NXP Semiconductors MCIMX6L8DVN10AA

Overview

MCIMX6L8DVN10AA from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, featuring integrated GPU2Dv2 and EPDC for E Ink display control, 128 KB on-chip RAM (OCRAM), DDR3-800 memory interface, and hardware-accelerated multimedia processing - deployed in eReaders and entry-level tablets requiring low-power, high-resolution monochrome display support.

For engineers reviewing the MCIMX6L8DVN10AA datasheet, MCIMX6L8DVN10AA pinout, MCIMX6L8DVN10AA application, or MCIMX6L8DVN10AA equivalent, key selection criteria include confirmed EPDC support, 13×13 mm BGA package compatibility, 1 GHz core frequency under commercial temperature grade (0°C to +95°C), and verified GPU2Dv2/PUVGv2 graphics acceleration for embedded UI rendering.

Technical Context

The MCIMX6L8DVN10AA implements a single ARM Cortex-A9 MPCore CPU with TrustZone security, 32 KB L1 instruction and data caches, 256 KB unified L2 cache, and NEON MPE co-processor - all operating at up to 1 GHz. It integrates dedicated hardware accelerators including GPU2Dv2 (BitBlt), GPUVGv2 (OpenVG 1.1), and PXP (pixel processing pipeline) optimized for grayscale E Ink panel driving.

Its memory subsystem supports 16-/32-bit DDR3-800 and LPDDR2-800 interfaces, 128 KB OCRAM, and boot ROM with HABv4 secure boot. Power management includes DVFS, software state retention, and integrated LDOs - enabling operation in active and multiple low-power states without external PMIC dependency.

Key Specifications

Pinout & Package

MCIMX6L8DVN10AA uses a 13×13 mm MAPBGA package with 0.5 mm pitch and 289 balls (BGA-289). Pin assignments follow the i.MX 6SoloLite signal naming convention defined in IMX6SLCEC Rev. 6, with dedicated ball groups for DDR3 interface (DQ/DQS/DM/CK/CKE/CS), EPDC (EPDC_DATA/EPDC_CLK/EPDC_PWR), GPU-related signals (GPU_VSYNC/GPU_HSYNC), and power domains (VDD_ARM/VDD_SOC/VDDA_3P3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6L8DVN10AA, MCIMX6L3DVN10AB removes EPDC but retains GPU acceleration for LCD use cases, while i.MX6ULL G0A10A trades core performance and display capabilities for lower BOM cost and extended temperature range - making MCIMX6L8DVN10AA uniquely suited for E Ink-centric consumer devices requiring balanced compute, graphics, and ultra-low static power.

Availability

MCIMX6L8DVN10AA is available at Aetrix Electronics and suitable for eReader development, industrial barcode terminal production, and educational tablet manufacturing requiring stable component supply across multi-year product lifecycles.

Supply support for MCIMX6L8DVN10AA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The i.MX 6SoloLite product line targets power-constrained portable applications - delivering ARM Cortex-A9 performance with integrated EPDC, GPU, and security features optimized for eReaders, entry tablets, and smart display endpoints.

FAQ

What is the maximum DDR3 memory speed supported by MCIMX6L8DVN10AA?

MCIMX6L8DVN10AA supports DDR3-800 (800 MT/s) with 16- or 32-bit bus width. This enables 6.4 GB/s peak bandwidth for high-resolution framebuffer handling and real-time video decode buffers. The MMDC controller includes programmable timing parameters for JEDEC-compliant DDR3 SDRAM chips, and supports up to 2 GB addressable space. Verified operation requires strict PCB layout rules including length-matched DQ/DQS traces and controlled-impedance routing.

Does MCIMX6L8DVN10AA include hardware support for secure boot?

Yes, MCIMX6L8DVN10AA implements HABv4 (Advanced High Assurance Boot) with SHA-256 hashing, 2048-bit RSA signature verification, and version control - enforced by the CSU and SNVS modules. Secure boot validates signed firmware images stored in eMMC or SPI NOR before loading into OCRAM. Keys are fused into eFUSEs during manufacturing, and the boot ROM enforces immutable chain-of-trust. This capability is confirmed in the i.MX 6SoloLite Security Reference Manual (IMX6SLSRM).

Can MCIMX6L8DVN10AA drive color E Ink displays?

Yes, MCIMX6L8DVN10AA's integrated EPDC supports both monochrome and color E Ink panels, including E Ink Spectra and Gallery technologies. It handles up to 2048×1536 resolution at 106 Hz refresh rate with 5-bit grayscale (32 levels per channel), enabling smooth partial updates for color text and graphics. The PXP accelerator performs real-time gamma correction and color-space conversion - eliminating need for external frame buffer or lookup tables.

What is the operating temperature range for MCIMX6L8DVN10AA?

MCIMX6L8DVN10AA is rated for commercial temperature range: junction temperature (Tj) from 0°C to +95°C. This is specified in Table 1 of the IMX6SLCEC datasheet and applies to all variants ending in "D" (e.g., MCIMX6L8DVN10AB/AC/AA). Thermal design must maintain die temperature within this range under worst-case load - typically requiring ≥2.5 cm² copper pour and 2 oz copper layers for heat dissipation in handheld form factors.

How many USB 2.0 interfaces does MCIMX6L8DVN10AA provide?

MCIMX6L8DVN10AA integrates two High-Speed USB 2.0 OTG ports (up to 480 Mbps each) with integrated PHYs, plus one additional USB 2.0 host port with HS-IC USB PHY. All three support standard USB 2.0 protocol stacks and are accessible via dedicated ball groups. The OTG ports support dual-role operation (host/peripheral) and are validated for mass storage, HID, and CDC ACM classes in Linux BSP v5.4 and later.