NXP Semiconductors MCIMX6Q4AVT10ACR
- Part No.:
- MCIMX6Q4AVT10ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q4AVT10ACR.pdf
- Description:
- IC MPU I.MX6Q 1.0GHZ 624FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,935
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q4AVT10ACR from NXP Semiconductors is an automotive-grade i.MX 6Quad application processor featuring four Arm Cortex-A9 cores running at 1 GHz, integrated 3D/2D/OpenVG graphics accelerators (GPU only, no VPU), and FCPBGA-624 package (21 × 21 mm, 0.8 mm pitch). It supports DDR3/DDR3L/LPDDR2 memory, dual CAN, HDMI 1.4, MIPI CSI-2/DSI, and Gigabit Ethernet - deployed in automotive instrument clusters and infotainment head units.
For engineers reviewing the MCIMX6Q4AVT10ACR datasheet, MCIMX6Q4AVT10ACR pinout, MCIMX6Q4AVT10ACR application, or MCIMX6Q4AVT10ACR equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), GPU-only multimedia capability (no hardware video encode/decode), quad-core A9 performance with TrustZone, and compatibility with i.MX 6Quad software ecosystem and BSPs.
Technical Context
The MCIMX6Q4AVT10ACR implements a symmetric quad-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core, 1 MB shared L2 cache, NEON MPE coprocessor, and GIC supporting 128 interrupts. Its memory subsystem includes boot ROM (96 KB), OCRAM (256 KB), secure RAM (16 KB), and MMDC supporting DDR3-1066/DDR3L-1066/LPDDR2-800.
It integrates dedicated hardware accelerators including GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2 (BitBlt), GPUVG (OpenVG 1.1), ASRC (10-channel asynchronous sample rate conversion), and CAAM (NIST-certified cryptographic acceleration with 16 KB secure RAM), all managed via CCM/GPC/SRC clock and power control modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad Arm Cortex-A9 @ 1 GHz - delivers deterministic real-time HMI responsiveness and concurrent OS/application execution. |
| Graphics | GPU3Dv4 + GPU2Dv2 + GPUVG - enables OpenGL ES 2.0 UI rendering, 2D compositing, and OpenVG vector graphics without VPU offload. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to 1066 MHz - supports high-bandwidth display buffering and multi-layer UI frame buffers. |
| Automotive Interfaces | Dual FlexCAN (1 Mbps) + MLB150 + ESAI + ASRC - meets automotive audio/video synchronization and bus communication requirements. |
| Security | CAAM + TrustZone + A-HAB v4 (SHA-256, 2048-bit RSA) - enables secure boot, encrypted firmware updates, and DRM-compliant content playback. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive reflow profiles and mechanical shock/vibration environments. |
| Temperature Grade | −40°C to +125°C junction - validated for under-hood and dashboard-mounted automotive electronics. |
Pinout & Package
MCIMX6Q4AVT10ACR uses a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and integrated heat spreader lid. Pin assignments follow the i.MX 6Quad Automotive signal naming convention (IMX6DQAEC Rev. 6), with functional contact mapping defined across power domains (VDD_ARM, VDD_SOC, VDD_GPU, etc.), I/O banks (LVDS, HDMI, MIPI, DDR), and dedicated automotive interfaces (CAN, MLB, ESAI).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM_1P2 | Core Power Supply | 1.2 V supply for Arm Cortex-A9 cores and L1/L2 caches - requires low-noise regulation and local decoupling. |
| VDD_SOC | System-on-Chip Power | 1.2 V domain powering MMDC, GPC, CCM, and interconnect fabric - critical for DDR timing stability. |
| VDD_GPU | Graphics Power Supply | 1.1 V supply for GPU3D/GPU2D/GPUVG - independent regulation enables dynamic GPU frequency scaling. |
| CAN1_TX / CAN1_RX | Controller Area Network | Differential CAN 2.0B interface - supports automotive body control and gateway messaging at 1 Mbps. |
| HDMI_TX_CLK / HDMI_TX_DATA[0:2] | HDMI 1.4 Transmitter | TMDS clock and data lanes - drives 1080p60 displays with HDCP-ready pixel pipeline (requires external PHY). |
| CSI2_D0_P / CSI2_CLK_P | MIPI CSI-2 Camera Input | Differential data and clock pairs - supports up to 1 Gbps/lane for high-resolution automotive camera sensors. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across CPU, GPU, and memory domains - reduces active power by >40% vs. fixed-frequency operation. |
| Multi-Standard Display Support | Simultaneous parallel LCD + LVDS + HDMI + MIPI DSI - enables multi-display instrument clusters with independent resolution/timing control. |
| Secure Boot Chain | A-HAB v4 with SHA-256 signature verification and eFUSE-based CSU policy locking - prevents unauthorized firmware execution at power-on. |
| Hardware Audio Acceleration | ASRC (10-channel, −120 dB THD+N) + ESAI (260 kHz stereo) - eliminates CPU load for multi-source automotive audio mixing and resampling. |
| Industrial-Grade Peripheral Set | 5x UART (5 Mbps), 5x eCSPI, 3x I2C (400 kbps), 4x PWM, SPDIF Rx/Tx - supports legacy vehicle ECUs and sensor networks without external bridges. |
Applications
| Automotive Instrument Cluster | Infotainment Head Unit |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, navigation arrows, and ADAS warnings on TFT-LCD or OLED display behind glass. IC Role / Device Role / Timing Role: Application processor executing QNX or Linux-based cluster OS, driving dual-display output (LCD + HUD) with <50 ms latency. Use Value: GPU-accelerated vector graphics ensure smooth gauge animation and overlay transparency without CPU saturation. | Use Scenario: Central multimedia hub integrating AM/FM, Bluetooth audio, Apple CarPlay, and rear-seat video playback. IC Role / Device Role / Timing Role: Main SoC handling Android Automotive OS, managing HDMI video out, MIPI CSI-2 camera input, and dual CAN bus telemetry. Use Value: Dedicated ASRC and ESAI enable zero-jitter multi-source audio routing while GPU handles UI compositing and video decode (via software fallback). |
| Telematics Control Unit (TCU) | Advanced Driver Assistance System (ADAS) Gateway |
Use Scenario: Cellular-connected module aggregating GPS, vehicle diagnostics (OBD-II), and remote diagnostics over LTE. IC Role / Device Role / Timing Role: Host processor interfacing with modem IC via PCIe and USB, running secure Linux with OTA update stack. Use Value: CAAM-accelerated TLS 1.2 and secure boot guarantee firmware integrity during wireless updates in field deployment. | Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS ECU. IC Role / Device Role / Timing Role: Edge compute node performing image scaling (IPUv3H), timestamp synchronization (ASRC + ESAI), and CAN message filtering. Use Value: Hardware IPU and ASRC offload CPU cycles from time-critical sensor fusion tasks, enabling deterministic sub-100 µs interrupt response. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q6AVT10AC | Includes VPU (1080p encode/decode) + same GPU + identical CPU/package - higher BOM cost, +150 mW typical active power. | Required for hardware-accelerated video conferencing or DVR recording; unnecessary if only UI rendering and audio playback needed. | Select MCIMX6Q6AVT10AC only when H.264/H.265 encode/decode is mandatory; MCIMX6Q4AVT10ACR reduces thermal design complexity where VPU is unused. |
| MCIMX6D4AVT10AC | Dual-core Cortex-A9 @ 1 GHz, same GPU/no VPU, identical package/temperature grade - ~30% lower CPU throughput, reduced L2 cache (512 KB vs. 1 MB). | Suitable for cost-sensitive entry-level clusters with single-display UI and no concurrent background services. | Choose MCIMX6D4AVT10AC for simpler HMI designs with lower real-time scheduling demands; retain MCIMX6Q4AVT10ACR for multi-tasking automotive IVI requiring full quad-core headroom. |
Compared with MCIMX6Q6AVT10AC, MCIMX6Q4AVT10ACR removes VPU to cut power and cost while retaining full GPU and CPU capability; versus MCIMX6D4AVT10AC, it doubles core count and L2 cache for robust multitasking - making MCIMX6Q4AVT10ACR the optimal balance of graphics performance, CPU headroom, and automotive qualification for mid-tier infotainment.
Availability
MCIMX6Q4AVT10ACR is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply across extended product lifecycles and rigorous AEC-Q100-aligned manufacturing traceability.
Supply support for MCIMX6Q4AVT10ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and automotive safety/security IP.
The i.MX 6Quad family - including MCIMX6Q4AVT10ACR - was designed specifically for automotive infotainment and digital cockpit systems, emphasizing ASIL-B–capable functional safety features, hardware security, and multi-display graphics performance under extended temperature operation.
FAQ
What is the maximum operating frequency of the MCIMX6Q4AVT10ACR CPU cores?
The MCIMX6Q4AVT10ACR integrates four Arm Cortex-A9 cores rated for operation at 1 GHz under automotive temperature conditions (−40°C to +125°C junction). This frequency is guaranteed with a 24 MHz crystal input; using alternative clock sources may require validation per IMX6DQAEC Section 4.4 (PLL Electrical Characteristics).
Does the MCIMX6Q4AVT10ACR include a Video Processing Unit (VPU)?
No, the MCIMX6Q4AVT10ACR does not include a hardware Video Processing Unit. As confirmed in Table 1 of the IMX6DQAEC datasheet, the "4" in the part number denotes GPU-only configuration (no VPU), distinguishing it from "6" variants like MCIMX6Q6AVT10AC which include full 1080p encode/decode acceleration.
Which display interfaces are supported by the MCIMX6Q4AVT10ACR?
The MCIMX6Q4AVT10ACR supports five concurrent display interfaces: parallel RGB (24-bit, up to WUXGA), LVDS (dual-port, up to WUXGA), HDMI 1.4 (1080p60), MIPI DSI (2-lane, up to 1 Gbps), and internal LCD controller. Total raw pixel throughput reaches 450 Mpixels/sec at 24 bpp, enabling multi-display automotive clusters.
Is the MCIMX6Q4AVT10ACR qualified for automotive applications?
Yes, the MCIMX6Q4AVT10ACR carries the "A" temperature grade suffix, indicating qualification for automotive use from −40°C to +125°C junction temperature. It complies with AEC-Q100 stress test standards and includes automotive-specific interfaces such as dual FlexCAN, MLB150, and ESAI - documented in the i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors datasheet (IMX6DQAEC Rev. 6).
What security features are implemented in the MCIMX6Q4AVT10ACR?
The MCIMX6Q4AVT10ACR integrates TrustZone-enabled Arm Cortex-A9 cores, CAAM (Cryptographic Acceleration and Assurance Module) with NIST-certified PRNG and 16 KB secure RAM, SNVS (Secure Non-Volatile Storage), CSU (Central Security Unit), and A-HAB v4 (Advanced High Assurance Boot) supporting SHA-256, 2048-bit RSA, and version-controlled secure boot - all detailed in the i.MX 6Dual/6Quad Security Reference Manual (IMX6DQ6SDLSRM).
MCIMX6Q4AVT10ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q4AVT10ACR FAQ
1.How can I place an order for MCIMX6Q4AVT10ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q4AVT10ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q4AVT10ACR reliable?
The price and inventory of MCIMX6Q4AVT10ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q4AVT10ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6Q4AVT10ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q4AVT10ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q4AVT10ACR?
MCIMX6Q4AVT10ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q4AVT10ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q4AVT10ACR?
For technical support, including MCIMX6Q4AVT10ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q4AVT10ACR requirements.
6.How does Aetrix verify that MCIMX6Q4AVT10ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q4AVT10ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q4AVT10ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6Q4AVT10ACR?
All MCIMX6Q4AVT10ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q4AVT10ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q4AVT10ACR part is unused and in its original packaging.
Return procedure for MCIMX6Q4AVT10ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q4AVT10ACR Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

