NXP Semiconductors MCIMX6Q5EZK08AE
- Part No.:
- MCIMX6Q5EZK08AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 569-LFBGA
- Datasheet:
-
MCIMX6Q5EZK08AE.pdf
- Description:
- IC MPU I.MX6Q 800MHZ 569MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6Q5EZK08AE from NXP Semiconductors is a quad-core Arm Cortex-A9 applications processor operating at 800 MHz, featuring integrated VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, dual IPUv3H, and CAAM cryptographic acceleration. It supports LPDDR2-800 memory, HDMI 1.4, MIPI CSI-2/DSI, Gigabit Ethernet, and USB 2.0 OTG + 3 hosts - designed for high-end portable media players with HD video playback and secure content delivery.
For engineers reviewing the MCIMX6Q5EZK08AE datasheet, MCIMX6Q5EZK08AE pinout, MCIMX6Q5EZK08AE application, or MCIMX6Q5EZK08AE equivalent, key selection criteria include extended commercial temperature range (–20°C to +105°C), PoP-compatible 12 mm × 12 mm FCBGA package with 0.4 mm pitch, DVFS support, and hardware-accelerated multimedia pipelines for low-power HD video decode and display.
Technical Context
The MCIMX6Q5EZK08AE implements a symmetric 4-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE coprocessor. Its SoC-level memory system includes 256 KB OCRAM, 96 KB boot ROM with HABv4, and secure 16 KB RAM managed by SNVS.
It integrates dedicated accelerators: VPU for H.264/VC-1/MPEG-4 decode up to 1080p60, dual IPUv3H for real-time image processing, GPU3Dv4 delivering OpenGL ES 2.0 graphics, and CAAM with NIST-certified PRNG and 16 KB secure RAM - all coordinated via GPC power controller and CCM clock management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad Arm Cortex-A9 @ 800 MHz - enables concurrent OS, UI, and media tasks with full TrustZone isolation. |
| Memory Interface | 2×32-bit LPDDR2-800 - delivers 12.8 GB/s peak bandwidth for dual-channel video and graphics rendering. |
| Video Processing | VPU + dual IPUv3H - supports 1080p60 decode, deinterlacing, color space conversion, and overlay compositing in real time. |
| Graphics Acceleration | GPU3Dv4 (OpenGL ES 2.0) + GPU2Dv2 + GPUVG - enables HD UI rendering, 2D BitBlt operations, and vector graphics acceleration. |
| Security | CAAM + SNVS + A-HABv4 + CSU - provides hardware-accelerated AES/SHA/RSA, secure boot, and tamper-resistant key storage. |
| Connectivity | HDMI 1.4, MIPI CSI-2 (4-lane), MIPI DSI (2-lane), Gigabit ENET (400 Mbps real-world throughput), USB 2.0 OTG + 3 hosts - enables multi-display, multi-camera, and wired network edge devices. |
| Package | 12 mm × 12 mm FCBGA, 0.4 mm pitch, Package-on-Package (PoP) - supports stacked memory integration and compact PCB layout. |
| Temperature Grade | Extended Commercial: –20°C to +105°C - qualified for fanless embedded systems in industrial and consumer enclosures. |
Pinout & Package
MCIMX6Q5EZK08AE is housed in a 12 mm × 12 mm, 0.4 mm pitch Fine-Pitch Chip Scale Ball Grid Array (FCPBGA) with Package-on-Package (PoP) capability for LPDDR2 stacking. Pin assignments follow the i.MX 6Quad Consumer PoP ball map defined in IMX6DQCPOPEC Rev. 2, Section 6.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SDRAM_DQ[0:31] | LPDDR2 Data Bus | Two independent 32-bit bidirectional data lanes for dual-channel memory access; requires matched trace length and on-die termination calibration. |
| SDRAM_CLK[0:1] | LPDDR2 Clock | Differential clock pair per channel; drives 800 MHz DDR timing with phase-aligned strobes for reliable high-speed capture. |
| HDMI_TX | HDMI 1.4 Transmitter | TMDS differential output supporting up to 1080p60 RGB/YUV444; requires external level-shifting and ESD protection per HDMI spec. |
| CSI_DATA[0:3] | MIPI CSI-2 Data Lane | Four high-speed differential lanes supporting up to 800 Mbps/lane in 4-lane mode; routed as controlled-impedance 100 Ω differential pairs. |
| USB_OTG_DP/DM | USB 2.0 OTG Differential Pair | Integrated HS PHY with internal termination; supports host/peripheral mode and battery charging detection per USB BC 1.2. |
| ENET_MDIO/MDC | IEEE 802.3 Management Interface | Open-drain MDIO bus with 2.5 V tolerant inputs; used to configure external PHY registers including IEEE 1588 timestamping. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage and Frequency Scaling (DVFS) | Reduces dynamic power by scaling CPU voltage/frequency per workload - enables audio-only operation at 300 MHz/0.8 V while maintaining real-time responsiveness. |
| Hardware Video Decode Acceleration | Offloads H.264 BP/MP/HP, VC-1, MPEG-2/4, and DivX decoding from CPU - preserves >70% CPU cycles for concurrent UI and network tasks during 1080p playback. |
| Secure Boot with A-HABv4 | Enforces cryptographic chain-of-trust using SHA-256 and 2048-bit RSA keys - prevents unauthorized firmware execution and ensures runtime integrity of bootloader and OS kernel. |
| Smart DMA (SDMA) Controller | Programmable microcode engine managing 32 channels across peripherals - eliminates CPU polling for NAND, SPI, UART, and audio transfers, reducing latency and interrupt load. |
| Multi-Display Support | Simultaneous parallel RGB + HDMI + LVDS + MIPI DSI outputs - enables dual independent displays (e.g., infotainment main screen + rear-seat entertainment) without external compositor. |
| CAAM Cryptographic Engine | Accelerates AES-128/256, SHA-1/256, RSA-2048, and RNG generation - achieves >100 Mbps encrypted throughput with constant-time execution to resist side-channel attacks. |
Applications
| Portable Media Player | Industrial HMI Terminal |
|---|---|
|
Use Scenario: High-resolution video playback, touchscreen navigation, and DRM-protected streaming in handheld form factor. IC Role / Device Role / Timing Role: Main applications processor executing Android/Linux OS, driving HDMI/LVDS displays, decoding 1080p60 video, and managing secure content keys via CAAM. Use Value: Hardware-accelerated VPU and dual IPUv3H enable smooth 60 fps video with <5% CPU utilization, extending battery life beyond 8 hours on 4000 mAh packs. |
Use Scenario: Fanless panel PC in factory automation with multi-touch GUI, camera-based barcode scanning, and EtherNet/IP connectivity. IC Role / Device Role / Timing Role: Central controller handling real-time UI rendering (GPU3Dv4), image acquisition (MIPI CSI-2), deterministic Ethernet (IEEE 1588), and secure firmware updates. Use Value: Integrated Gigabit ENET with hardware timestamping and FlexCAN provide synchronized I/O control and fieldbus interoperability without external MAC/PHY components. |
| Medical Imaging Display | Digital Signage Player |
|
Use Scenario: DICOM-compliant diagnostic monitor receiving JPEG2000-encoded X-ray/CT images over GigE with zero-latency local rendering. IC Role / Device Role / Timing Role: Image processing hub performing color correction, window/level adjustment, and lossless decompression using dual IPUv3H and ASRC audio resampling. Use Value: On-chip ASRC and IPUv3H eliminate need for external FPGA-based preprocessing - reduces BOM cost by $12 and board area by 28 mm². |
Use Scenario: 4K-capable retail signage player supporting multiple HDMI zones, scheduled content updates, and remote diagnostics via cellular backhaul. IC Role / Device Role / Timing Role: Multimedia orchestrator managing eMMC-based content storage, HDMI 1.4 output with HDCP 1.4, USB-based firmware updates, and secure OTA patch validation. Use Value: Hardware HDCP engine and A-HABv4 ensure compliance with content licensing requirements while enabling signed firmware rollouts without exposing private keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q6AVT10AD | Same quad-core Cortex-A9 architecture but rated for automotive temperature (–40°C to +125°C) and includes MLB support; uses 14 mm × 14 mm package. | Targeted for automotive infotainment with CAN FD and ASIL-B functional safety features not present in MCIMX6Q5EZK08AE. | Select when automotive qualification, higher thermal margin, or MLB interface is required - not drop-in compatible due to larger footprint and different ball map. |
| i.MX8M Mini (LPC55S69) | Arm Cortex-A53 + Cortex-M33 dual-core architecture; supports LPDDR4, PCIe, and enhanced security (SECO); lacks native HDMI 1.4 and MIPI CSI-2. | Designed for next-gen IoT gateways requiring AI inference (via NN accelerator) and long-term software support, not direct HD video playback replacement. | Choose for future-proof designs needing 10+ year longevity, neural network acceleration, or USB 3.0 - requires new PCB layout and BSP migration. |
Compared with MCIMX6Q5EZK08AE, MCIMX6Q6AVT10AD offers higher thermal resilience and automotive interfaces but demands larger board area and different power sequencing, while i.MX8M Mini shifts focus toward AI-enabled edge compute at the expense of legacy multimedia peripheral compatibility.
Availability
MCIMX6Q5EZK08AE is available at Aetrix Electronics and suitable for portable media players, industrial HMIs, medical imaging displays, and digital signage players requiring stable component supply across extended commercial temperature ranges.
Supply support for MCIMX6Q5EZK08AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based applications processors and edge AI.
The i.MX 6 series was engineered to deliver high-performance multimedia processing in thermally constrained portable and embedded systems - balancing CPU throughput, GPU/VPU acceleration, and hardware security for rich user experiences.
FAQ
What is the maximum supported LPDDR2 speed for MCIMX6Q5EZK08AE?
The MCIMX6Q5EZK08AE supports LPDDR2-800, meaning it operates with a 400 MHz clock frequency delivering 800 MT/s data rates per pin. This is implemented across two independent 32-bit channels, enabling 12.8 GB/s aggregate memory bandwidth. The device requires precise PCB layout with matched trace lengths and calibrated on-die termination to maintain signal integrity at this speed.
Does MCIMX6Q5EZK08AE include hardware support for secure boot?
Yes, MCIMX6Q5EZK08AE implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, version control, and warm-boot support. It leverages the CAAM module and SNVS secure real-time clock to enforce a cryptographic chain-of-trust from boot ROM through OS loader, preventing unauthorized firmware execution.
Can MCIMX6Q5EZK08AE drive multiple displays simultaneously?
Yes, MCIMX6Q5EZK08AE supports up to four active displays concurrently: one parallel RGB interface, one HDMI 1.4 port, one or two LVDS ports, and one MIPI DSI interface. Its display subsystem includes dual IPUv3H units that handle composition, scaling, and color space conversion - enabling independent rendering to separate outputs without external hardware.
What video codecs are accelerated by the VPU in MCIMX6Q5EZK08AE?
The VPU in MCIMX6Q5EZK08AE provides hardware-accelerated decode for H.264 (Baseline/Main/High Profile), VC-1 (Simple/Main/Advanced), MPEG-2, MPEG-4 Part 2, and DivX/Xvid up to 1080p60 resolution. It does not support encode acceleration or newer codecs like HEVC or VP9 - those require software implementation or external silicon.
Is MCIMX6Q5EZK08AE pin-compatible with other i.MX 6Quad variants like MCIMX6Q6AVT10AD?
No, MCIMX6Q5EZK08AE is not pin-compatible with MCIMX6Q6AVT10AD. While both are i.MX 6Quad processors, they use different packages: MCIMX6Q5EZK08AE uses a 12 mm × 12 mm FCBGA PoP, whereas MCIMX6Q6AVT10AD uses a 14 mm × 14 mm FCBGA with distinct ball mapping and power delivery requirements - necessitating separate PCB layouts.
MCIMX6Q5EZK08AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 569-LFBGA
- Series:
- i.MX6Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 569-MAPBGA (12x12)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q5EZK08AE FAQ
1.How can I place an order for MCIMX6Q5EZK08AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q5EZK08AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q5EZK08AE reliable?
The price and inventory of MCIMX6Q5EZK08AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q5EZK08AE is usually 5 days.
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MCIMX6Q5EZK08AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q5EZK08AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q5EZK08AE?
For technical support, including MCIMX6Q5EZK08AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q5EZK08AE requirements.
6.How does Aetrix verify that MCIMX6Q5EZK08AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q5EZK08AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q5EZK08AE meets industry standards.
7.What is the process for return or replacement of MCIMX6Q5EZK08AE?
All MCIMX6Q5EZK08AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q5EZK08AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q5EZK08AE part is unused and in its original packaging.
Return procedure for MCIMX6Q5EZK08AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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