NXP Semiconductors MCIMX6L8DVN10ABR

Overview

MCIMX6L8DVN10ABR from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, featuring integrated GPU2Dv2 and EPDC for E Ink display control, 128 KB on-chip RAM (OCRAM), DDR3-800 memory interface, and hardware-accelerated multimedia processing - deployed in eReaders, entry-level tablets, and barcode scanners.

For engineers reviewing the MCIMX6L8DVN10ABR datasheet, MCIMX6L8DVN10ABR pinout, MCIMX6L8DVN10ABR application, or MCIMX6L8DVN10ABR equivalent, key selection criteria include EPD controller support, 13×13 mm BGA package with 0.5 mm pitch, 1 GHz core frequency, -40°C to +105°C extended temperature grade, and integrated power management with DVFS.

Technical Context

The MCIMX6L8DVN10ABR implements an ARM Cortex-A9 MPCore CPU with TrustZone security, 32 KB L1 instruction and data caches per core, 256 KB unified L2 cache, NEON MPE coprocessor, and Snoop Control Unit. It integrates dedicated accelerators including GPU2Dv2 (BitBlt), GPUVGv2 (OpenVG 1.1), and PXP (pixel processing pipeline) optimized for grayscale E Ink rendering.

Its memory subsystem supports 16/32-bit DDR3-800 and LPDDR2-800, plus NOR Flash, PSRAM, and eMMC up to HS200 mode (200 MB/s). Power management includes integrated LDOs, temperature monitoring (TEMPMON), dynamic voltage and frequency scaling (DVFS), and software state retention for low-power operation.

Key Specifications

Pinout & Package

MCIMX6L8DVN10ABR is housed in a 13×13 mm, 0.5 mm pitch MAPBGA package with 289 solder balls. Pin assignments follow the i.MX 6SoloLite signal naming convention defined in IMX6SLSRM and documented in Section 6.2 of IMX6SLCEC Rev. 6. Ball map and functional contact assignments are available in the official NXP datasheet (pages 82–100).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6L8DVN10ABR, MCIMX6L3DVN10AB removes E Ink support but maintains identical packaging and thermal specs, while MCIMX6Y2DVM08AB trades performance and graphics capability for reduced static power and Cortex-A7 efficiency - making each suitable for distinct display vs. headless deployment trade-offs.

Availability

MCIMX6L8DVN10ABR is available at Aetrix Electronics and suitable for electronic paper displays, industrial handheld terminals, and entry-level Android tablets requiring stable component supply, long-term lifecycle assurance, and extended-temperature qualification.

Supply support for MCIMX6L8DVN10ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer applications.

The i.MX 6SoloLite product line targets cost-sensitive, power-constrained consumer electronics - delivering balanced performance, integrated display control, and hardware security for eReaders, smart retail, and portable HMIs.

FAQ

What is the maximum DDR3 memory speed supported by MCIMX6L8DVN10ABR?

MCIMX6L8DVN10ABR supports DDR3-800 (400 MHz clock, 800 MT/s data rate) across a 32-bit bus interface. This delivers up to 6.4 GB/s peak bandwidth and supports up to 2 GB of external DDR3 memory, as specified in Section 4.10 of the IMX6SLCEC datasheet. The MMDC controller handles timing calibration and refresh management autonomously.

Does MCIMX6L8DVN10ABR include hardware support for secure boot?

Yes, MCIMX6L8DVN10ABR implements Advanced High Assurance Boot (A-HAB v4) with SHA-256 hashing, 2048-bit RSA signature verification, version control, and eFUSE-based key provisioning. Secure boot is enforced by the HAB block in Boot ROM and configured via CSU and SNVS modules - detailed in the i.MX 6SoloLite Security Reference Manual (IMX6SLSRM).

What display interfaces does MCIMX6L8DVN10ABR support besides EPDC?

In addition to the integrated EPDC for E Ink panels, MCIMX6L8DVN10ABR supports LCDIF for RGB/TFT displays up to WUXGA (1920×1200) at 60 Hz, and includes HDMI transmitter support via external PHY. The LCDIF provides 24-bit parallel output with programmable timing, dot-clock generation, and alpha blending - enabling direct connection to common LVDS or RGB display modules.

Is MCIMX6L8DVN10ABR pin-compatible with other i.MX 6SoloLite variants?

Yes, MCIMX6L8DVN10ABR shares the identical 13×13 mm, 0.5 mm pitch MAPBGA-289 package and ball map with all MCIMX6LxDVN10xx and MCIMX6LxEVN10xx variants. Signal compatibility is maintained across the family per the updated naming convention in IMX6SLCEC Section 1.3, though functional differences (e.g., EPDC presence) are determined by fusing and silicon revision.

What power management features are integrated into MCIMX6L8DVN10ABR?

MCIMX6L8DVN10ABR integrates a comprehensive PMU with multiple LDO regulators, DVFS control, temperature monitoring (TEMPMON), software state retention, and power gating for ARM cores and MPE. It supports five system power modes - RUN, WAIT, STOP, DEEP-SLEEP, and POWER-OFF - with automatic transition triggered by OS-level suspend/resume calls or hardware events.