NXP Semiconductors MCIMX6Q6AVT10ADR
- Part No.:
- MCIMX6Q6AVT10ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q6AVT10ADR.pdf
- Description:
- IC MPU I.MX6Q 1.0GHZ 624FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,219
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q6AVT10ADR from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor operating at 1 GHz, integrating VPU, GPU3Dv4 (OpenGL ES 2.0), GPU2Dv2, and IPUv3H for 1080p video decode/encode and dual-display graphics rendering. It features a 64-bit DDR3/DDR3L/LPDDR2 memory interface, dual FlexCAN 1 Mbps controllers, HDMI 1.4, MIPI CSI-2/DSI, and Gigabit Ethernet - deployed in automotive infotainment head units and digital instrument clusters.
For engineers reviewing the MCIMX6Q6AVT10ADR datasheet, MCIMX6Q6AVT10ADR pinout, MCIMX6Q6AVT10ADR application, or MCIMX6Q6AVT10ADR equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FCPBGA 21×21 mm package with 0.8 mm pitch, integrated CAAM cryptographic accelerator, TrustZone security, and hardware-accelerated multimedia subsystems supporting HABv4 secure boot.
Technical Context
The MCIMX6Q6AVT10ADR implements a symmetric quad-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core, 1 MB shared L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor. Its SoC-level architecture integrates Smart DMA (SDMA), MMDC for DDR3-1066/LPDDR2-800, and multi-channel ASRC for audio sample rate conversion up to 260 kHz.
Power management includes dynamic voltage and frequency scaling (DVFS), software state retention, power gating for CPU/MPE, and integrated PMU with LDO regulators. Security is enforced via TrustZone, CAAM (16 KB secure RAM, NIST-certified PRNG), SNVS, CSU, and A-HABv4 with SHA-256 and 2048-bit RSA key support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 1 GHz max (996 MHz with 24 MHz USB clock) |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to DDR3-1066; supports interleaving and dual x32 LPDDR2 |
| Graphics Acceleration | GPU3Dv4 (200 MTri/s, OpenGL ES 2.0), GPU2Dv2, GPUVG (OpenVG 1.1), 2× IPUv3H |
| Video Processing | VPU supporting 1080p60 encode/decode (H.264, VC-1, MPEG-4, VP8) |
| Security Engine | CAAM with 16 KB secure RAM, NIST-certified DRBG/SHS, A-HABv4, TrustZone, SNVS RTC |
| Automotive Interfaces | Dual FlexCAN 1 Mbps, MLB150, ESAI (260 kHz I2S), ASRC (10-channel concurrent conversion) |
| Package | FCPBGA, 21 mm × 21 mm, 0.8 mm pitch, lidded, automotive qualified (−40°C to +125°C) |
Pinout & Package
MCIMX6Q6AVT10ADR is housed in a 21 mm × 21 mm FCPBGA package with 0.8 mm ball pitch and thermal lid. Pin assignments follow the i.MX 6Dual/6Quad Automotive signal naming convention (IMX6DQAEC Rev. 6) and require adherence to ball map Table 6–1 in Section 6.2 of the datasheet. The device uses 521-ball FCBGA layout with dedicated power/ground banks, differential clock inputs (OSC_IN/OSC_OUT, 24 MHz crystal), and muxed I/O groups for display, camera, and peripheral interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OSC_IN / OSC_OUT | Crystal oscillator input/output | Accepts 24 MHz fundamental-mode crystal; required for USB PHY operation and system clock derivation |
| VDD_ARM / VDD_SOC | Core and system domain supplies | Separate 1.2 V (ARM) and 1.2–1.3 V (SOC) regulated inputs; each requires local decoupling per datasheet layout rules |
| DDR_DQ[0:63] | DDR data bus | 64-bit bidirectional data lines with on-die termination; supports DDR3-1066, LPDDR2-800, and interleaved modes |
| CAN1_TX / CAN1_RX | FlexCAN controller channel 1 | Differential CAN bus interface compliant with ISO 11898-1; supports 1 Mbps bit rate and loopback self-test |
| HDMI_TX_CLK / HDMI_TX_DATA[0:2] | HDMI 1.4 transmitter outputs | TMDS clock and data lanes driving HDMI sink; requires external level-shifting and ESD protection per automotive EMC requirements |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Enables full-feature operation at sub-1W active power in automotive ambient by coordinating DVFS, clock gating, and power domain isolation |
| Hardware Video Pipeline | VPU + dual IPUv3H enables simultaneous 1080p decode + UI compositing + overlay blending without CPU load |
| Secure Boot Architecture | A-HABv4 with SHA-256 signature verification, 2048-bit RSA keys, and eFUSE-based CSU policy locking prevents unauthorized firmware execution |
| Multi-Display Support | Five concurrent display paths (parallel LCD, LVDS ×2, HDMI, MIPI DSI) with total pixel throughput up to 450 Mpixels/sec at 24 bpp |
| Automotive Audio Subsystem | ESAI + ASRC + AUDMUX enables 7.1-channel audio routing with asynchronous sample rate conversion across independent clock domains |
Applications
| Automotive Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
Use Scenario: Central touchscreen unit delivering navigation, media playback, Bluetooth telephony, and vehicle settings in passenger cabin. IC Role / Device Role / Timing Role: Primary application processor executing Linux/QNX OS, managing HDMI/LVDS display output, MIPI CSI-2 camera input, and dual FlexCAN for vehicle network telemetry. Use Value: Integrated VPU and GPU enable smooth 1080p video playback and animated UI while maintaining <500 ms boot-to-UI time under AEC-Q100 Grade 2 conditions. | Use Scenario: Real-time driver information display behind steering wheel, showing speed, ADAS alerts, gear position, and energy flow in EVs. IC Role / Device Role / Timing Role: Safety-enhanced application processor rendering critical gauges via parallel LCD and HDMI, with ASRC-synchronized audio alerts and CAN-bus vehicle data ingestion. Use Value: Dual IPUv3H units allow concurrent processing of camera feed (rearview) and synthetic graphics (speedometer), meeting ISO 26262 ASIL-B timing constraints for display update latency ≤ 100 ms. |
| Telematics Control Unit (TCU) | Advanced Driver Assistance System (ADAS) Display Processor |
Use Scenario: Cellular-connected module aggregating GPS, cellular modem, Wi-Fi, and OTA update capability for fleet management and remote diagnostics. IC Role / Device Role / Timing Role: Host processor interfacing with uSDHC-based eMMC storage, PCIe-connected LTE modem, Gigabit Ethernet for V2X gateway, and secure CAAM for TLS key acceleration. Use Value: Hardware-accelerated crypto (CAAM) reduces TLS handshake latency by >70% versus software-only stack, enabling sub-second OTA firmware validation. | Use Scenario: Front-end display processor fusing camera, radar, and ultrasonic sensor data into unified HUD or center-stack visualization for lane departure, blind spot, and collision warnings. IC Role / Device Role / Timing Role: Vision preprocessing engine using MIPI CSI-2 (4-lane @ 800 Mbps/lane) and GPU3D for real-time object segmentation before sending metadata to safety MCU. Use Value: Dedicated SDMA and IPUv3H offload image warping, color correction, and overlay composition from Cortex-A9 cores, preserving >85% CPU bandwidth for perception algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q5AVT10AD | Same quad-core Cortex-A9, 1 GHz, identical FCPBGA package, but excludes VPU (video processing unit) | Lacks hardware-accelerated 1080p encode/decode; suitable only for UI-centric infotainment without video playback | Select when video codec functionality is unnecessary and BOM cost reduction is prioritized over multimedia flexibility |
| MCIMX8MQ5CVAD8A | Arm Cortex-A53 quad-core @ 1.5 GHz, integrated GC7000Lite GPU, no VPU, supports LPDDR4, newer 14 nm process | Higher CPU IPC and lower active power, but lacks ASRC, MLB, and legacy CAN peripherals required for automotive body domain integration | Choose for next-gen designs targeting Android Automotive OS and high-resolution UI, provided legacy automotive bus compatibility is handled externally |
Compared with MCIMX6Q5AVT10AD, the MCIMX6Q6AVT10ADR adds essential VPU capability for video-centric HMI; versus MCIMX8MQ5CVAD8A, it retains mature automotive interface support (MLB, dual CAN, ESAI) critical for seamless integration into existing vehicle networks without external bridge ICs.
Availability
MCIMX6Q6AVT10ADR is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics control units requiring stable component supply across extended product lifecycles and AEC-Q100-compliant manufacturing.
Supply support for MCIMX6Q6AVT10ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The i.MX 6Dual/6Quad family was designed specifically for automotive infotainment and digital cluster applications, emphasizing functional safety readiness, multimedia performance, and long-term automotive qualification (AEC-Q100 Grade 2).
FAQ
What is the maximum operating frequency of the MCIMX6Q6AVT10ADR and under what condition is it limited?
The MCIMX6Q6AVT10ADR operates at a maximum core frequency of 1 GHz. However, when a 24 MHz crystal is used for the USB PHY (a mandatory requirement for USB functionality), the maximum achievable SoC speed is reduced to 996 MHz due to internal clock tree constraints documented in the i.MX 6Dual/6Quad errata (ERR004512). This limitation applies regardless of thermal or voltage margin.
Does the MCIMX6Q6AVT10ADR support secure boot, and what cryptographic standards does it implement?
Yes, the MCIMX6Q6AVT10ADR implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hash verification, 2048-bit RSA public-key signature validation, and version control. It leverages the CAAM module for NIST-certified cryptographic operations including DRBG and SHS, and enforces boot policy via eFUSE-programmed CSU registers locked at power-on reset.
What display interfaces does the MCIMX6Q6AVT10ADR natively support, and what is the aggregate pixel throughput?
The MCIMX6Q6AVT10ADR supports five native display interfaces: parallel 24-bit LCD, dual LVDS, HDMI 1.4, and MIPI DSI. Its total raw pixel throughput across all active interfaces is up to 450 Mpixels/sec at 24 bpp - sufficient for simultaneous WUXGA (1920×1200@60Hz) on HDMI plus WXGA (1280×800@60Hz) on LVDS, as specified in Section 6 of the IMX6DQAEC datasheet.
How many CAN interfaces does the MCIMX6Q6AVT10ADR integrate, and what protocol versions are supported?
The MCIMX6Q6AVT10ADR integrates two FlexCAN controllers compliant with ISO 11898-1, supporting CAN 2.0A/B protocols at up to 1 Mbps. Both controllers feature message buffers, FIFO mode, loopback self-test, and hardware timestamping - essential for automotive body control and powertrain communication in AEC-Q100 environments.
Is the MCIMX6Q6AVT10ADR pin-compatible with other i.MX 6Quad variants such as MCIMX6Q4AVT10AD?
Yes, the MCIMX6Q6AVT10ADR shares identical FCPBGA 21×21 mm package, ball map, and pinout with all MCIMX6QxAxxxxD variants (e.g., MCIMX6Q4AVT10AD), differing only in fuse-configured features (VPU presence) and silicon revision. PCB layout and signal routing remain fully interchangeable, enabling drop-in replacement where VPU functionality is not required.
MCIMX6Q6AVT10ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q6AVT10ADR FAQ
1.How can I place an order for MCIMX6Q6AVT10ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q6AVT10ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q6AVT10ADR reliable?
The price and inventory of MCIMX6Q6AVT10ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q6AVT10ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6Q6AVT10ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q6AVT10ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q6AVT10ADR?
MCIMX6Q6AVT10ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q6AVT10ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q6AVT10ADR?
For technical support, including MCIMX6Q6AVT10ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q6AVT10ADR requirements.
6.How does Aetrix verify that MCIMX6Q6AVT10ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q6AVT10ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q6AVT10ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6Q6AVT10ADR?
All MCIMX6Q6AVT10ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q6AVT10ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q6AVT10ADR part is unused and in its original packaging.
Return procedure for MCIMX6Q6AVT10ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q6AVT10ADR Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

