My Inquiry
My Account
NXP Semiconductors MCIMX6Q6AVT08AC
- Part No.:
- MCIMX6Q6AVT08AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q6AVT08AC.pdf
- Description:
- IC MPU I.MX6Q 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,655
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q6AVT08AC from NXP Semiconductors is an automotive-grade quad-core Arm® Cortex®-A9 application processor with integrated VPU and GPU, operating at 852 MHz, supporting DDR3/DDR3L/LPDDR2 memory, 1080p video decode/encode, and dual CAN interfaces. It targets infotainment head units, digital instrument clusters, and telematics gateways requiring real-time multimedia processing and functional safety support.
For engineers reviewing the MCIMX6Q6AVT08AC datasheet, MCIMX6Q6AVT08AC pinout, MCIMX6Q6AVT08AC application, or MCIMX6Q6AVT08AC equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FCPBGA-624 package compatibility, integrated CAAM security module, HDMI 1.4 and MIPI DSI/CSI-2 interface support, and boot ROM with HABv4 secure boot.
Technical Context
The MCIMX6Q6AVT08AC implements a symmetric 4-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core, 1 MB shared L2 cache, TrustZone® security, and NEON MPE co-processor. Its SoC-level architecture integrates Smart DMA (SDMA), dual IPUv3H image processors, and dedicated hardware accelerators for video (VPU), 3D graphics (GPU3Dv4), 2D graphics (GPU2Dv2), and OpenVG 1.1 rendering.
Power management includes dynamic voltage and frequency scaling (DVFS), software state retention, power gating for CPU/MPE domains, and integrated LDO regulators. Clocking relies on eight PLLs, on-chip oscillators, and external 24 MHz crystal input-critical for USB PHY operation and limiting max SoC speed to 852 MHz in automotive grade.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 852 MHz max - enables concurrent OS tasks, middleware execution, and real-time HMI rendering. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to 532 MHz - supports high-bandwidth framebuffer access and multi-display buffering. |
| Video Processing | Hardware VPU with 1080p encode/decode - offloads CPU for seamless navigation map rendering and rear-view camera video pipeline. |
| Graphics Acceleration | OpenGL ES 2.0 GPU3D (200 MTri/s), GPU2D, GPUVG - delivers smooth 3D cluster animations and 2D UI compositing without CPU saturation. |
| Automotive Interfaces | Dual FlexCAN 1 Mbps, MLB150, ESAI, ASRC - meets automotive audio distribution, ECU communication, and multi-source sample rate conversion requirements. |
| Security Features | CAAM (16 KB secure RAM), SNVS, CSU, A-HABv4 with SHA-256/2048-bit RSA - enables secure boot, encrypted firmware updates, and DRM-protected media playback. |
| Package | FCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - designed for automotive thermal cycling reliability and PCB layout compatibility with NXP reference designs. |
Pinout & Package
MCIMX6Q6AVT08AC is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 624 solder balls, 0.8 mm pitch, and integrated heat spreader lid. This package supports automotive-grade thermal dissipation and mechanical robustness under vibration and temperature cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling for stable 852 MHz operation. |
| VDD_SOC | SoC Logic Power | 1.2 V ±3% supply for L2 cache, interconnect, and peripheral logic - shared rail with GPU/VPU domains. |
| VDD_DDR | DDR Memory Interface | 1.5 V (DDR3) or 1.35 V (DDR3L) supply - must meet tight slew rate and noise specs per JEDEC standards. |
| CLKIN_24M | Primary Oscillator Input | 24 MHz CMOS clock input - mandatory for USB PHY operation and system clock tree derivation. |
| CAN1_TX / CAN1_RX | FlexCAN Channel 1 | Differential CAN bus interface - supports ISO 11898-2 compliant physical layer via external transceiver. |
| HDMI_TX | HDMI 1.4 Transmitter | TMDS output pins (CLK, DATA0–2) - drives display directly without external level-shifting for automotive-grade panels. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating across CPU, GPU, VPU, and memory domains reduces active power by >40% vs. fixed-frequency operation. |
| Multi-Standard Video Codec | Hardware-accelerated decode of H.264, MPEG-4, VC-1, VP8 and encode of H.264 - enables simultaneous rear-view camera feed and navigation video overlay. |
| Secure Boot Architecture | A-HABv4 with eFUSE-based key provisioning and SHA-256 signature verification - prevents unauthorized firmware execution in production vehicles. |
| Dual Independent Image Processors | Two IPUv3H units handle parallel camera sensor pipelines (e.g., front ADAS + rear backup) with real-time de-warping and blending. |
| Flexible Display Subsystem | Support for four concurrent displays (LVDS, HDMI, MIPI DSI, parallel RGB) at combined 450 Mpixels/sec - powers full-digital instrument clusters with HUD projection. |
Applications
| Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
Use Scenario: Central multimedia hub integrating navigation, voice assistant, Bluetooth audio, and wireless CarPlay/Android Auto projection. IC Role / Device Role / Timing Role: Primary application processor executing Linux/QNX OS, managing GPU/VPU pipelines, and coordinating CAN/Ethernet communication with vehicle networks. Use Value: 852 MHz quad-core performance ensures <100 ms UI response time during concurrent video decode, speech recognition, and OTA update background download. | Use Scenario: Real-time driver information display with animated gauges, ADAS warnings, and 3D vehicle model visualization. IC Role / Device Role / Timing Role: Safety-enhanced application processor driving dual LVDS/HDMI outputs with hardware composited layers and deterministic frame timing. Use Value: Dual IPUv3H and GPU3D enable synchronized rendering of critical speed/tachometer overlays with <5 ms latency, meeting ASIL-B timing constraints. |
| Telematics Control Unit (TCU) | Advanced Rear-View Camera System |
Use Scenario: Cellular-connected gateway aggregating CAN bus data, GPS location, and remote diagnostics for fleet management platforms. IC Role / Device Role / Timing Role: Host processor for LTE modem interface, secure OTA firmware update engine, and encrypted CAN message routing via FlexCAN peripherals. Use Value: Integrated CAAM and SNVS provide hardware-accelerated AES-256 encryption and secure RTC-backed logging for regulatory compliance (e.g., UNECE R155). | Use Scenario: Multi-camera surround-view system with stitched 360° bird's-eye view and dynamic parking guidance. IC Role / Device Role / Timing Role: Vision processing SoC receiving raw MIPI CSI-2 feeds from four cameras, performing geometric correction, color calibration, and real-time stitching. Use Value: Dedicated VPU and SDMA controller enable sub-100 ms end-to-end latency from sensor capture to display, eliminating motion blur during low-speed maneuvering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q6AVT10AC | Same package and feature set, but rated for 1 GHz operation - requires higher VDD_ARM voltage and stricter thermal design. | Targeted at premium infotainment systems needing higher sustained compute for AI-based voice processing or 4K UI rendering. | Select when thermal margin allows 1 GHz operation and application demands >18% higher CPU throughput at peak load. |
| MCIMX6D6AVT08AC | Dual-core variant (2× Cortex-A9), same 852 MHz speed, identical automotive grade and package - lacks second pair of CPU cores and one IPU. | Suitable for cost-optimized clusters or entry-level head units where single-application concurrency suffices. | Choose for BOM cost reduction where quad-core parallelism and dual-camera processing are not required. |
Compared with MCIMX6Q6AVT08AC, MCIMX6Q6AVT10AC delivers higher deterministic CPU throughput for complex middleware stacks, while MCIMX6D6AVT08AC reduces silicon cost and power envelope at the expense of parallel vision/audio processing capability.
Availability
MCIMX6Q6AVT08AC is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics control units requiring stable component supply across extended product lifecycles and rigorous AEC-Q100 qualification.
Supply support for MCIMX6Q6AVT08AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6Dual/6Quad family was engineered specifically for automotive infotainment and digital cockpit applications, emphasizing functional safety readiness, multimedia acceleration, and long-term automotive supply chain stability.
FAQ
What is the maximum operating junction temperature for MCIMX6Q6AVT08AC?
The MCIMX6Q6AVT08AC is qualified for automotive temperature grade A, with a specified junction temperature range of −40°C to +125°C. This rating is validated per AEC-Q100 Grade 2 requirements and enables deployment in under-hood or dashboard-mounted infotainment modules without forced cooling.
Does MCIMX6Q6AVT08AC support secure boot with cryptographic verification?
Yes, MCIMX6Q6AVT08AC implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing and 2048-bit RSA signature verification. The boot ROM enforces chain-of-trust validation using keys stored in eFUSEs or OTP memory, ensuring only authenticated firmware executes on the device.
Can MCIMX6Q6AVT08AC drive multiple displays simultaneously?
Yes, MCIMX6Q6AVT08AC supports up to four concurrent displays via its integrated display subsystem - including parallel RGB, LVDS, HDMI 1.4, and MIPI DSI interfaces - with a combined pixel throughput of 450 Mpixels/sec at 24 bpp, enabling full-digital instrument clusters with HUD projection.
What external memory types does MCIMX6Q6AVT08AC support?
MCIMX6Q6AVT08AC supports DDR3, DDR3L, and LPDDR2 memory up to 532 MHz on a 64-bit bus; NAND Flash (MLC/SLC, BCH ECC up to 40-bit); NOR Flash; PSRAM; and eMMC 4.41. These interfaces are managed by the MMDC and GPMI controllers with hardware-assisted error correction.
Is MCIMX6Q6AVT08AC pin-compatible with other i.MX 6Quad variants in the same package?
Yes, MCIMX6Q6AVT08AC shares identical FCPBGA-624 pinout and ball assignment with all other i.MX 6Quad automotive-grade parts (e.g., MCIMX6Q6AVT10AC, MCIMX6Q4AVT08AC), enabling drop-in replacement within the same speed and feature bin without PCB redesign.
MCIMX6Q6AVT08AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Bulk
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q6AVT08AC FAQ
1.How can I place an order for MCIMX6Q6AVT08AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q6AVT08AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q6AVT08AC reliable?
The price and inventory of MCIMX6Q6AVT08AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q6AVT08AC is usually 5 days.
3.What payment methods are accepted for MCIMX6Q6AVT08AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q6AVT08AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q6AVT08AC?
MCIMX6Q6AVT08AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q6AVT08AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q6AVT08AC?
For technical support, including MCIMX6Q6AVT08AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q6AVT08AC requirements.
6.How does Aetrix verify that MCIMX6Q6AVT08AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q6AVT08AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q6AVT08AC meets industry standards.
7.What is the process for return or replacement of MCIMX6Q6AVT08AC?
All MCIMX6Q6AVT08AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q6AVT08AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q6AVT08AC part is unused and in its original packaging.
Return procedure for MCIMX6Q6AVT08AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q6AVT08AC Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
