NXP Semiconductors MCIMX6Q4AVT08ACR
- Part No.:
- MCIMX6Q4AVT08ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q4AVT08ACR.pdf
- Description:
- IC MPU I.MX6Q 852MHZ 624FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,237
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q4AVT08ACR from NXP Semiconductors is an automotive-grade i.MX 6Quad application processor featuring four Arm Cortex-A9 cores running at 852 MHz, integrated GPU (no VPU), 1 MB L2 cache, and FCPBGA-624 package (21 × 21 mm, 0.8 mm pitch). It delivers graphics-accelerated HMI, audio processing, and display control for automotive infotainment head units and digital instrument clusters.
For engineers reviewing the MCIMX6Q4AVT08ACR datasheet, MCIMX6Q4AVT08ACR pinout, MCIMX6Q4AVT08ACR application, or MCIMX6Q4AVT08ACR equivalent, key selection criteria include its 852 MHz CPU frequency, GPU-only multimedia acceleration (no VPU), automotive temperature grade (−40°C to +125°C), DDR3/DDR3L/LPDDR2 memory interface, and dual CAN support for vehicle network integration.
Technical Context
The MCIMX6Q4AVT08ACR implements a quad-core Arm Cortex-A9 MPCore platform with TrustZone security, private L1 caches (32 KB I/D per core), and a shared 1 MB L2 cache. Its memory subsystem supports 64-bit DDR3-1066, DDR3L-1066, and LPDDR2-800 interfaces with interleaving and ECC-capable NAND flash controllers.
It integrates dedicated hardware accelerators including GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2 (BitBlt), GPUVG (OpenVG 1.1), ASRC (asynchronous sample rate conversion for multi-channel audio), and CAAM (cryptographic acceleration with NIST-certified PRNG and 16 KB secure RAM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad Arm Cortex-A9 @ 852 MHz - enables concurrent OS, middleware, and application execution in automotive HMI stacks. |
| L2 Cache | 1 MB unified - reduces memory bandwidth pressure and improves deterministic latency for real-time UI rendering. |
| Graphics | GPU3Dv4 + GPU2Dv2 + GPUVG - supports OpenGL ES 2.0, OpenVG 1.1, and BitBlt acceleration for smooth 2D/3D GUIs without CPU load. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to 1066 MHz - provides ≥8.5 GB/s peak bandwidth for high-resolution multi-display systems. |
| Automotive Interfaces | Dual FlexCAN (1 Mbps) + MLB150 + ESAI + ASRC - enables robust audio routing, vehicle bus communication, and MOST network integration. |
| Security | CAAM + SNVS + CSU + A-HAB v4 - delivers hardware-accelerated AES/SHA/RSA, secure boot, and tamper-resistant key storage for DRM and OTA updates. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch - supports high I/O count (624 balls) and thermal dissipation required for automotive under-hood environments. |
Pinout & Package
MCIMX6Q4AVT08ACR is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls and 0.8 mm pitch. The package is lidded for enhanced thermal performance and mechanical protection in automotive applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for Arm Cortex-A9 cores; requires low-noise regulation and local decoupling for stable 852 MHz operation. |
| VDD_SOC | SoC Logic Power | 1.1 V ±3% supply for L2 cache, interconnect, and system peripherals; critical for AXI bus integrity and timing closure. |
| VDDA_3P3 | Analog I/O Supply | 3.3 V analog rail for USB PHY, HDMI, and audio interfaces; must be isolated from digital noise to meet USB 2.0 eye diagram specs. |
| CLKIN_24M | Primary Clock Input | 24 MHz crystal reference for USB OTG/PHY, Ethernet, and system clock generation; mandatory for full-speed USB compliance. |
| CAN1_TX / CAN1_RX | FlexCAN Channel 1 | Differential CAN bus signals compliant with ISO 11898-2; enable direct connection to automotive CAN transceivers without level-shifting. |
| SD1_CMD / SD1_CLK / SD1_DATA0–3 | eMMC/uSDHC Interface | High-speed 4-bit SDIO interface supporting UHS-I SDR104 (104 MB/s); used for boot media and firmware storage in production systems. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamic voltage and frequency scaling (DVFS) across CPU, GPU, and memory domains reduces active power by >40% vs. fixed-frequency operation. |
| Multi-Display Support | Simultaneous drive of up to four displays (HDMI 1.4 + LVDS + MIPI DSI + parallel RGB) at combined pixel rates up to 450 Mpixels/sec. |
| Hardware Video Acceleration | GPU-only pipeline enables 1080p60 video playback and UI compositing while freeing CPU cores for application logic and safety monitoring. |
| Secure Boot Chain | A-HAB v4 with SHA-256, 2048-bit RSA, and version control ensures authenticated, encrypted firmware loading and runtime integrity verification. |
| Automotive Audio Subsystem | ESAI + ASRC + AUDMUX + SPDIF supports 7.1-channel audio with sample rate conversion between independent clocks (e.g., GPS, Bluetooth, and tuner sources). |
Applications
| Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
Use Scenario: Central multimedia hub integrating navigation, media streaming, voice assistant, and vehicle settings in OEM dashboard systems. IC Role / Device Role / Timing Role: Application processor executing Linux/QNX OS, managing GPU-rendered UI, coordinating CAN-based vehicle data, and driving HDMI/LVDS displays. Use Value: GPU acceleration enables fluid 60 Hz UI transitions and concurrent 1080p video playback without frame drops or CPU saturation. | Use Scenario: Real-time driver information display with speed, ADAS alerts, fuel economy, and customizable gauges behind steering wheel. IC Role / Device Role / Timing Role: Safety-critical graphics controller rendering fail-operational UI elements using IPUv3H and GPU2D with deterministic latency under ASIL-B constraints. Use Value: Dual independent IPUv3H units allow simultaneous image scaling, color space conversion, and overlay composition for redundant display paths. |
| Telematics Control Unit (TCU) | Advanced Driver Assistance System (ADAS) Display Processor |
Use Scenario: Cellular-connected module handling OTA updates, remote diagnostics, emergency call (eCall), and fleet telematics reporting. IC Role / Device Role / Timing Role: Secure host processor managing TLS-secured cellular modem communication, encrypted log storage, and signed firmware validation via CAAM. Use Value: Hardware-accelerated crypto (AES-GCM, SHA-256) achieves >100 Mbps encrypted throughput for fast OTA package installation. | Use Scenario: Processing and visualizing camera, radar, and ultrasonic sensor fusion data on center-stack or HUD display. IC Role / Device Role / Timing Role: Vision preprocessing engine using GPMI for raw sensor input, IPUv3H for distortion correction, and GPU3D for AR overlay rendering. Use Value: Dedicated GPMI NAND controller with BCH40 ECC supports reliable storage of calibration data and sensor firmware in harsh automotive environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q6AVT08ACR | Includes VPU (video processing unit) in addition to GPU; same 852 MHz CPU, identical package and pinout. | Required for 1080p60 hardware video decode/encode (H.264/H.265); not needed if only GPU-accelerated UI/video playback is used. | Select MCIMX6Q6AVT08ACR only when hardware video codec offload is mandatory; MCIMX6Q4AVT08ACR reduces BOM cost where VPU is unused. |
| MCIMX6D4AVT08ACR | Dual-core Cortex-A9 @ 852 MHz, same GPU-only configuration, identical automotive grade and FCPBGA-624 package. | Lower compute throughput for multi-threaded HMI stacks; suitable for cost-sensitive entry-level infotainment with reduced feature set. | Choose MCIMX6D4AVT08ACR when application workload fits within two cores and thermal/power envelope is tighter. |
Compared with MCIMX6Q6AVT08ACR, MCIMX6Q4AVT08ACR removes VPU logic to reduce die size and dynamic power, making it optimal for GPU-centric UIs; versus MCIMX6D4AVT08ACR, it doubles CPU core count for higher concurrency in complex QNX/Linux automotive frameworks.
Availability
MCIMX6Q4AVT08ACR is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6Q4AVT08ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and automotive functional safety.
The i.MX 6 series was designed specifically for automotive infotainment and HMI applications, emphasizing real-time graphics, multi-display support, functional safety readiness (ISO 26262), and hardware security for connected vehicles.
FAQ
What is the maximum operating frequency of the MCIMX6Q4AVT08ACR CPU cores?
The MCIMX6Q4AVT08ACR features four Arm Cortex-A9 cores rated for operation at 852 MHz under automotive temperature conditions (−40°C to +125°C junction). This frequency is validated with a 24 MHz crystal input and meets all electrical and thermal specifications in the IMX6DQAEC datasheet Rev. 6.
Does the MCIMX6Q4AVT08ACR include a Video Processing Unit (VPU)?
No, the MCIMX6Q4AVT08ACR does not include a Video Processing Unit. Its part number suffix "4A" explicitly denotes GPU-only configuration (no VPU), distinguishing it from "6A" variants like MCIMX6Q6AVT08ACR which integrate both GPU and VPU for hardware video encode/decode.
What package type and ball count does the MCIMX6Q4AVT08ACR use?
The MCIMX6Q4AVT08ACR uses a lidded Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm pitch and 624 solder balls. This package is qualified for automotive applications and supports thermal dissipation requirements up to 125°C junction temperature.
Which memory types are supported by the MCIMX6Q4AVT08ACR's external memory interface?
The MCIMX6Q4AVT08ACR supports DDR3-1066, DDR3L-1066, and LPDDR2-800 via its 64-bit MMDC interface, plus NAND Flash (MLC/SLC, BCH up to 40-bit), NOR Flash, PSRAM, and OneNAND. It does not support DDR4 or LPDDR3.
Is the MCIMX6Q4AVT08ACR qualified for automotive applications?
Yes, the MCIMX6Q4AVT08ACR is fully qualified for automotive applications with AEC-Q100 Grade 2 rating (−40°C to +125°C junction temperature), integrated dual FlexCAN interfaces, ASIL-B capable peripherals, and automotive-specific qualification testing per NXP's automotive product roadmap.
MCIMX6Q4AVT08ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q4AVT08ACR FAQ
1.How can I place an order for MCIMX6Q4AVT08ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q4AVT08ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q4AVT08ACR reliable?
The price and inventory of MCIMX6Q4AVT08ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q4AVT08ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6Q4AVT08ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q4AVT08ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q4AVT08ACR?
MCIMX6Q4AVT08ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q4AVT08ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q4AVT08ACR?
For technical support, including MCIMX6Q4AVT08ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q4AVT08ACR requirements.
6.How does Aetrix verify that MCIMX6Q4AVT08ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q4AVT08ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q4AVT08ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6Q4AVT08ACR?
All MCIMX6Q4AVT08ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q4AVT08ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q4AVT08ACR part is unused and in its original packaging.
Return procedure for MCIMX6Q4AVT08ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q4AVT08ACR Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

