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NXP Semiconductors MCIMX6Q5EYM10AE
- Part No.:
- MCIMX6Q5EYM10AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6Q5EYM10AE.pdf
- Description:
- IC MPU I.MX6Q 1.0GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:169
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Product details
Overview
MCIMX6Q5EYM10AE from NXP Semiconductors is an industrial-grade quad-core Arm Cortex-A9 applications processor operating at 1.0 GHz, integrating VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode, 2D/3D graphics acceleration, and dual-camera processing. It features a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface and supports HDMI 1.4, MIPI CSI-2/DSI, Gigabit Ethernet, PCIe v2.0, and dual FlexCAN for embedded industrial HMI and edge gateway systems.
For engineers reviewing the MCIMX6Q5EYM10AE datasheet, MCIMX6Q5EYM10AE pinout, MCIMX6Q5EYM10AE application, or MCIMX6Q5EYM10AE equivalent, key selection criteria include industrial temperature range (−40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, 1 MB shared L2 cache, TrustZone-enabled security architecture, and verified support for Linux Yocto and Android BSPs.
Technical Context
The MCIMX6Q5EYM10AE implements a symmetric quad-core Arm Cortex-A9 MPCore platform with per-core 32 KB L1 instruction and data caches, unified 1 MB L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP), dual IPUv3H for image scaling/compositing, and CAAM with 16 KB secure RAM and NIST-certified PRNG.
Its system-level architecture includes MMDC supporting DDR3-1066/DDR3L-1066/LPDDR2-800, GPMI with BCH40 ECC for NAND Flash, ASRC for multi-channel audio sample rate conversion, and clock management via eight PLLs with CCM-controlled gating. Power management leverages DVFS, software state retention, and power gating across CPU, MPE, and peripheral domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 1.0 GHz max (industrial grade with 24 MHz reference clock) |
| L2 Cache | 1 MB unified, shared across all four cores - enables coherent multi-threaded execution without external cache coherency logic |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - supports up to 4 GB DRAM with interleaving and low-latency access for multimedia workloads |
| Graphics Units | GPU3Dv4 (200 MTri/s, OpenGL ES 2.0), GPU2Dv2 (BitBLT/stretched BLT), GPUVGv2 (OpenVG 1.1) - enables concurrent UI rendering, video overlay, and vector graphics |
| Video Acceleration | VPU with H.264 BP/MP/HP decode up to 1080p60, encode up to 1080p30 - offloads full HD video processing from CPU, reducing thermal load |
| Security Features | Arm TrustZone, CAAM (16 KB secure RAM, AES-128/256, SHA-256, RSA-2048), SNVS with SRTC, A-HABv4 boot - enables secure boot, encrypted storage, and DRM-compliant content playback |
| Industrial Temp Range | −40°C to +105°C junction - qualified for continuous operation in harsh environments without derating |
| Package | FCPBGA-624, 21 mm × 21 mm, 0.8 mm pitch, lidded - compatible with standard industrial PCB assembly processes and thermal management solutions |
Pinout & Package
MCIMX6Q5EYM10AE is housed in a 21 mm × 21 mm FCPBGA package with 624 solder balls and 0.8 mm pitch. The package is lidded for enhanced thermal dissipation and mechanical protection in industrial deployments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling for stable 1.0 GHz operation |
| VDD_SOC | SoC logic voltage | 1.35 V ±3% supply for L2 cache, MMDC, and interconnect fabric - critical for DDR timing margin and cache coherency |
| VDDA_3V3 | Analog I/O supply | 3.3 V ±5% for USB PHY, HDMI TMDS, and analog peripherals - must be isolated from digital noise sources |
| BOOT_MODE[1:0] | Boot configuration | Strapped inputs determining boot device priority (eMMC, NAND, SPI NOR, SD) - defines initial firmware load path and security policy |
| ENET_REF_CLK | Ethernet reference clock | 125 MHz differential input for IEEE 1588-capable Gigabit Ethernet MAC - enables precise time synchronization in industrial networks |
| CSI0_DAT[7:0] | Parallel camera interface | 8-bit bidirectional data bus for CMOS sensor interfacing at up to 240 MHz - supports raw Bayer or YUV capture without frame buffer overhead |
| HDMI_TX_D[2:0] | HDMI TMDS data lanes | Differential outputs for HDMI 1.4 video transport - require controlled impedance routing (100 Ω differential) and ESD protection |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power management across CPU, GPU, VPU, and peripherals - reduces active power by >40% vs. fixed-frequency operation while maintaining real-time responsiveness |
| Dual IPUv3H Image Processors | Independent hardware scalers, rotators, and compositors - enable simultaneous display output (e.g., LVDS + HDMI) and camera preview with zero CPU load |
| ASRC with 10-channel concurrency | Hardware-accelerated asynchronous sample rate conversion - eliminates software resampling latency for multi-source audio (e.g., VoIP + local mic + SPDIF) |
| PCIe v2.0 x1 Root/Endpoint mode | Configurable high-speed expansion interface - supports direct attachment of industrial I/O modules (e.g., CAN FD gateways, FPGA accelerators) without bridge chips |
| CAAM Cryptographic Engine | On-the-fly AES-256 encryption/decryption and SHA-256 hashing - enables secure firmware updates and encrypted data logging without CPU intervention |
| FlexCAN v2.0 B with 1 Mbps | Dual CAN controllers compliant with ISO 11898-1 - provide deterministic, fault-tolerant communication for factory automation and vehicle subsystems |
Applications
| Industrial HMI Panel | Edge Gateway Controller |
|---|---|
Use Scenario: Rugged touchscreen panel in manufacturing cell monitoring, operating continuously at 60°C ambient with vibration and EMI exposure. IC Role / Device Role / Timing Role: Main applications processor executing Qt-based UI, decoding live camera feeds from machine vision sensors, and driving dual LVDS displays at WUXGA resolution. Use Value: Integrated GPU3Dv4 and dual IPUv3H eliminate need for discrete graphics, while −40°C to +105°C rating ensures reliability without forced cooling or derating. | Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, CAN bus, and OPC UA data for cloud telemetry in smart grid substations. IC Role / Device Role / Timing Role: Central compute node running real-time Linux, managing multiple protocol stacks, performing local analytics, and securing data with CAAM before TLS transmission. Use Value: Dual FlexCAN + Gigabit Ethernet + PCIe enables native fieldbus connectivity and high-throughput backhaul, while TrustZone isolates secure boot and crypto operations from application code. |
| Medical Imaging Terminal | Ruggedized In-Vehicle Infotainment |
Use Scenario: Portable ultrasound console requiring real-time beamforming preprocessing, DICOM image rendering, and HIPAA-compliant data export over encrypted USB. IC Role / Device Role / Timing Role: High-performance SoC handling raw sensor data ingestion via parallel camera interface, GPU-accelerated image enhancement, and secure file transfer via USB OTG. Use Value: VPU-accelerated JPEG2000 compression and CAAM-secured USB mass storage meet FDA cybersecurity guidance without adding discrete crypto ICs. | Use Scenario: In-cab fleet management terminal exposed to automotive temperature cycling (−40°C to +85°C) and conducted EMI per ISO 11452-4. IC Role / Device Role / Timing Role: Applications processor running Android Automotive OS, driving HDMI-connected rear-seat displays, processing dual MIPI camera inputs for ADAS alerts, and managing Bluetooth/Wi-Fi connectivity. Use Value: Industrial-grade thermal spec (−40°C to +105°C) exceeds automotive requirements, and integrated HDMI 1.4 + MIPI CSI-2 reduce BOM count versus discrete interface bridges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q6AVT10AD | Same i.MX 6Quad core, 1.0 GHz, but automotive-grade (−40°C to +125°C) with MLB option enabled; identical FCPBGA-624 package | Targeted for automotive infotainment with AEC-Q100 qualification and mandatory MLB (Media Link Bus) support for audio/video bridging | Select when AEC-Q100 compliance and MLB interface for legacy audio domain controllers are required |
| MCIMX8M6CVTKZAA | Next-generation i.MX 8M Mini with Arm Cortex-A53 quad-core (1.8 GHz), integrated LPDDR4 controller, and updated GPU (Vivante GC7000UL), but different pinout and software stack | Designed for cost-sensitive consumer and industrial IoT with higher IPC, lower static power, and native support for Android 11+ and Wayland | Select when migrating to newer BSP ecosystem, requiring LPDDR4 support, or needing improved single-thread performance and AI inference acceleration |
Compared with MCIMX6Q5EYM10AE, MCIMX6Q6AVT10AD offers extended temperature and automotive-specific features but no performance gain, while MCIMX8M6CVTKZAA delivers higher CPU throughput and modern memory support at the cost of software migration effort and non-pin-compatible layout changes.
Availability
MCIMX6Q5EYM10AE is available at Aetrix Electronics and suitable for industrial HMI, edge gateways, medical imaging terminals, and ruggedized in-vehicle infotainment systems requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6Q5EYM10AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based applications processors and edge AI.
The i.MX 6 series, including MCIMX6Q5EYM10AE, was designed specifically for industrial and embedded applications demanding long-term availability, extended temperature operation, and hardware-enforced security - not general-purpose computing.
FAQ
What is the maximum operating frequency of the MCIMX6Q5EYM10AE under industrial temperature conditions?
The MCIMX6Q5EYM10AE is rated for 1.0 GHz operation across its full industrial temperature range of −40°C to +105°C junction, provided a 24 MHz crystal reference clock is used. This frequency is validated per NXP's IMX6DQIEC datasheet Rev. 6 and confirmed in Table 6 of the electrical characteristics section. Performance remains stable without throttling under sustained thermal load when proper PCB thermal design is implemented.
Does the MCIMX6Q5EYM10AE support secure boot with cryptographic verification?
Yes, the MCIMX6Q5EYM10AE implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, version control, and warm boot support. Secure boot is enforced by the HAB ROM code and configured via eFUSEs through the CSU. The CAAM module provides the cryptographic engine, and the SNVS subsystem safeguards keys and the secure RTC - all documented in the i.MX 6Dual/6Quad Security Reference Manual (IMX6DQ6SDLSRM).
Which display interfaces are supported natively by the MCIMX6Q5EYM10AE without external bridge ICs?
The MCIMX6Q5EYM10AE supports HDMI 1.4 (up to 1080p60), parallel RGB (24-bit, up to WUXGA), LVDS (dual-port, up to WUXGA), and MIPI DSI (1–4 lanes, up to 1 Gbps/lane) directly from on-die controllers. All are electrically compatible with standard display panels and require only passive termination and proper layout - no external level shifters or protocol translators are needed for basic operation.
Can the MCIMX6Q5EYM10AE interface with both DDR3 and LPDDR2 memory simultaneously?
No, the MCIMX6Q5EYM10AE uses a single Multi-Mode DDR Controller (MMDC) that supports DDR3, DDR3L, or LPDDR2 - but only one memory type can be populated and initialized at boot. The MMDC does not support concurrent dual-channel operation across different memory technologies. Memory type selection is determined at runtime via boot configuration and cannot be mixed within the same system design.
What is the function of the BOOT_MODE pins on the MCIMX6Q5EYM10AE, and how are they configured?
The BOOT_MODE[1:0] pins on the MCIMX6Q5EYM10AE are strapping inputs sampled at reset to determine the primary boot device (eMMC, NAND Flash, SPI NOR, or SD card) and associated configuration (e.g., 8-bit vs. 4-bit eMMC). They are hardwired to VDD or GND using resistors during PCB design - no dynamic reconfiguration is possible after boot. Configuration details and timing requirements are specified in Section 5.1 of the IMX6DQIEC datasheet Rev. 6.
MCIMX6Q5EYM10AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q5EYM10AE FAQ
1.How can I place an order for MCIMX6Q5EYM10AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q5EYM10AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q5EYM10AE reliable?
The price and inventory of MCIMX6Q5EYM10AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q5EYM10AE is usually 5 days.
3.What payment methods are accepted for MCIMX6Q5EYM10AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q5EYM10AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q5EYM10AE?
MCIMX6Q5EYM10AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q5EYM10AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q5EYM10AE?
For technical support, including MCIMX6Q5EYM10AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q5EYM10AE requirements.
6.How does Aetrix verify that MCIMX6Q5EYM10AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q5EYM10AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q5EYM10AE meets industry standards.
7.What is the process for return or replacement of MCIMX6Q5EYM10AE?
All MCIMX6Q5EYM10AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q5EYM10AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q5EYM10AE part is unused and in its original packaging.
Return procedure for MCIMX6Q5EYM10AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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