NXP Semiconductors MCIMX6Q5EYM10ACR

Overview

MCIMX6Q5EYM10ACR from NXP Semiconductors is an industrial-grade quad-core Arm Cortex-A9 applications processor operating at 1.0 GHz, featuring integrated VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode and dual-display support. It integrates a 64-bit DDR3/DDR3L/LPDDR2-800 memory controller, Gigabit Ethernet, dual CAN, MIPI CSI-2/DSI, HDMI 1.4, and hardware security modules (CAAM, SNVS, TrustZone) - deployed in rugged HMI, industrial gateways, and medical imaging systems.

For engineers reviewing the MCIMX6Q5EYM10ACR datasheet, MCIMX6Q5EYM10ACR pinout, MCIMX6Q5EYM10ACR application, or MCIMX6Q5EYM10ACR equivalent, key selection criteria include confirmed 1.0 GHz core speed under industrial temperature (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, verified 1 MB shared L2 cache, and documented support for eMMC 4.41, NAND with 40-bit BCH ECC, and IEEE 1588-compliant ENET.

Technical Context

The MCIMX6Q5EYM10ACR implements a symmetric quad-core Arm Cortex-A9 MPCore platform with TrustZone, each core including 32 KB L1 instruction and data caches, private timers, and NEON MPE co-processors. The SoC integrates a unified 1 MB L2 cache, SCU, GIC supporting 128 interrupts, and dual 64-bit AXI master interfaces.

Its multimedia subsystem includes dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 decode/encode up to 1080p60, dual IPUv3H for image scaling/composition, GPU3Dv4 delivering up to 200 MTri/s, GPU2Dv2 for BitBLT operations, and GPUVGv2 for OpenVG 1.1 vector graphics - all operating independently of CPU cores to reduce system latency and power.

Key Specifications

Pinout & Package

MCIMX6Q5EYM10ACR is housed in a 21 mm × 21 mm FCBGA package with 624 solder balls and 0.8 mm pitch. Pin assignments follow the standardized i.MX 6 series signal naming convention (EB792), with functional contact mapping defined in Section 6 of IMX6DQIEC Rev. 6.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6Q5EYM10ACR, MCIMX6Q6AVT10ACR offers identical compute and media capability with automotive qualification overhead, while i.MX 8M Mini provides higher CPU throughput and AI features but removes hardware video encoding - making the former a spec-for-spec alternative and the latter a generational upgrade requiring architectural rework.

Availability

MCIMX6Q5EYM10ACR is available at Aetrix Electronics and suitable for industrial HMI, medical imaging edge nodes, and ruggedized gateways requiring stable component supply across extended product lifecycles and harsh environmental conditions.

Supply support for MCIMX6Q5EYM10ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based applications processors and edge AI.

The i.MX 6 series was designed specifically for industrial and embedded applications demanding high reliability, long-term availability, and hardware-enforced security - MCIMX6Q5EYM10ACR represents the quad-core, 1.0 GHz, industrial-temperature variant optimized for video-rich human interfaces and real-time control.

FAQ

What is the maximum guaranteed operating frequency of MCIMX6Q5EYM10ACR under industrial temperature conditions?

The MCIMX6Q5EYM10ACR is rated for guaranteed operation at 1.0 GHz across its full industrial junction temperature range of −40°C to +105°C, as confirmed by NXP's IMX6DQIEC Rev. 6 datasheet (Section 1.1, Table 1 footnote 3). This rating assumes use of the mandatory 24 MHz input clock and adherence to specified VDD_ARM/VDD_SOC voltage tolerances and thermal dissipation guidelines.

Does MCIMX6Q5EYM10ACR support hardware-accelerated video encoding for H.264?

Yes, MCIMX6Q5EYM10ACR includes a dedicated Video Processing Unit (VPU) that supports full hardware-accelerated H.264 BP/MP/HP encoding up to 1080p60 resolution, as documented in the i.MX 6Dual/6Quad Applications Processors for Industrial Products datasheet (IMX6DQIEC Rev. 6, Section 1.2). This offloads encoding from the CPU cores and maintains consistent frame rates under heavy system load.

What security features are integrated into MCIMX6Q5EYM10ACR for secure boot and runtime protection?

MCIMX6Q5EYM10ACR integrates multiple hardware security blocks: Advanced High Assurance Boot (A-HABv4) with SHA-256 and 2048-bit RSA verification, Cryptographic Acceleration and Assurance Module (CAAM) with NIST-certified RNG, Secure Non-Volatile Storage (SNVS) with SRTC, Central Security Unit (CSU), and Arm TrustZone. These collectively enforce authenticated boot, encrypted firmware updates, and isolated secure execution environments.

Which package type and pin count does MCIMX6Q5EYM10ACR use?

MCIMX6Q5EYM10ACR uses a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls and 0.8 mm pitch, as specified in the Package Information section of IMX6DQIEC Rev. 6. This lidded package is designed for industrial thermal management and mechanical robustness in high-vibration environments.

Can MCIMX6Q5EYM10ACR interface directly with eMMC 4.41 storage devices?

Yes, MCIMX6Q5EYM10ACR supports eMMC 4.41 via its uSDHC controllers, as explicitly listed in the "Multilevel memory system" feature description (IMX6DQIEC Rev. 6, Section 1.2). The SoC's eMMC interface complies with JEDEC Standard JESD84-B451 and supports HS400 mode for up to 200 MB/s read throughput when paired with compatible eMMC devices.