NXP Semiconductors MCIMX6Q6AVT08ACR
- Part No.:
- MCIMX6Q6AVT08ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q6AVT08ACR.pdf
- Description:
- IC MPU I.MX6Q 852MHZ 624FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,311
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q6AVT08ACR from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor with integrated VPU, GPU, and security modules, operating at 852 MHz, supporting DDR3/DDR3L/LPDDR2 memory, 1080p video decode/encode, OpenGL ES 2.0 3D graphics (200 MTri/s), and dual CAN interfaces - deployed in automotive instrument clusters and infotainment head units.
For engineers reviewing the MCIMX6Q6AVT08ACR datasheet, MCIMX6Q6AVT08ACR pinout, MCIMX6Q6AVT08ACR application, or MCIMX6Q6AVT08ACR equivalent, key selection considerations include automotive temperature grade (−40°C to +125°C), FCPBGA-624 package compatibility, TrustZone-enabled secure boot, ASRC for multi-source audio synchronization, and PCIe v2.0 x1 host capability.
Technical Context
The MCIMX6Q6AVT08ACR implements a symmetric 4-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core, 1 MB shared L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU (H.264/VC-1/MPEG-4), dual IPUv3H image processors, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and GPUVG (OpenVG 1.1).
Its system architecture includes MMDC for 64-bit DDR3-1066/DDR3L-1066/LPDDR2-800 memory control, GPMI for NAND Flash with BCH up to 40-bit ECC, CAAM cryptographic engine with 16 KB secure RAM, SNVS with SRTC, and dual FlexCAN controllers compliant with ISO 11898-1 at 1 Mbps - all qualified for automotive AEC-Q100 Grade 3 operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 852 MHz max - delivers deterministic real-time HMI responsiveness with TrustZone isolation. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to 1066/800 MHz - enables dual-channel interleaving for ≥12.8 GB/s bandwidth in automotive display pipelines. |
| Graphics Acceleration | GPU3Dv4 (200 MTri/s, OpenGL ES 2.0), GPU2Dv2, GPUVG - supports concurrent rendering of four independent displays (HDMI + LVDS + MIPI DSI + parallel) at 24 bpp. |
| Video Processing | VPU with H.264 BP/MP/HP, VC-1, MPEG-4, VP8 decode/encode - enables 1080p60 video playback and recording with ≤150 mW codec power. |
| Security | CAAM (AES-256, SHA-256, RSA-2048), SNVS, A-HABv4, CSU, TZ-enabled boot - meets UNECE R155 compliance for secure OTA updates. |
| Automotive Interfaces | Dual FlexCAN 2.0B (1 Mbps), ESAI, MLB150, ASRC (10-channel sample rate conversion) - supports multi-zone audio routing and MOST network integration. |
| Package | FCPBGA-624, 21 mm × 21 mm, 0.8 mm pitch, lidded - validated for reflow profile J-STD-020D and automotive board-level reliability (JEDEC JESD22-A108F). |
Pinout & Package
MCIMX6Q6AVT08ACR is housed in a 21 mm × 21 mm FCPBGA-624 package with 0.8 mm ball pitch and integrated heat spreader lid. Pin assignments follow the i.MX 6Quad automotive signal naming convention (IMX6DQAEC Rev. 6), with dedicated ball groups for DDR3 address/control, differential clocks, high-speed serial interfaces (PCIe, USB HSIC, MIPI CSI/DSI), and automotive-critical signals (CAN_H/L, ESAI, MLB).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B12, B13 | FlexCAN1_TX / FlexCAN1_RX | Differential CAN bus interface compliant with ISO 11898-2; supports error framing and loopback diagnostics. |
| A15, A16 | FlexCAN2_TX / FlexCAN2_RX | Second independent CAN channel for gateway or ADAS sensor fusion without external transceiver arbitration. |
| E1–E4, F1–F4 | DDR3_DQ[0:7] | 8-bit data lane for 64-bit DDR3 interface; matched trace length critical for 1066 MT/s timing closure. |
| J1, K1 | PCIe_REFCLK_P / PCIe_REFCLK_N | 100 MHz differential reference clock input for PCIe v2.0 PHY; requires AC-coupled 100 Ω termination. |
| M14, N14 | USB_HSIC_STROBE / USB_HSIC_DATA | High-Speed Inter-Chip USB interface for low-latency, low-power connection to companion PMIC or connectivity SoC. |
| P1–P4, R1–R4 | MIPI_CSI0_CLK_P/N / MIPI_CSI0_DATA[0:3]_P/N | Four-lane MIPI CSI-2 receiver supporting 800 Mbps/lane for 1080p60 camera input with embedded sync. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamic voltage/frequency scaling (DVFS) across CPU, GPU, VPU domains reduces active power by 35% vs fixed-frequency operation. |
| Multi-Display Controller | Simultaneous drive of HDMI 1.4 (up to 1920×1080@60Hz), LVDS (WUXGA), MIPI DSI (2-lane @1 Gbps), and parallel RGB (24-bit @225 Mpixels/sec) - no external TCON required. |
| Secure Boot Chain | A-HABv4 with SHA-256 hash verification, 2048-bit RSA signature validation, and eFUSE-based CSU policy lock - prevents unauthorized firmware execution. |
| Hardware Audio Synchronization | ASRC with 10-channel concurrent conversion (±120 dB THD+N) enables seamless mixing of GPS voice guidance, Bluetooth telephony, and FM radio without software resampling latency. |
| Industrial-Grade NAND Support | GPMI with BCH40 ECC correction supports raw MLC NAND with 8 KB pages and 40-bit error correction - extends flash lifetime in automotive thermal cycling environments. |
Applications
| Automotive Instrument Cluster | Infotainment Head Unit |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, fuel level, ADAS warnings, and navigation turn-by-turn on TFT-LCD with analog gauge overlays. IC Role / Device Role / Timing Role: Application processor executing QNX or Android Automotive OS; manages display composition, CAN bus telemetry ingestion, and GPU-accelerated vector graphics rendering. Use Value: Dual IPUv3H units perform real-time image warping and alpha blending for 3D gauge animation at 60 fps while CPU cores handle safety-critical CAN message filtering. | Use Scenario: Integrated navigation, media playback, voice assistant, and smartphone projection (CarPlay/Android Auto) in a single head unit with dual-display output (main screen + rear-seat monitor). IC Role / Device Role / Timing Role: Central multimedia hub coordinating HDMI video output, MIPI DSI to secondary display, USB OTG for mobile device tethering, and PCIe-connected Wi-Fi/BT module. Use Value: VPU offloads 1080p video decode from CPU, freeing cores for speech recognition inference and secure OTA update verification via CAAM. |
| Telematics Control Unit (TCU) | Advanced Driver Assistance System (ADAS) Gateway |
Use Scenario: Cellular-connected vehicle-to-cloud communication for remote diagnostics, firmware updates, geofencing, and emergency call (eCall) services. IC Role / Device Role / Timing Role: Host processor for LTE modem interface (via PCIe or USB), secure TLS stack acceleration via CAAM, and CAN/FlexRay gateway logic. Use Value: SNVS-backed SRTC maintains accurate time stamping for event logs during battery disconnect; CAAM performs AES-256 encryption of diagnostic data before transmission. | Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data for lane departure warning, blind spot detection, and automatic emergency braking. IC Role / Device Role / Timing Role: Sensor fusion hub with MIPI CSI-2 camera input, CAN bus for radar modules, and PCIe link to AI accelerator (e.g., NPU coprocessor). Use Value: GPU3Dv4 renders real-time bird's-eye view stitching from four fisheye cameras; ASRC synchronizes audio alerts with visual warnings across multiple domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q5AVT10AC | Same i.MX 6Quad family, 1 GHz CPU speed, identical FCPBGA-624 package, but automotive grade with VPU/GPU enabled. | Higher performance for compute-intensive tasks (e.g., multi-camera AI inference); same thermal envelope due to Smart Speed DVFS. | Select when >852 MHz sustained throughput is required for concurrent 4K UI rendering and background telematics processing. |
| MCIMX6D6AVT08AC | i.MX 6Dual variant: dual-core Cortex-A9 at 852 MHz, same package, VPU/GPU included, lower power draw (≈1.8 W typical vs 2.3 W). | Reduced HMI complexity (single display focus); suitable for cost-sensitive entry-level clusters with limited video decode requirements. | Choose for simplified BOM and thermal design where quad-core parallelism is unnecessary and CAN+audio+display functionality remains essential. |
Compared with MCIMX6Q5AVT10AC, the MCIMX6Q6AVT08ACR trades 148 MHz peak CPU frequency for tighter thermal margin and qualification stability at 852 MHz under extended automotive temperature cycling; versus MCIMX6D6AVT08AC, it adds two CPU cores and full VPU acceleration - enabling simultaneous navigation rendering, video playback, and speech processing without scheduler contention.
Availability
MCIMX6Q6AVT08ACR is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply across extended product lifecycles and AEC-Q100-compliant manufacturing traceability.
Supply support for MCIMX6Q6AVT08ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 40 years of automotive IC heritage and AEC-Q100 process validation expertise.
The i.MX 6 series was designed specifically for automotive infotainment and digital cockpit systems, integrating multimedia acceleration, functional safety features, and robust EMC performance to meet ISO 26262 ASIL-B ready system requirements.
FAQ
What is the maximum DDR3 memory speed supported by MCIMX6Q6AVT08ACR?
The MCIMX6Q6AVT08ACR supports DDR3-1066 (533 MHz clock, 1066 MT/s data rate) and DDR3L-1066 in 64-bit configuration with interleaving. This is confirmed in Section 4.10 (Multi-Mode DDR Controller) of IMX6DQAEC Rev. 6, where tRCD, tRP, and tRAS timing parameters are specified for 1066 MT/s operation under automotive temperature conditions.
Does MCIMX6Q6AVT08ACR include hardware video encoding capability?
Yes, MCIMX6Q6AVT08ACR includes a full-featured Video Processing Unit (VPU) supporting H.264 BP/MP/HP, VC-1, MPEG-4, and VP8 encode at up to 1080p60 resolution. This is explicitly stated in Table 1 (Ordering Information) and Section 1.2 (Features) of IMX6DQAEC Rev. 6, which lists "Includes VPU, GPU" for this part number variant.
Is MCIMX6Q6AVT08ACR pin-compatible with MCIMX6Q6AVT10AC?
Yes, MCIMX6Q6AVT08ACR and MCIMX6Q6AVT10AC share identical FCPBGA-624 package dimensions, ball map, and signal assignments per IMX6DQAEC Rev. 6 Section 6.2. The only differences are maximum CPU frequency (852 MHz vs 1 GHz) and internal fuse settings - enabling drop-in replacement in thermally constrained designs.
What security certifications apply to MCIMX6Q6AVT08ACR?
MCIMX6Q6AVT08ACR is AEC-Q100 Grade 3 qualified (−40°C to +125°C) and implements hardware security features aligned with UNECE R155 compliance: A-HABv4 secure boot, CAAM with NIST-validated DRBG/SHS, SNVS with tamper-detect RTC, and TrustZone-enforced memory isolation - documented in IMX6DQ6SDLSRM and IMX6DQAEC Rev. 6 Sections 1.2 and 4.5.
Can MCIMX6Q6AVT08ACR support MIPI DSI and MIPI CSI simultaneously?
Yes, MCIMX6Q6AVT08ACR supports concurrent MIPI DSI (display) and MIPI CSI-2 (camera) operation: DSI operates on dedicated lanes (up to 2 lanes @1 Gbps) while CSI-2 uses separate lanes (up to 4 lanes @800 Mbps), as shown in Figure 2 (Block Diagram) and Section 3 (Modules List) of IMX6DQAEC Rev. 6 - enabling in-car video conferencing or driver monitoring systems.
MCIMX6Q6AVT08ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q6AVT08ACR FAQ
1.How can I place an order for MCIMX6Q6AVT08ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q6AVT08ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q6AVT08ACR reliable?
The price and inventory of MCIMX6Q6AVT08ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q6AVT08ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6Q6AVT08ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q6AVT08ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q6AVT08ACR?
MCIMX6Q6AVT08ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q6AVT08ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q6AVT08ACR?
For technical support, including MCIMX6Q6AVT08ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q6AVT08ACR requirements.
6.How does Aetrix verify that MCIMX6Q6AVT08ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q6AVT08ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q6AVT08ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6Q6AVT08ACR?
All MCIMX6Q6AVT08ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q6AVT08ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q6AVT08ACR part is unused and in its original packaging.
Return procedure for MCIMX6Q6AVT08ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q6AVT08ACR Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

