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NXP Semiconductors MCIMX6Q5EYM12AD
- Part No.:
- MCIMX6Q5EYM12AD
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6Q5EYM12AD.pdf
- Description:
- IC MPU I.MX6Q 1.2GHZ 624FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,650
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Product details
Overview
MCIMX6Q5EYM12AD from NXP Semiconductors is an industrial-grade quad-core Arm Cortex-A9 applications processor operating at 1.2 GHz, integrating VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode, 2D/3D graphics acceleration, and dual-camera image processing. It features a 64-bit DDR3/DDR3L/LPDDR2-800 memory interface and supports HDMI 1.4, MIPI DSI/CSI-2, Gigabit Ethernet, PCIe 2.0, and dual FlexCAN for embedded industrial HMI, machine vision, and edge gateway systems.
For engineers reviewing the MCIMX6Q5EYM12AD datasheet, MCIMX6Q5EYM12AD pinout, MCIMX6Q5EYM12AD application, or MCIMX6Q5EYM12AD equivalent, key selection criteria include its 1.2 GHz industrial temperature rating (–40°C to +105°C), FCPBGA-624 package with 0.8 mm pitch, integrated CAAM cryptographic engine, and support for secure boot via A-HAB v4 with SHA-256 and 2048-bit RSA.
Technical Context
The MCIMX6Q5EYM12AD implements a symmetric quad-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor. Its SoC-level memory system includes 256 KB OCRAM, 96 KB boot ROM with HAB, and 16 KB secure RAM within CAAM.
It integrates dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 decode up to 1080p60, dual IPUv3H for real-time image scaling and color space conversion, ASRC for concurrent multi-channel audio sample rate conversion, and GPMI with BCH40 ECC for NAND flash reliability. Clocking relies on eight PLLs and on-chip oscillators including XTALOSC and OSC32K.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 1.2 GHz max - enables parallel OS task execution and real-time deterministic response in Linux/Yocto-based industrial controllers. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2-800 - supports up to 4 GB external RAM with interleaving for sustained bandwidth >12.8 GB/s in multimedia pipelines. |
| Graphics Acceleration | GPU3Dv4 (200 MTri/s), GPU2Dv2, GPUVGv2 - delivers OpenGL ES 2.0 rendering and OpenVG 1.1 vector graphics for responsive GUIs on dual HD displays. |
| Video Processing | VPU + dual IPUv3H - enables simultaneous 1080p60 decode + encode + image enhancement (deinterlacing, noise reduction) without CPU load. |
| Security Engine | CAAM with 16 KB secure RAM, NIST-certified PRNG, AES/SHA/RSA acceleration - provides hardware-rooted trust for secure boot, DRM, and encrypted firmware updates. |
| Industrial Temp Range | –40°C to +105°C junction - qualified for continuous operation in uncooled factory automation, railway, and energy metering environments. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch - standard BGA footprint compatible with automated SMT assembly and thermal vias for high-power dissipation. |
Pinout & Package
MCIMX6Q5EYM12AD is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls and 0.8 mm pitch. The package is lidded and RoHS-compliant, optimized for thermal dissipation in industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling to maintain timing integrity at 1.2 GHz. |
| VDD_SOC | SoC Logic Power | 1.35 V ±3% supply for L2 cache, MMDC, and interconnect fabric - critical for DDR3/LPDDR2 interface stability and bus throughput. |
| CLKIN_24M | Primary Reference Clock Input | 24 MHz crystal oscillator input - mandatory for USB PHY operation and used as base clock for multiple PLLs including ARM, SOC, and VPU domains. |
| BOOT_MODE[1:0] | Boot Configuration Pins | Strapped at power-on to select boot device (eMMC, NAND, SPI NOR, SD card) - determines initial firmware load path and security policy enforcement. |
| ENET_RXD[3:0] | Gigabit Ethernet Receive Data | LVDS-compatible differential inputs for 10/100/1000 Mbps ENET - routed with controlled impedance (100 Ω differential) to meet IEEE 802.3 timing budgets. |
| CSI_DATA[7:0] | Parallel Camera Interface Data | 8-bit CMOS camera sensor data bus - supports up to 240 MHz pixel clock for high-speed machine vision capture with minimal latency. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across CPU, GPU, VPU, and memory domains - reduces active power by up to 40% during partial-load operation while maintaining real-time responsiveness. |
| A-HAB v4 Secure Boot | Hardware-enforced chain of trust using SHA-256 hash verification and 2048-bit RSA signature validation - prevents unauthorized firmware execution and ensures field-upgrade authenticity. |
| Multi-Standard Video Codec | H.264, VC-1, MPEG-2/4, VP8 decode and H.264 encode up to 1080p60 - eliminates need for external video ASICs in digital signage and IP camera systems. |
| ASRC with 10-Channel Concurrency | Independent asynchronous sample rate conversion for up to 10 audio streams - enables mixed-clock audio routing (e.g., 44.1 kHz codec ↔ 48 kHz DSP) without software resampling artifacts. |
| PCIe 2.0 x1 Root/Endpoint Mode | Full Gen2 link negotiation and configuration space access - allows direct attachment of industrial I/O expansion cards (e.g., CAN FD, isolated DI/DO) without bridge chips. |
Applications
| Industrial HMI | Machine Vision Edge Node |
|---|---|
|
Use Scenario: Touch-enabled operator interface for PLC-controlled packaging lines with dual 1080p displays and real-time alarm logging. IC Role / Device Role / Timing Role: Main applications processor executing Qt-based GUI, managing HDMI/LVDS display outputs, and coordinating serial I/O via UART/I2C. Use Value: Integrated GPU3Dv4 and dual IPUv3H enable smooth 60 Hz UI rendering and overlay of live camera feeds without frame drops or CPU saturation. |
Use Scenario: On-machine inspection system capturing 2 MP images at 30 fps from two synchronized area scan cameras. IC Role / Device Role / Timing Role: Vision processing hub running OpenCV on Linux, performing real-time blob detection and OCR using VPU-accelerated pre-processing. Use Value: CSI-2 interface with 4-lane 800 Mbps/lane support and hardware ASRC allow precise timestamp alignment and audio-video sync for audit trails. |
| Railway Onboard Gateway | Energy Metering Data Concentrator |
|
Use Scenario: EN50155-compliant train network node aggregating CAN, RS485, and wireless telemetry from subsystems to cloud. IC Role / Device Role / Timing Role: Secure communications gateway with dual FlexCAN, Gigabit Ethernet, and eMMC-based firmware storage. Use Value: CAAM cryptographic engine enables TLS 1.2 offload and secure key storage, meeting EN50155 cybersecurity requirements without software crypto overhead. |
Use Scenario: DIN-rail mounted smart meter concentrator collecting AMI data from 100+ sub-meters via RS485 and transmitting via LTE. IC Role / Device Role / Timing Role: Real-time data aggregator with SNVS-RTC for tamper-proof time-stamping and secure boot ensuring firmware integrity. Use Value: Industrial temperature grade and SNVS-backed RTC guarantee accurate billing timestamps and fail-safe operation during extended power outages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q6AVT10AC | 1.0 GHz max frequency, –40°C to +105°C, same FCPBGA-624 package - lower clock speed but identical feature set and pinout. | Suitable for cost-sensitive industrial HMIs where 1.2 GHz headroom is unnecessary; retains full VPU/GPU/IPU functionality. | Select when thermal budget or BOM cost constraints prioritize lower power over peak compute throughput. |
| i.MX 8M Mini (NXP MMIMX8MQ5CZND8AB) | Quad-core Cortex-A53 + Cortex-M4, 1.8 GHz A53, 2 GB LPDDR4, 28 nm process - newer architecture with higher IPC, AI inference acceleration (NN accelerator), and improved power efficiency. | Better suited for next-gen edge AI gateways requiring TensorFlow Lite Micro or voice wake-word detection alongside traditional HMI functions. | Choose for new designs targeting long-term roadmap continuity, enhanced security (ARM TrustZone + SECO), and future-proofing beyond i.MX 6 lifecycle. |
Compared with MCIMX6Q5EYM12AD, MCIMX6Q6AVT10AC offers identical peripheral integration and industrial qualification at reduced clock speed and power, while i.MX 8M Mini delivers architectural advancement with AI acceleration and modern memory subsystems - making it ideal for designs requiring both legacy compatibility and forward-looking capabilities.
Availability
MCIMX6Q5EYM12AD is available at Aetrix Electronics and suitable for industrial HMI, machine vision edge nodes, railway onboard gateways, and energy metering data concentrators requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6Q5EYM12AD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based SoCs and embedded security.
The i.MX 6 series was designed specifically for high-reliability industrial applications demanding rich multimedia, real-time control, and hardware-enforced security - positioning MCIMX6Q5EYM12AD as a foundational processor for mission-critical edge systems.
FAQ
What is the maximum operating frequency of the MCIMX6Q5EYM12AD and under what conditions?
The MCIMX6Q5EYM12AD operates at a maximum frequency of 1.2 GHz, validated for industrial temperature range (–40°C to +105°C). This speed assumes use of a 24 MHz reference clock and compliance with specified VDD_ARM (1.2 V) and VDD_SOC (1.35 V) supply tolerances. Performance is sustained under thermal design power (TDP) limits defined in the IMX6DQIEC datasheet Rev. 6.
Does the MCIMX6Q5EYM12AD support secure boot, and how is it implemented?
Yes, the MCIMX6Q5EYM12AD implements Advanced High Assurance Boot (A-HAB) v4 with SHA-256 hashing, 2048-bit RSA signature verification, and version control. Secure boot is enforced by the Hardware Abstraction Block (HAB) in boot ROM, which validates signed firmware images before loading into OCRAM. CAAM and SNVS provide secure key storage and tamper-resistant RTC.
Which display interfaces does the MCIMX6Q5EYM12AD support, and what are their maximum resolutions?
The MCIMX6Q5EYM12AD supports HDMI 1.4 (up to 1080p60), parallel RGB (24-bit, up to WUXGA 1920×1200@60 Hz), LVDS (dual-port, up to WUXGA@60 Hz), and MIPI DSI (1 Gbps/lane, up to 1080p60). Total raw pixel throughput across all active interfaces is capped at 450 Mpixels/sec at 24 bpp, enabling dual-display configurations.
Can the MCIMX6Q5EYM12AD interface directly with NAND flash, and what ECC capabilities does it provide?
Yes, the MCIMX6Q5EYM12AD integrates the General Purpose Media Interface (GPMI) supporting 8-bit NAND flash with BCH40 error correction - capable of correcting up to 40 bits per 1 KB page. It supports Raw MLC/SLC, ONFI 2.2, and eMMC 4.41, with configurable timing for legacy and high-speed NAND devices.
What is the package type and ball count of the MCIMX6Q5EYM12AD, and are thermal vias recommended?
The MCIMX6Q5EYM12AD uses a lidded FCPBGA-624 package measuring 21 mm × 21 mm with 0.8 mm pitch. Thermal vias beneath the exposed thermal pad are strongly recommended per NXP's hardware design guide AN4948 to achieve ≤30°C/W junction-to-board thermal resistance in industrial ambient conditions.
MCIMX6Q5EYM12AD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.2GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q5EYM12AD FAQ
1.How can I place an order for MCIMX6Q5EYM12AD through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q5EYM12AD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q5EYM12AD reliable?
The price and inventory of MCIMX6Q5EYM12AD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q5EYM12AD is usually 5 days.
3.What payment methods are accepted for MCIMX6Q5EYM12AD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q5EYM12AD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q5EYM12AD?
MCIMX6Q5EYM12AD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q5EYM12AD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q5EYM12AD?
For technical support, including MCIMX6Q5EYM12AD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q5EYM12AD requirements.
6.How does Aetrix verify that MCIMX6Q5EYM12AD is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q5EYM12AD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q5EYM12AD meets industry standards.
7.What is the process for return or replacement of MCIMX6Q5EYM12AD?
All MCIMX6Q5EYM12AD units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q5EYM12AD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q5EYM12AD part is unused and in its original packaging.
Return procedure for MCIMX6Q5EYM12AD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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