My Inquiry
My Account
NXP Semiconductors MCIMX6Q5EYM10ADR
- Part No.:
- MCIMX6Q5EYM10ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6Q5EYM10ADR.pdf
- Description:
- IC MPU I.MX6Q 1.0GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:792
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q5EYM10ADR from NXP Semiconductors is an industrial-grade quad-core Arm Cortex-A9 applications processor operating at 1.0 GHz, featuring integrated VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode, 2D/3D graphics acceleration, and image processing. It supports DDR3/DDR3L/LPDDR2-800 memory, HDMI 1.4, MIPI CSI-2/DSI, dual CAN, Gigabit Ethernet, and USB 2.0 OTG + 3 hosts - deployed in rugged HMI, industrial vision, and edge gateway systems.
For engineers reviewing the MCIMX6Q5EYM10ADR datasheet, MCIMX6Q5EYM10ADR pinout, MCIMX6Q5EYM10ADR application, or MCIMX6Q5EYM10ADR equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, quad-core 1.0 GHz operation with TrustZone, hardware-accelerated multimedia subsystems, and compliance with i.MX 6Dual/6Quad Industrial Products specification IMX6DQIEC Rev. 6.
Technical Context
The MCIMX6Q5EYM10ADR implements a symmetric quad-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data cache per core, 1 MB shared L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU (H.264/VC-1/MPEG-4 decode up to 1080p60), dual IPUv3H for camera pipeline processing, and GPU3Dv4 delivering up to 200 MTri/s.
Power management includes integrated LDOs, dynamic voltage and frequency scaling (DVFS), software state retention, power gating, and thermal monitoring via on-die sensor. Memory subsystem supports 64-bit DDR3/DDR3L-1066, LPDDR2-800, NAND Flash with BCH up to 40-bit ECC, NOR/PSRAM, and eMMC 4.41 - all managed by the Multi-Mode DDR Controller (MMDC) and GPMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad Arm Cortex-A9 @ 1.0 GHz (industrial grade, −40°C to +105°C junction) |
| Graphics Acceleration | GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2 (BitBLT/stretched BLT), GPUVGv2 (OpenVG 1.1) |
| Video Processing | VPU supporting H.264/VC-1/MPEG-4 decode & encode up to 1080p60; dual IPUv3H for real-time ISP pipeline |
| Memory Interface | 64-bit DDR3/DDR3L-1066 or LPDDR2-800; 8-bit NAND with BCH 40-bit ECC; eMMC 4.41 support |
| Connectivity | HDMI 1.4 Tx, MIPI CSI-2 (4-lane, 800 Mbps/lane), MIPI DSI (1 Gbps/lane), dual FlexCAN 1 Mbps, 10/100/1000 ENET (IEEE 1588) |
| USB | 1× HS USB 2.0 OTG (PHY-integrated), 3× HS USB 2.0 hosts (1 with PHY, 2 with HS-IC PHY) |
| Security | Arm TrustZone, CAAM (16 KB secure RAM, NIST-certified PRNG), SNVS, A-HAB v4 (SHA-256, 2048-bit RSA) |
Pinout & Package
MCIMX6Q5EYM10ADR is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 I/O balls and 0.8 mm ball pitch. The package is non-lidded (YM suffix) and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V nominal supply for Arm Cortex-A9 cores and L1/L2 cache; requires tight regulation (±30 mV) |
| VDD_SOC | System-on-Chip Power | 1.1 V nominal supply for MMDC, GPC, CCM, and most digital logic; critical for DDR timing stability |
| VDDA_3P3 | Analog I/O Supply | 3.3 V analog rail powering USB PHY, HDMI TMDS, and analog ADC references; low-noise design required |
| BOOT_MODE[1:0] | Boot Configuration | Strapped inputs determining boot source (eMMC, NAND, SPI NOR, SD); must be stable during POR |
| ENET_REF_CLK | Ethernet Reference Clock | 125 MHz differential clock input for Gigabit Ethernet MAC; sourced externally or from internal PLL |
| CSI_MCLK / CSI_DATA[7:0] | Parallel Camera Interface | 20-bit parallel camera port supporting up to 240 MHz pixel clock; supports BT.656/BT.1120 protocols |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Hardware-managed DVFS and power gating across CPU, GPU, VPU, and memory domains to minimize active/idle power without software overhead |
| Multi-Standard Video Codec | Dedicated VPU enables simultaneous decode of two 1080p30 streams or encode+decode of one 1080p60 stream - offloading CPU and reducing thermal load |
| Dual Independent IPUv3H | Each IPU handles full camera pipeline (demosaic, color correction, gamma, scaling, rotation) in parallel - enabling dual-sensor stereo vision or multi-camera fusion |
| Secure Boot & Runtime Integrity | A-HAB v4 with SHA-256 signature verification, encrypted image loading, and CAAM-backed key storage prevents unauthorized firmware execution and runtime tampering |
| Industrial Temperature Support | Qualified for continuous operation from −40°C to +105°C junction temperature - validated across voltage, frequency, and process corners per IMX6DQIEC spec |
Applications
| Industrial HMI | Machine Vision Gateway |
|---|---|
Use Scenario: Rugged panel PC in factory automation requiring real-time visualization, multi-touch GUI, and PLC integration. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based HMI stack, driving dual LVDS displays and decoding live camera feeds for quality inspection overlay. Use Value: GPU3Dv4 renders OpenGL ES 2.0 UI at 60 fps while VPU processes 1080p video analytics - eliminating need for external FPGA or DSP co-processor. |
Use Scenario: Edge gateway aggregating data from multiple high-resolution cameras and sensors in smart manufacturing cell. IC Role / Device Role / Timing Role: Central SoC managing four MIPI CSI-2 camera inputs, running inference on ARM NEON, and forwarding metadata over Gigabit Ethernet with IEEE 1588 time stamping. Use Value: Dual IPUv3H performs real-time de-bayering and lens correction on two 5 MP sensors simultaneously - enabling sub-millisecond latency for closed-loop control. |
| Railway Infotainment Terminal | Medical Imaging Display |
Use Scenario: Passenger information system in rolling stock with HDMI output to LCD, audio playback, and GPS/Wi-Fi connectivity. IC Role / Device Role / Timing Role: Applications processor hosting Android Automotive OS, driving HDMI 1.4 display, decoding MPEG-2 transport streams, and managing secure OTA updates. Use Value: CAAM and SNVS provide hardware-enforced secure boot and encrypted storage - meeting EN 50155 Class TX vibration/temperature requirements for rail deployment. |
Use Scenario: Portable ultrasound display unit requiring low-latency rendering of DICOM-compliant grayscale images and real-time Doppler overlays. IC Role / Device Role / Timing Role: Real-time imaging processor handling raw sensor data from ADC, applying beamforming in GPU2Dv2, and compositing UI with OpenVG 1.1 acceleration. Use Value: GPUVGv2 delivers anti-aliased vector graphics and Bezier curve tesselation at 60 fps - ensuring smooth pan/zoom interaction on medical-grade displays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q6AVT10AC | Same quad-core Cortex-A9, 1.0 GHz, but automotive-grade (−40°C to +125°C) and lidded FCPBGA package | Targeted for automotive infotainment; includes MLB interface not present in MCIMX6Q5EYM10ADR | Select when AEC-Q100 qualification, extended temperature margin, or lid-based thermal solution is required |
| MCIMX6D5EYM10ADR | Dual-core variant (2× Cortex-A9 @ 1.0 GHz), identical package, same industrial temp grade and peripheral set | Lower TDP (~2.5 W vs ~3.5 W typical), reduced graphics throughput, suitable for cost-sensitive or thermally constrained designs | Select when application workload fits dual-core performance envelope and BOM cost reduction is prioritized |
Compared with MCIMX6Q6AVT10AC, MCIMX6Q5EYM10ADR offers lower-cost industrial qualification and non-lidded packaging; compared with MCIMX6D5EYM10ADR, it delivers 2× CPU throughput and full quad-core multimedia acceleration - making it optimal for high-performance industrial edge nodes where thermal headroom permits.
Availability
MCIMX6Q5EYM10ADR is available at Aetrix Electronics and suitable for industrial HMI, machine vision gateways, railway infotainment terminals, and medical imaging displays requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6Q5EYM10ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6 series - including MCIMX6Q5EYM10ADR - was designed as a high-performance, low-power applications processor family for industrial and embedded systems requiring rich multimedia, real-time processing, and hardware security.
FAQ
What is the maximum operating frequency of the MCIMX6Q5EYM10ADR under industrial temperature conditions?
The MCIMX6Q5EYM10ADR is rated for 1.0 GHz operation across its full industrial temperature range of −40°C to +105°C junction temperature, as specified in the IMX6DQIEC Rev. 6 datasheet. This frequency is achievable using a 24 MHz crystal reference clock and verified with DDR3-1066 memory timing constraints. The MCIMX6Q5EYM10ADR maintains this speed without throttling when thermal design meets NXP's recommended PCB layout and heatsink guidelines.
Does the MCIMX6Q5EYM10ADR support HDMI 2.0 or only HDMI 1.4?
The MCIMX6Q5EYM10ADR supports HDMI 1.4 only, as confirmed in Section 1.2 and Figure 2 of the IMX6DQIEC Rev. 6 datasheet. Its HDMI transmitter block implements HDMI 1.4 features including 3D frame packing, audio return channel (ARC), and 1080p60 video output. HDMI 2.0 capabilities such as 4K@60Hz or HDR are not supported - those require later-generation i.MX 8 series processors.
Can the MCIMX6Q5EYM10ADR boot directly from eMMC 5.0 or is it limited to eMMC 4.41?
The MCIMX6Q5EYM10ADR supports eMMC up to revision 4.41 only, as explicitly stated in Section 1.2 of the IMX6DQIEC Rev. 6 datasheet. While eMMC 5.0 is backward compatible at electrical and command levels, the MCIMX6Q5EYM10ADR's ROM bootloader does not implement eMMC 5.0-specific features like HS400 mode or enhanced strobe timing. For reliable boot, use eMMC 4.41 devices qualified per JEDEC JESD84-B451.
How many MIPI CSI-2 lanes does the MCIMX6Q5EYM10ADR support, and what is the maximum data rate per lane?
The MCIMX6Q5EYM10ADR supports one MIPI CSI-2 receiver with up to four data lanes and one clock lane, as documented in Table 2 and Section 1.2 of the IMX6DQIEC Rev. 6 datasheet. Maximum data rate is 800 Mbps per lane in 4-lane mode, or 1 Gbps per lane in 1–3 lane configurations. Total aggregate bandwidth reaches 3.2 Gbps, sufficient for dual 1080p30 camera inputs with RAW10 format.
Is the MCIMX6Q5EYM10ADR pin-compatible with other i.MX 6Quad variants such as MCIMX6Q7CVT08AC?
Yes, the MCIMX6Q5EYM10ADR is pin-compatible with all i.MX 6Quad FCPBGA-624 variants including MCIMX6Q7CVT08AC, as confirmed by the unified ball map in Section 6.2 of IMX6DQIEC Rev. 6. All share identical 21 mm × 21 mm footprint, 0.8 mm pitch, and signal-to-ball assignment - enabling drop-in replacement for frequency, temperature grade, or fuse option changes without PCB redesign.
MCIMX6Q5EYM10ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q5EYM10ADR FAQ
1.How can I place an order for MCIMX6Q5EYM10ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q5EYM10ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q5EYM10ADR reliable?
The price and inventory of MCIMX6Q5EYM10ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q5EYM10ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6Q5EYM10ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q5EYM10ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q5EYM10ADR?
MCIMX6Q5EYM10ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q5EYM10ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q5EYM10ADR?
For technical support, including MCIMX6Q5EYM10ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q5EYM10ADR requirements.
6.How does Aetrix verify that MCIMX6Q5EYM10ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q5EYM10ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q5EYM10ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6Q5EYM10ADR?
All MCIMX6Q5EYM10ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q5EYM10ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q5EYM10ADR part is unused and in its original packaging.
Return procedure for MCIMX6Q5EYM10ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q5EYM10ADR Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
