NXP Semiconductors MCIMX6Q6AVT08AD
- Part No.:
- MCIMX6Q6AVT08AD
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q6AVT08AD.pdf
- Description:
- IC MPU I.MX6Q 852MHZ 624FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,166
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q6AVT08AD from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor with integrated VPU and GPU, operating at 852 MHz, supporting DDR3/DDR3L/LPDDR2 memory, 1080p video decode/encode, OpenGL ES 2.0 3D graphics (200 MTri/s), and dual CAN interfaces - deployed in automotive instrument clusters and infotainment head units.
For engineers reviewing the MCIMX6Q6AVT08AD datasheet, MCIMX6Q6AVT08AD pinout, MCIMX6Q6AVT08AD application, or MCIMX6Q6AVT08AD equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FCPBGA-624 package compatibility, integrated security (CAAM, TrustZone, HABv4), multimedia acceleration (VPU, IPUv3H, GPU3D/GPU2D/GPUVG), and interface flexibility (HDMI 1.4, MIPI DSI/CSI-2, PCIe v2.0, Gigabit Ethernet).
Technical Context
The MCIMX6Q6AVT08AD implements a symmetric 4-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. It integrates dedicated hardware accelerators including VPU for H.264/VC-1/MPEG-4 decode/encode, dual IPUv3H for image scaling/composition, and three graphics units (GPU3Dv4, GPU2Dv2, GPUVG).
Its system architecture includes MMDC for 64-bit DDR3-1066/DDR3L-1066/LPDDR2-800 memory, GPMI for NAND Flash with BCH up to 40-bit ECC, and comprehensive automotive I/O: two FlexCAN 1 Mbps controllers, ESAI and ASRC for multi-channel audio, MLB150 interface, and IEEE 1588-compliant Gigabit Ethernet controller with measured throughput up to 400 Mbps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 852 MHz - enables concurrent OS tasks, middleware, and real-time UI rendering in automotive HMI. |
| Graphics Acceleration | OpenGL ES 2.0 GPU3Dv4 (200 MTri/s), GPU2Dv2, GPUVG - supports smooth 3D navigation maps and layered 2D GUIs without CPU load. |
| Video Processing | VPU with H.264 BP/MP/HP, VC-1, MPEG-4 decode/encode up to 1080p60 - enables rear-view camera display and media playback with low power. |
| Memory Interface | 64-bit MMDC supporting DDR3-1066, DDR3L-1066, LPDDR2-800 - delivers >5 GB/s bandwidth for high-resolution multi-display systems. |
| Automotive Interfaces | 2× FlexCAN 1 Mbps, ESAI, ASRC, MLB150 - meets ISO 11898-1/2 and automotive audio synchronization requirements. |
| Security Engine | CAAM (16 KB secure RAM), TrustZone, A-HABv4 (SHA-256, 2048-bit RSA), SNVS - enables secure boot, DRM, and OTA firmware updates. |
| Package | FCPBGA-624, 21 mm × 21 mm, 0.8 mm pitch, lidded - qualified for automotive underhood environments with thermal management support. |
Pinout & Package
MCIMX6Q6AVT08AD is housed in a 21 mm × 21 mm, 0.8 mm pitch, lidded FCPBGA package with 624 solder balls. Pin assignments follow the i.MX 6Dual/6Quad Automotive signal naming convention and functional contact map defined in IMX6DQAEC Rev. 6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B1–B3, C1–C3 | VDD_ARM | Core voltage supply (1.2 V) for Arm Cortex-A9 cluster - requires low-noise regulation and local decoupling. |
| E1–E4, F1–F4 | VDD_SOC | System-on-chip logic voltage (1.35 V) powering L2 cache, interconnect, and peripherals - critical for timing closure. |
| J1–J5, K1–K5 | VDD_DDR | DDR memory interface supply (1.5 V for DDR3, 1.35 V for DDR3L) - must meet JEDEC AC/DC specs for signal integrity. |
| M1–M4, N1–N4 | VDDA_3P3 | Analog I/O supply (3.3 V) for USB PHY, HDMI, and analog audio blocks - isolated to minimize noise coupling. |
| T1–T4, U1–U4 | VDDA_1P1 | Analog core supply (1.1 V) for PLLs, clock generators, and ADC/DAC circuits - sensitive to ripple and PSRR. |
| Y1–Y4, AA1–AA4 | CLKIN_24M | Primary 24 MHz crystal reference input - mandatory for USB OTG/PHY operation and system clock derivation. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Power Management | Dynamically scales voltage/frequency across CPU, GPU, and VPU domains - reduces active power by >40% vs. fixed-frequency operation in HMI idle states. |
| Multi-Standard Video Codec | Hardware-accelerated decode/encode of H.264, VC-1, MPEG-2/4, VP8 - eliminates software decoding latency for real-time camera feeds. |
| Dual Independent IPUv3H | Parallel image processing pipelines for simultaneous display composition and camera preview overlay - enables split-screen instrument cluster with live backup camera. |
| Secure Boot Chain (A-HABv4) | Verified boot using SHA-256 hash and 2048-bit RSA signature - prevents unauthorized firmware execution in safety-critical automotive ECUs. |
| Automotive Audio Subsystem | ESAI + ASRC + AUDMUX supporting 260 kHz sample rates and 7.1 channel output - satisfies premium car audio OEM requirements. |
Applications
| Automotive Digital Instrument Cluster | Head Unit Infotainment System |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, navigation turn-by-turn, ADAS warnings, and rear-view camera feed on TFT-LCD or OLED display. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR Adaptive OS, managing display pipeline via LVDS/HDMI, and synchronizing CAN bus telemetry. Use Value: Dual IPUv3H enables zero-latency camera overlay on vector-rendered gauges; VPU offloads 1080p60 camera decode to preserve CPU cycles for safety-critical tasks. | Use Scenario: Integrated navigation, voice-controlled media playback, Bluetooth hands-free calling, and wireless Android Auto/CarPlay projection. IC Role / Device Role / Timing Role: Central multimedia hub interfacing with GPS, Wi-Fi/BT module, eMMC storage, HDMI display, and multi-zone audio codecs via ESAI/ASRC. Use Value: GPU3Dv4 renders 3D map navigation with smooth zoom/pan; CAAM secures OTA updates and DRM-protected streaming content. |
| Rear-View Camera Processing Unit | Automotive Telematics Control Unit (TCU) |
Use Scenario: Low-latency processing and display of wide-angle rear camera feed with dynamic guidelines, object detection overlay, and mirror mode correction. IC Role / Device Role / Timing Role: Dedicated vision processor handling CSI-2 input, ISP pipeline (via IPUv3H), and LVDS/HDMI output - operates independently of main head unit OS. Use Value: Hardware VPU enables sub-30 ms end-to-end latency from sensor to display; MIPI CSI-2 supports 1 Gbps/lane for high-resolution 12 MP sensors. | Use Scenario: Cellular-connected gateway aggregating CAN bus data, GNSS position, cellular diagnostics, and remote vehicle control commands. IC Role / Device Role / Timing Role: Secure edge node running Linux-based telematics stack, encrypting CAN frames via CAAM before LTE transmission. Use Value: Dual FlexCAN ports interface with powertrain and body domain ECUs; SNVS provides tamper-resistant RTC and secure key storage for TLS handshake. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q5AVT10AD | Same i.MX 6Quad family, 1 GHz max frequency, automotive grade, identical FCPBGA-624 package and pinout. | Higher CPU/GPU clock enables more complex UI frameworks and concurrent background services. | Select when higher sustained compute throughput is required and thermal design accommodates increased power. |
| MCIMX6D6AVT08AD | i.MX 6Dual variant: 2 Cortex-A9 cores, same 852 MHz speed, identical VPU/GPU feature set and package. | Lower core count reduces cost and power; suitable for cost-sensitive entry-level clusters with single-display focus. | Select when dual-core performance suffices and BOM cost reduction is prioritized over multi-display scalability. |
Compared with MCIMX6Q5AVT10AD, the MCIMX6Q6AVT08AD trades 148 MHz CPU headroom for lower dynamic power and thermal envelope; compared with MCIMX6D6AVT08AD, it delivers 2× CPU thread capacity and higher graphics fill rate - critical for multi-layer HMI with concurrent camera and navigation rendering.
Availability
MCIMX6Q6AVT08AD is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6Q6AVT08AD includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and automotive qualification standards.
The i.MX 6Dual/6Quad product line was designed specifically for automotive infotainment and digital cockpit systems, integrating multimedia acceleration, functional safety-aware peripherals, and hardware-enforced security to meet AEC-Q100 Grade 2 and ISO 26262 ASIL-B readiness requirements.
FAQ
What is the maximum operating junction temperature for MCIMX6Q6AVT08AD?
The MCIMX6Q6AVT08AD is rated for automotive temperature grade A (−40°C to +125°C junction), validated per AEC-Q100 Grade 2 requirements. Thermal design must maintain die temperature ≤125°C under worst-case ambient and power conditions, with recommended PCB copper pour and thermal vias beneath the FCPBGA package.
Does MCIMX6Q6AVT08AD support HDMI 2.0 or only HDMI 1.4?
The MCIMX6Q6AVT08AD supports HDMI 1.4 only, with maximum resolution of 1080p60 and features including 3D frame packing, deep color (up to 12-bit), and audio return channel (ARC). HDMI 2.0 support is not implemented in the i.MX 6Dual/6Quad series; that capability was introduced in later i.MX 8 series processors.
Can MCIMX6Q6AVT08AD boot directly from eMMC 4.5 without external NOR/NAND flash?
Yes, MCIMX6Q6AVT08AD supports boot from eMMC 4.41/4.5 devices via its uSDHC controllers. The internal Boot ROM initializes uSDHC0/uSDHC1 and loads the SPL (Secondary Program Loader) from eMMC boot partitions, enabling single-chip boot without discrete flash - subject to correct eFUSE configuration and partition layout per AN4549.
What security certifications apply to the CAAM module in MCIMX6Q6AVT08AD?
The CAAM module in MCIMX6Q6AVT08AD includes NIST-certified cryptographic primitives: DRBG validation number 94 and SHS validation number 1455 under the Cryptographic Algorithm Validation Program (CAVP). It supports FIPS 140-2 Level 1 compliance when configured per NXP's security reference manual (IMX6DQ6SDLSRM).
Is the MCIMX6Q6AVT08AD pin-compatible with MCIMX6Q6AVT10AD?
Yes, MCIMX6Q6AVT08AD and MCIMX6Q6AVT10AD share identical FCPBGA-624 package dimensions, ball pitch (0.8 mm), pinout, and signal assignment - differing only in maximum guaranteed operating frequency (852 MHz vs. 1 GHz) and internal speed binning. No PCB redesign is needed when upgrading between these variants.
MCIMX6Q6AVT08AD Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q6AVT08AD FAQ
1.How can I place an order for MCIMX6Q6AVT08AD through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q6AVT08AD on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q6AVT08AD reliable?
The price and inventory of MCIMX6Q6AVT08AD are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q6AVT08AD is usually 5 days.
3.What payment methods are accepted for MCIMX6Q6AVT08AD?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q6AVT08AD transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q6AVT08AD?
MCIMX6Q6AVT08AD orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q6AVT08AD order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q6AVT08AD?
For technical support, including MCIMX6Q6AVT08AD datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q6AVT08AD requirements.
6.How does Aetrix verify that MCIMX6Q6AVT08AD is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q6AVT08AD products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q6AVT08AD meets industry standards.
7.What is the process for return or replacement of MCIMX6Q6AVT08AD?
All MCIMX6Q6AVT08AD units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q6AVT08AD, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q6AVT08AD part is unused and in its original packaging.
Return procedure for MCIMX6Q6AVT08AD:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q6AVT08AD Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

