NXP Semiconductors MCIMX6L8DVN10AC

Overview

MCIMX6L8DVN10AC from NXP Semiconductors is a single-core ARM Cortex-A9 applications processor operating at 1 GHz, integrating GPU2Dv2 and EPDC for E Ink display control, with DDR3-800 memory interface and integrated power management. It targets low-power consumer devices including eReaders and entry-level tablets.

For engineers reviewing the MCIMX6L8DVN10AC datasheet, MCIMX6L8DVN10AC pinout, MCIMX6L8DVN10AC application, or MCIMX6L8DVN10AC equivalent, key selection criteria include EPD controller support, 13×13 mm BGA package compatibility, 1 GHz operation under commercial temperature range (0°C to +95°C), and GPU-enabled 2D graphics acceleration for embedded UI rendering.

Technical Context

The MCIMX6L8DVN10AC implements a symmetric dual-issue ARM Cortex-A9 core with TrustZone security, 32 KB L1 instruction and data caches, and 256 KB unified L2 cache. It integrates NEON MPE for SIMD media processing and supports DVFS for dynamic power optimization across active and low-power states.

Its system architecture includes dedicated hardware accelerators: GPU2Dv2 for BitBlt operations, GPUVGv2 for OpenVG 1.1 vector graphics, and PXP for pixel-level processing (color-space conversion, alpha blending) optimized for grayscale EPD panels up to 2048 × 1536 at 106 Hz refresh.

Key Specifications

Pinout & Package

MCIMX6L8DVN10AC is housed in a 13 × 13 mm, 0.5 mm pitch MAPBGA package with 361 I/O balls. Pin assignments follow the i.MX 6SoloLite signal naming convention defined in IMX6SLSRM and documented in the Functional Contact Assignments table (Section 6.2, Rev. 6 datasheet). Ball map includes dedicated EPDC data/control lanes, DDR3 address/control groups, and multiplexed peripheral interfaces (eCSPI, I2C, UART, SSI).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6L8DVN10AC, MCIMX6L7DVN10AC removes GPU resources to reduce die size and power, while MCIMX6L3DVN10AC shifts focus from electrophoretic to emissive displays - both retain identical ARM Cortex-A9 core, DDR3 interface, and security features, enabling software reuse across variants.

Availability

MCIMX6L8DVN10AC is available at Aetrix Electronics and suitable for color eReader systems, industrial HMI terminals, and entry-level Android tablets requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MCIMX6L8DVN10AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The i.MX 6SoloLite product line was designed specifically for ultra-low-power, cost-sensitive consumer applications requiring rich multimedia capability and E Ink display support - balancing performance, power, and integration in a single-die solution.

FAQ

What is the maximum supported resolution and refresh rate for E Ink displays using MCIMX6L8DVN10AC?

The MCIMX6L8DVN10AC supports E Ink displays up to 2048 × 1536 pixels at 106 Hz refresh rate in monochrome mode, and up to 4096 × 4096 at 20 Hz for high-resolution color panels. These capabilities are enabled by its integrated EPDC module and PXP pixel pipeline, both confirmed in the i.MX 6SoloLite datasheet (Rev. 6, Section 1.1 and Table 1). The MCIMX6L8DVN10AC delivers full hardware timing control without external logic.

Does MCIMX6L8DVN10AC support secure boot, and what cryptographic algorithms are implemented?

Yes, MCIMX6L8DVN10AC implements Advanced High Assurance Boot (A-HAB) v4 with SHA-256 hash verification and 2048-bit RSA public-key signature validation during ROM-based boot. These features are enforced by the CSU and SNVS modules and documented in the i.MX 6SoloLite Security Reference Manual (IMX6SLSRM). The MCIMX6L8DVN10AC uses on-die fuses to lock boot policy configuration at manufacturing.

What memory types and configurations does MCIMX6L8DVN10AC support through its external interfaces?

MCIMX6L8DVN10AC supports DDR3-800 and LPDDR2-800 (16/32-bit), NOR Flash (16/32-bit), PSRAM, cellular RAM, and managed NAND including eMMC 4.41. Its MMDC controller handles up to 2 GB of DDR space with configurable burst lengths and latency settings. This multi-interface flexibility is specified in Section 4.10 of the IMX6SLCEC datasheet and validated for MCIMX6L8DVN10AC in Table 1.

Is MCIMX6L8DVN10AC pin-compatible with other i.MX 6SoloLite variants such as MCIMX6L7DVN10AC?

Yes, MCIMX6L8DVN10AC shares identical 13 × 13 mm MAPBGA package, 361-ball layout, and ball-to-signal mapping with all MCIMX6LxDVN10xx and MCIMX6LxEVN10xx variants listed in Table 1 of the IMX6SLCEC datasheet. Signal routing, power sequencing, and thermal pad design are fully interchangeable - only functional enablement (GPU/EPDC) differs per part number.

What is the operating temperature range and qualification level for MCIMX6L8DVN10AC?

MCIMX6L8DVN10AC is rated for commercial temperature operation from 0°C to +95°C junction temperature (Tj), as explicitly stated in Table 1 of the IMX6SLCEC datasheet. It meets NXP's standard qualification level for consumer applications and is packaged in RoHS-compliant, MSL3 moisture-sensitive MAPBGA - consistent with all "D" suffix variants in the i.MX 6SoloLite family.