermal load |
| L2 Cache | 256 KB unified - reduces off-chip memory accesses and improves deterministic latency for industrial HMI workloads |
| Memory Interface | 16/32-bit DDR3-800 or LPDDR2-800 - supports low-power, high-bandwidth memory configurations for battery-operated edge devices |
| Graphics Acceleration | GPU2Dv2 + GPUVGv2 - delivers hardware-accelerated 2D rendering and OpenVG 1.1 vector graphics, critical for responsive GUIs on LCD panels |
| Temperature Range | –40°C to +105°C junction - qualified for deployment in uncontrolled industrial enclosures and automotive cabin-adjacent environments |
| Package | 13 × 13 mm MAPBGA, 0.5 mm pitch, 289-ball - compatible with standard SMT reflow profiles and supports high-density PCB routing |
Pinout & Package
MCIMX6L3EVN10AC is housed in a RoHS-compliant, lead-free 13 × 13 mm MAPBGA package with 289 solder balls and moisture sensitivity level 3 (MSL3). Pin assignments follow the i.MX 6SoloLite functional contact map defined in Section 6.2 of IMX6SLCEC Rev. 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | ARM Core Power Supply | 1.05–1.3 V regulated input - requires dedicated low-noise LDO; voltage scaling enabled via DVFS for dynamic power optimization |
| VDD_SOC | SoC Logic & I/O Power | 1.2–1.3 V supply - powers CCM, GPC, OCRAM, and peripheral logic; shared rail with DDR I/O for simplified PMIC design |
| DDR_DQ[15:0] | DDR Data Bus (Lower Half) | 16-bit bidirectional data path - supports DDR3-800 (400 MHz) transfers; requires matched-length routing and on-die termination calibration |
| USB_OTG1_DP / USB_OTG1_DM | USB 2.0 OTG Differential Pair | Integrated HS PHY with 480 Mbps capability - eliminates need for external transceiver; requires 90 Ω differential impedance and ESD protection |
| ENET_RXD[3:0] / ENET_TXD[3:0] | Ethernet MAC Data Lines | 10/100 Mbps RMII interface - connects directly to external PHY (e.g., KSZ8081RND); supports IEEE 802.3 compliance with auto-negotiation |
| BOOT_MODE[1:0] | Boot Configuration Inputs | Pulled high/low at reset to select boot source (eMMC, NAND, SPI NOR, or SD card) - determines initial firmware loading sequence and HAB security policy |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage and Frequency Scaling (DVFS) | Enables runtime adjustment of VDD_ARM and clock frequency to match workload demands - reduces active power by up to 40% during audio decode or idle GUI states |
| Secure Boot (HABv4) | Hardware-enforced authentication chain using SHA-256 and 2048-bit RSA keys - prevents unauthorized firmware execution and ensures supply-chain integrity |
| On-Chip Temperature Sensor (TEMPMON) | Monitors die temperature with ±3°C accuracy - triggers thermal throttling or system shutdown before exceeding 105°C junction limit |
| Smart DMA (SDMA) | 16-bit micro-RISC engine with 32-channel time-division multiplexing - offloads CPU from memory-mapped peripheral transfers (e.g., camera sensor streaming to DDR) |
| GPIO with Dual-Voltage Support | Configurable 1.8 V / 3.3 V I/O pads - simplifies interface to legacy peripherals and modern low-voltage sensors without level shifters |
Applications
| Industrial HMI Terminal | Ruggedized Handheld Scanner |
|---|---|
|
Use Scenario: A sealed, fanless panel PC deployed in factory automation for machine status monitoring and operator interaction. IC Role / Device Role / Timing Role: Primary applications processor executing Qt-based GUI, managing real-time Ethernet I/O, and driving 800×480 TFT-LCD at 60 Hz with GPU-accelerated widget rendering. Use Value: Extended temperature rating (–40°C to +105°C) ensures reliable operation inside hot machinery cabinets; DVFS maintains stable frame rate while limiting thermal dissipation. |
Use Scenario: Battery-powered barcode scanner used in warehouse logistics with drop resistance and long operational life. IC Role / Device Role / Timing Role: Central SoC handling image capture via parallel camera interface, decoding symbologies in real time, and communicating over USB OTG to host PCs. Use Value: Integrated GPU2Dv2 accelerates image preprocessing (contrast enhancement, binarization); low-power modes extend battery runtime beyond 12 hours per charge. |
| Medical Point-of-Care Display | Smart Energy Meter Interface |
|
Use Scenario: Portable diagnostic device displaying vital sign waveforms and patient records on a sunlight-readable monochrome LCD. IC Role / Device Role / Timing Role: Applications processor running Linux RT kernel, rendering waveform overlays using OpenVG, and interfacing with ADCs and serial medical sensors via UART/I²C. Use Value: GPUVGv2 enables smooth anti-aliased curve drawing and real-time zoom/pan; secure boot (HABv4) satisfies HIPAA-aligned firmware validation requirements. |
Use Scenario: DIN-rail mounted electricity meter with local display, tamper detection, and wireless backhaul via cellular modem. IC Role / Device Role / Timing Role: Main controller managing energy measurement ASIC communication (SPI), updating segmented LCD, logging data to eMMC, and coordinating LTE modem handshakes. Use Value: SDMA handles burst transfers from measurement IC without CPU intervention; 128 KB OCRAM provides fast scratchpad for cryptographic operations during secure firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6L2EVN10AC | No GPU2Dv2 or GPUVGv2 hardware - lacks 2D/OpenVG acceleration blocks entirely | Suitable only for headless or text-only UI applications; cannot render complex graphics or vector icons | Select when cost reduction outweighs graphical capability needs and software-rendered UI is acceptable |
| MCIMX6Y2CVM08AB | i.MX 6ULL variant; ARM Cortex-A7 @ 792 MHz, smaller 10 × 10 mm BGA, no EPDC or PXP | Lower performance, lower power, and reduced peripheral count - optimized for ultra-low-cost IoT gateways | Choose for new designs prioritizing BOM cost and footprint over legacy i.MX 6SoloLite software compatibility |
Compared with MCIMX6L3EVN10AC, MCIMX6L2EVN10AC removes GPU resources but retains identical CPU, memory, and temperature specs - ideal for non-graphical control tasks; MCIMX6Y2CVM08AB trades Cortex-A9 architecture and graphics capability for lower cost and power, requiring BSP migration but offering newer silicon revision and longer lifecycle visibility.
Availability
MCIMX6L3EVN10AC is available at Aetrix Electronics and suitable for industrial HMI terminals, ruggedized handheld scanners, medical point-of-care displays, smart energy meters, and other extended-temperature embedded applications requiring stable component supply and long-term manufacturing continuity.
Supply support for MCIMX6L3EVN10AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based applications processors and edge AI acceleration.
The i.MX 6SoloLite product line was designed specifically for cost-sensitive, power-constrained consumer and industrial portable devices requiring rich multimedia capabilities, extended temperature operation, and hardware-enforced security - exemplified by the MCIMX6L3EVN10AC's GPU-enabled, –40°C to +105°C qualified implementation.
FAQ
What is the maximum DDR3 memory speed supported by MCIMX6L3EVN10AC?
MCIMX6L3EVN10AC supports DDR3-800, meaning it operates with a 400 MHz clock frequency and delivers up to 6.4 GB/s peak bandwidth across its 16- or 32-bit interface. This is confirmed in Section 4.10 of the IMX6SLCEC datasheet, where timing parameters for DDR3-800 are explicitly specified for all i.MX 6SoloLite variants including MCIMX6L3EVN10AC.
Does MCIMX6L3EVN10AC include the Electrophoretic Display Controller (EPDC)?
No, MCIMX6L3EVN10AC does not include enabled EPDC functionality. Per Table 1 in the IMX6SLCEC datasheet, the "3" in the part number suffix indicates GPU-enabled but EPDC-disabled configuration. While the silicon may contain EPDC logic, fusing and boot configuration prevent its activation - unlike MCIMX6L7EVN10AC or MCIMX6L8EVN10AC which explicitly list EPDC in their options column.
What boot devices are supported by MCIMX6L3EVN10AC?
MCIMX6L3EVN10AC supports boot from eMMC, NAND Flash, SPI NOR Flash, and SD/MMC cards, as defined by BOOT_MODE[1:0] pin strapping and documented in Section 5 of IMX6SLCEC. The boot ROM includes HABv4 secure boot verification for signed images loaded from any of these sources, ensuring authenticated firmware startup.
Is MCIMX6L3EVN10AC pin-compatible with other i.MX 6SoloLite variants in the same package?
Yes, MCIMX6L3EVN10AC shares identical 289-ball 13 × 13 mm MAPBGA mechanical and electrical pinout with all other VN-suffixed i.MX 6SoloLite parts (e.g., MCIMX6L2EVN10AC, MCIMX6L7EVN10AC), as confirmed in Section 6.2 of IMX6SLCEC. Signal mapping and ball assignment are consistent across the family, enabling hardware reuse across GPU-enabled and EPDC-enabled variants.
What security features are implemented in MCIMX6L3EVN10AC?
MCIMX6L3EVN10AC implements ARM TrustZone, HABv4 secure boot with SHA-256/2048-bit RSA, Secure Non-Volatile Storage (SNVS) with RTC, Central Security Unit (CSU), and System JTAG Controller (SJC) with eFUSE-configurable debug lockdown. These are detailed in Sections 1.2 and 6 of IMX6SLCEC and enable secure firmware updates, encrypted storage, and tamper-resistant operation - all active in the MCIMX6L3EVN10AC silicon configuration.
MCIMX6L3EVN10AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 432-TFBGA
- Series:
- i.MX6SL
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (3)
- Voltage - I/O:
- 1.2V, 1.8V, 3.0V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 432-MAPBGA (13x13)
- Additional Interfaces:
- AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
MCIMX6L3EVN10AC FAQ
1.How can I place an order for MCIMX6L3EVN10AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6L3EVN10AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6L3EVN10AC reliable?
The price and inventory of MCIMX6L3EVN10AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6L3EVN10AC is usually 5 days.
3.What payment methods are accepted for MCIMX6L3EVN10AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6L3EVN10AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6L3EVN10AC?
MCIMX6L3EVN10AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6L3EVN10AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6L3EVN10AC?
For technical support, including MCIMX6L3EVN10AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6L3EVN10AC requirements.
6.How does Aetrix verify that MCIMX6L3EVN10AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6L3EVN10AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6L3EVN10AC meets industry standards.
7.What is the process for return or replacement of MCIMX6L3EVN10AC?
All MCIMX6L3EVN10AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6L3EVN10AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6L3EVN10AC part is unused and in its original packaging.
Return procedure for MCIMX6L3EVN10AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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