My Inquiry
My Account
NXP Semiconductors MCIMX6Q6AVT08AER
- Part No.:
- MCIMX6Q6AVT08AER
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q6AVT08AER.pdf
- Description:
- IC MPU I.MX6Q 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,051
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q6AVT08AER from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor with integrated VPU, GPU, and security modules. It operates at 852 MHz, supports DDR3/DDR3L/LPDDR2 memory interfaces, delivers 1080p video decode/encode, and integrates dual CAN, HDMI 1.4, MIPI CSI-2/DSI, and Gigabit Ethernet - deployed in automotive instrument clusters and infotainment head units.
For engineers reviewing the MCIMX6Q6AVT08AER datasheet, MCIMX6Q6AVT08AER pinout, MCIMX6Q6AVT08AER application, or MCIMX6Q6AVT08AER equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FCPBGA-624 package compatibility, TrustZone-enabled secure boot, and hardware-accelerated multimedia throughput for real-time HMI rendering.
Technical Context
The MCIMX6Q6AVT08AER implements a symmetric 4-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core and a shared 1 MB L2 cache. Its SoC-level architecture includes dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 decode/encode, dual IPUv3H for image scaling/compositing, and GPU3Dv4 (OpenGL ES 2.0) delivering up to 200 MTri/s.
Power management is handled by an integrated PMU supporting DVFS, software state retention, and power gating across CPU, MPE, and peripherals. Clocking relies on eight PLLs and on-chip oscillators, while security is enforced via CAAM (16 KB secure RAM), SNVS, CSU, and A-HAB v4 with SHA-256 and 2048-bit RSA key support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 852 MHz max - enables concurrent OS, middleware, and application execution in safety-critical automotive domains. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to 532 MHz - supports high-bandwidth graphics and video buffering with interleaving mode for latency reduction. |
| Video Acceleration | VPU with 1080p60 decode/encode (H.264, VC-1, MPEG-4) - offloads CPU for real-time video playback and camera feed processing without frame drops. |
| Graphics Engine | GPU3Dv4 (OpenGL ES 2.0), 200 MTri/s, OpenCL support - renders complex 3D gauges and navigation maps with hardware tessellation and shader execution. |
| Automotive Interfaces | Dual FlexCAN (1 Mbps), MLB150, ESAI, ASRC - enables seamless integration with vehicle networks, multi-source audio routing, and asynchronous sample rate conversion for cockpit audio systems. |
| Security Features | CAAM (16 KB secure RAM), A-HAB v4, TrustZone, SNVS RTC - provides hardware-rooted secure boot, encrypted firmware updates, and tamper-resistant key storage for DRM and e-commerce. |
| Package | FCPBGA-624, 21 mm × 21 mm, 0.8 mm pitch, lidded - meets automotive mechanical reliability standards (AEC-Q100 Grade 3) and thermal dissipation requirements for under-dash mounting. |
Pinout & Package
MCIMX6Q6AVT08AER is housed in a 21 mm × 21 mm FCBGA package with 624 solder balls and 0.8 mm pitch. The lidded construction enhances thermal performance and mechanical robustness for automotive under-hood and dashboard applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling to maintain timing integrity at 852 MHz. |
| VDD_SOC | SoC logic voltage | 1.2 V ±3% supply for L2 cache, MMDC, and interconnect fabric - shared rail with GPU/VPU domains for coordinated DVFS scaling. |
| DDR_DQ[0:63] | DDR data bus | 64-bit bidirectional data interface - routed as length-matched differential pairs with controlled impedance (40–50 Ω) for signal integrity at 1066 MT/s. |
| CAN1_TX / CAN1_RX | FlexCAN channel 1 | Differential CAN physical layer interface - supports ISO 11898-2 compliant 1 Mbps communication with built-in transceiver biasing and fault protection. |
| HDMI_TX_CLK / HDMI_TX_DATA[0:2] | HDMI 1.4 pixel clock & data | TMDS-compatible outputs - drive standard HDMI sink devices at up to 165 MHz pixel clock (1080p60) with HDCP 1.4 support enabled via CAAM. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic power gating and clock gating across CPU, GPU, VPU, and peripherals - reduces active power by >40% during partial-load HMI operation without compromising responsiveness. |
| Multi-Standard Video Codec | Hardware-accelerated decode/encode for H.264, VC-1, MPEG-2/4, VP8 - enables simultaneous rear-seat video playback and front-camera ADAS preview with <5 ms pipeline latency. |
| Triple Graphics Pipeline | Independent GPU3D, GPU2D, and GPUVG engines - allows concurrent 3D navigation rendering, 2D UI compositing, and vector-based instrument cluster graphics with zero CPU intervention. |
| Secure Boot Chain | A-HAB v4 with SHA-256 hash verification and 2048-bit RSA signature validation - ensures only cryptographically signed firmware executes, preventing unauthorized code injection in OTA update scenarios. |
| Automotive Audio Subsystem | ESAI + ASRC + AUDMUX + SPDIF - supports 7.1 multi-channel audio output at 260 kHz sampling rate with asynchronous resampling between Bluetooth, USB, and tuner sources. |
Applications
| Automotive Instrument Cluster | Infotainment Head Unit |
|---|---|
Use Scenario: Real-time rendering of digital speedometer, tachometer, ADAS alerts, and navigation turn-by-turn overlays on TFT-LCD or OLED display. IC Role / Device Role / Timing Role: Application processor executing QNX or Android Automotive OS, driving parallel/LVDS/HDMI display interfaces while synchronizing with CAN bus vehicle data. Use Value: Dual IPUv3H units enable hardware-accelerated layer blending and alpha compositing at 60 fps, eliminating CPU bottlenecks during simultaneous gauge animation and map panning. | Use Scenario: Central multimedia hub supporting AM/FM/DAB radio, Bluetooth hands-free calling, USB media playback, and rear-seat HDMI video streaming. IC Role / Device Role / Timing Role: Main SoC managing multi-interface concurrency - USB OTG host, eMMC boot, SATA-II HDD, HDMI TX, MIPI CSI-2 camera input, and dual CAN for vehicle network bridging. Use Value: Integrated VPU and GPU3D allow simultaneous 1080p video decode and OpenGL ES 2.0 UI rendering with <12 ms end-to-end latency, meeting automotive UI responsiveness benchmarks. |
| Telematics Control Unit (TCU) | Advanced Driver Assistance System (ADAS) Display |
Use Scenario: Cellular-connected module aggregating GPS location, cellular telemetry, OTA firmware updates, and remote diagnostics over LTE/Wi-Fi. IC Role / Device Role / Timing Role: Secure application processor running Linux with CAAM-encrypted TLS sessions, SNVS-backed secure clock, and eMMC-based trusted firmware partition. Use Value: A-HAB v4 and CAAM enable FIPS 140-2 Level 3–compliant secure boot and runtime attestation, satisfying UNECE R155 cybersecurity management system (CSMS) requirements. | Use Scenario: Fusion display combining forward radar, surround-view camera, and lane-departure warning graphics on central console screen. IC Role / Device Role / Timing Role: Vision-processing SoC receiving raw MIPI CSI-2 camera streams (up to 4 lanes @ 800 Mbps/lane), applying ISP pipelines via IPUv3H, and overlaying sensor-fused graphics using GPU3D. Use Value: Hardware ASRC and ESAI enable synchronized multi-sensor audio feedback (e.g., proximity beeps + voice alerts) with sub-100 µs jitter across independent clock domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q5EVM10AC | Same i.MX 6Quad core, 1 GHz speed, commercial temp grade (−20°C to +105°C), no automotive qualification. | Lacks AEC-Q100 Grade 3 certification and automotive-specific features (e.g., MLB150, enhanced CAN ESD tolerance). | Select only for non-automotive industrial HMI where extended temperature range and functional safety compliance are not required. |
| MCIMX8MQ6CVTIZAB | Arm Cortex-A53 quad-core, 1.5 GHz, integrated MIPI DSI/LVDS, no VPU, uses CAAM v2 and newer security stack. | Targets next-gen Android Automotive with virtualization support but lacks hardware video encode and legacy automotive interfaces (MLB, ESAI). | Choose for new designs requiring higher CPU throughput and Android 12+ compatibility, accepting trade-offs in legacy video acceleration and automotive bus support. |
Compared with MCIMX6Q5EVM10AC, MCIMX6Q6AVT08AER provides certified automotive reliability and CAN/MLB integration; versus MCIMX8MQ6CVTIZAB, it retains mature 1080p VPU acceleration and broader automotive peripheral support at lower software migration cost.
Availability
MCIMX6Q6AVT08AER is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply across long production lifecycles and rigorous environmental qualification.
Supply support for MCIMX6Q6AVT08AER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and automotive functional safety.
The i.MX 6Dual/6Quad product line was designed specifically for automotive infotainment and digital cockpit applications, emphasizing hardware-accelerated multimedia, ASIL-B capable subsystems, and comprehensive automotive interface integration (CAN, MLB, ESAI, ASRC).
FAQ
What is the maximum operating junction temperature for MCIMX6Q6AVT08AER?
The MCIMX6Q6AVT08AER is rated for automotive temperature grade A (−40°C to +125°C junction). This specification is validated per AEC-Q100 Grade 3 requirements and applies under full load with proper thermal design using the lidded FCPBGA package and recommended PCB copper pour layout per NXP AN5307.
Does MCIMX6Q6AVT08AER support HDMI 2.0 or only HDMI 1.4?
The MCIMX6Q6AVT08AER supports HDMI 1.4 only, with maximum pixel clock of 165 MHz (1080p60). HDMI 2.0 support is not implemented in this silicon revision; the HDMI TX block lacks the required 6 Gbps TMDS capability and HDR metadata handling defined in HDMI 2.0 specification.
Can MCIMX6Q6AVT08AER boot directly from eMMC 4.5 without external SPI NOR flash?
Yes, MCIMX6Q6AVT08AER supports eMMC 4.41/4.5 boot via its uSDHC controller in HS200 mode. Boot ROM initializes the eMMC interface and loads the first-stage bootloader (SPL) from the boot partition, eliminating need for external SPI NOR flash when eMMC is used for primary storage and boot.
Is the VPU in MCIMX6Q6AVT08AER capable of 4K video decode?
No, the VPU in MCIMX6Q6AVT08AER is limited to 1080p60 decode/encode for H.264, VC-1, and MPEG-4. 4K decode capability is not supported in this generation; the VPU's internal memory bandwidth and macroblock processing pipeline are architecturally constrained to HD resolution.
How many MIPI CSI-2 lanes does MCIMX6Q6AVT08AER support per camera interface?
The MCIMX6Q6AVT08AER supports one MIPI CSI-2 receiver with up to four data lanes and one clock lane. It can operate in 1-, 2-, 3-, or 4-lane configuration at speeds up to 800 Mbps per lane (4-lane mode) or 1 Gbps per lane (1–3 lane mode), enabling high-resolution camera input at up to 240 MP/s aggregate bandwidth.
MCIMX6Q6AVT08AER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q6AVT08AER FAQ
1.How can I place an order for MCIMX6Q6AVT08AER through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q6AVT08AER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q6AVT08AER reliable?
The price and inventory of MCIMX6Q6AVT08AER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q6AVT08AER is usually 5 days.
3.What payment methods are accepted for MCIMX6Q6AVT08AER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q6AVT08AER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q6AVT08AER?
MCIMX6Q6AVT08AER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q6AVT08AER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q6AVT08AER?
For technical support, including MCIMX6Q6AVT08AER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q6AVT08AER requirements.
6.How does Aetrix verify that MCIMX6Q6AVT08AER is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q6AVT08AER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q6AVT08AER meets industry standards.
7.What is the process for return or replacement of MCIMX6Q6AVT08AER?
All MCIMX6Q6AVT08AER units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q6AVT08AER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q6AVT08AER part is unused and in its original packaging.
Return procedure for MCIMX6Q6AVT08AER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q6AVT08AER Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
