NXP Semiconductors MCIMX6Q5EYM10AC

Overview

MCIMX6Q5EYM10AC from NXP Semiconductors is an industrial-grade quad-core Arm Cortex-A9 applications processor operating at 1.0 GHz, integrating VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode, 2D/3D graphics acceleration, and dual-camera image processing. It features a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface and supports HDMI 1.4, MIPI DSI/CSI-2, Gigabit Ethernet, PCIe v2.0, and dual FlexCAN - deployed in rugged HMI, medical imaging, and industrial automation systems.

For engineers reviewing the MCIMX6Q5EYM10AC datasheet, MCIMX6Q5EYM10AC pinout, MCIMX6Q5EYM10AC application, or MCIMX6Q5EYM10AC equivalent, key selection criteria include its -40°C to +105°C industrial temperature rating, FCPBGA 21×21 mm 0.8 mm pitch package, 1.0 GHz core frequency with TrustZone security, integrated CAAM cryptographic module, and support for dual independent display pipelines with up to 450 Mpixels/sec aggregate throughput.

Technical Context

The MCIMX6Q5EYM10AC implements a symmetric quad-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates boot ROM (96 KB), OCRAM (256 KB), and secure RAM (16 KB) on-die.

Its multimedia subsystem includes dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 decode/encode up to 1080p60, dual IPUv3H for real-time image scaling/compositing, GPU3Dv4 delivering up to 200 MTri/s, GPU2Dv2 for BitBLT operations, and GPUVGv2 for OpenVG 1.1 vector graphics - all coordinated via Smart DMA (SDMA) controller and AXI/AMBA interconnect fabric.

Key Specifications

Pinout & Package

MCIMX6Q5EYM10AC is housed in a 529-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and non-lidded construction (YM suffix). Pin assignments follow the standardized i.MX 6 series signal naming convention per IMX 6 Series Standardized Signal Name Map (EB792), with functional contact assignments documented in Section 6 of IMX6DQIEC Rev. 6.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6Q7CVT08AC, MCIMX6Q5EYM10AC delivers 25% higher CPU clock and eliminates thermal lid for lower profile mounting; versus MCIMX8M6DVP10AC, it provides superior dedicated video acceleration and mature industrial qualification, though lacks NPU and newer security enclave features.

Availability

MCIMX6Q5EYM10AC is available at Aetrix Electronics and suitable for industrial HMI, medical imaging terminals, railway infotainment systems, and smart energy gateways requiring stable component supply across extended product lifecycles.

Supply support for MCIMX6Q5EYM10AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The i.MX 6 series - including MCIMX6Q5EYM10AC - was engineered specifically for high-reliability industrial applications demanding real-time multimedia processing, extended temperature operation, and hardware-enforced security in resource-constrained environments.

FAQ

What is the maximum operating frequency of the MCIMX6Q5EYM10AC and under what conditions?

The MCIMX6Q5EYM10AC operates at a maximum frequency of 1.0 GHz under industrial temperature conditions (-40°C to +105°C junction), provided a 24 MHz input clock is supplied to the CLKIN pin. This clock is mandatory for USB PHY functionality and enables full-speed USB 2.0 OTG operation. The 1.0 GHz rating is validated per the i.MX 6Dual/6Quad Applications Processors for Industrial Products datasheet (IMX6DQIEC Rev. 6).

Does the MCIMX6Q5EYM10AC support secure boot, and which cryptographic algorithms are implemented in hardware?

Yes, the MCIMX6Q5EYM10AC supports Advanced High Assurance Boot (A-HABv4) with hardware-accelerated SHA-256 hashing and 2048-bit RSA signature verification. These functions are executed within the CAAM module, which also provides NIST-certified pseudo-random number generation and AES-128/256 encryption for runtime data protection. Secure boot integrity is enforced from Boot ROM through OS initialization.

What display interfaces does the MCIMX6Q5EYM10AC natively support, and what is the maximum combined pixel throughput?

The MCIMX6Q5EYM10AC natively supports HDMI 1.4, LVDS (dual-port), MIPI DSI (2-lane), and parallel RGB up to 24-bit. Its five display interfaces collectively deliver up to 450 Mpixels/sec at 24 bpp. For example, it can simultaneously drive WUXGA (1920×1200@60Hz = 225 Mpixels/sec) over LVDS and HD1080 (1920×1080@60Hz = 124 Mpixels/sec) over HDMI, leveraging dual IPUv3H units for real-time composition.

How many camera interfaces does the MCIMX6Q5EYM10AC provide, and what are their electrical specifications?

The MCIMX6Q5EYM10AC provides two independent camera interfaces: a 20-bit parallel CSI port supporting up to 240 MHz pixel clock, and a 4-lane MIPI CSI-2 receiver supporting up to 800 Mbps per lane (3.2 Gbps aggregate). Both interfaces feed into the dual IPUv3H subsystem for hardware-accelerated image processing, with dedicated SDMA channels enabling zero-copy frame transfers to DDR memory.

What is the package type and ball count of the MCIMX6Q5EYM10AC, and how does it differ from lidded variants?

The MCIMX6Q5EYM10AC uses a 529-ball FCPBGA package measuring 21 mm × 21 mm with 0.8 mm pitch and non-lidded construction (denoted by YM suffix). Unlike lidded VT-suffix variants (e.g., MCIMX6Q7CVT08AC), the YM package omits the metal heat spreader lid, resulting in lower profile and reduced thermal resistance from die to PCB, but requiring careful thermal pad design and heatsink integration for high-power 1.0 GHz operation.