My Inquiry
My Account
NXP Semiconductors MCIMX6Q6AVT10AE
- Part No.:
- MCIMX6Q6AVT10AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6Q6AVT10AE.pdf
- Description:
- IC MPU I.MX6Q 1.0GHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,312
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6Q6AVT10AE from NXP Semiconductors is an automotive-grade i.MX 6Quad applications processor featuring four Arm Cortex-A9 cores running at 1 GHz, integrated VPU and GPU, 1 MB L2 cache, and FCPBGA-624 (21 × 21 mm, 0.8 mm pitch) packaging. It delivers full HD video decode/encode, OpenGL ES 2.0 3D graphics acceleration, and dual CAN interfaces - deployed in automotive instrument clusters and infotainment head units.
For engineers reviewing the MCIMX6Q6AVT10AE datasheet, MCIMX6Q6AVT10AE pinout, MCIMX6Q6AVT10AE application, or MCIMX6Q6AVT10AE equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), integrated multimedia accelerators (VPU/GPU/IPU), DDR3/DDR3L/LPDDR2 memory interface support, and compliance with ISO 26262 ASIL-B functional safety requirements for HMI subsystems.
Technical Context
The MCIMX6Q6AVT10AE implements a quad-core Arm Cortex-A9 MPCore platform with TrustZone security, each core equipped with 32 KB L1 instruction and data caches, NEON MPE co-processor, and private timers. The SCU and unified 1 MB L2 cache enable coherent multi-core operation with AXI bus interconnect.
It integrates dedicated hardware accelerators including VPU (H.264/H.265 decode up to 1080p60), dual IPUv3H for image scaling/compositing, GPU3Dv4 (200 MTri/s), GPU2Dv2, and GPUVG for OpenVG 1.1 vector graphics - all operating under dynamic voltage and frequency scaling (DVFS) for automotive thermal constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Quad-core Arm Cortex-A9 r2p10 with TrustZone, 1 GHz max frequency (996 MHz with 24 MHz USB clock) |
| L2 Cache | 1 MB unified, shared across all four cores - reduces off-chip memory traffic and improves real-time HMI responsiveness |
| Memory Interface | 64-bit DDR3/DDR3L-1066 or dual-channel 32-bit LPDDR2-800 - supports interleaved access for >5 GB/s bandwidth in automotive display pipelines |
| Video Processing | VPU with H.264 BP/MP/HP decode up to 1080p60 and encode up to 1080p30 - enables concurrent navigation UI rendering and rear-view camera feed |
| Graphics Acceleration | GPU3Dv4 (OpenGL ES 2.0, 200 MTri/s), GPU2Dv2, GPUVG - drives up to four independent displays (HDMI + LVDS + MIPI DSI + parallel) at 24 bpp |
| Automotive Interfaces | Two FlexCAN 2.0B controllers (1 Mbps), MLB150, ESAI, ASRC - supports multi-source audio routing and synchronized cluster instrumentation |
| Security | CAAM (16 KB secure RAM, NIST-certified PRNG), SNVS, CSU, A-HABv4 boot - enables secure boot, DRM, and encrypted firmware updates per UNECE R155 |
Pinout & Package
MCIMX6Q6AVT10AE uses a 624-ball Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package measuring 21 mm × 21 mm with 0.8 mm ball pitch and lidded construction for automotive thermal reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply | 1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling for EMI-sensitive automotive environments |
| VDD_SOC | System-on-chip power | 1.2 V ±3% supply for L2 cache, MMDC, and interconnect fabric - shared rail with GPU/VPU domains |
| VDD_DDR | DDR memory interface supply | 1.5 V (DDR3) or 1.35 V (DDR3L) - must be sequenced after VDD_SOC and before VDD_ARM during power-up |
| BOOT_MODE[1:0] | Boot configuration pins | Strapped at reset to select boot source (eMMC, NAND, SPI NOR, or SD card) - critical for fail-safe recovery in telematics modules |
| CAN1_TX / CAN1_RX | FlexCAN controller channel 1 | Differential signaling pair compliant with ISO 11898-2 - connects directly to external CAN transceiver without level-shifting |
| HDMI_CEC / HDMI_SCL / HDMI_SDA | HDMI interface control | Open-drain I²C-compatible signals for CEC command routing and DDC communication with display panels |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Hardware-managed DVFS and power gating across CPU, GPU, VPU, and IPU domains - achieves <500 mW idle power in ASIL-B-compliant sleep states |
| Multi-Display Support | Simultaneous drive of four independent displays (HDMI 1.4 + dual LVDS + MIPI DSI) at aggregate 450 Mpixels/sec - enables digital cockpit with HUD, cluster, and center stack |
| Camera Interface Flexibility | Parallel CSI (20-bit @ 240 MHz) + MIPI CSI-2 (4-lane @ 800 Mbps/lane) - supports front ADAS camera and surround-view stitching in single SoC |
| Secure Boot Chain | A-HABv4 with SHA-256, 2048-bit RSA, version control, and warm-boot capability - enforces signed firmware images and prevents rollback attacks |
| Thermal Management | Integrated die temperature sensor + SNVS-controlled thermal throttling - maintains operation within −40°C to +125°C junction range without external monitoring IC |
Applications
| Automotive Instrument Cluster | Infotainment Head Unit |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, fuel, and ADAS warnings on TFT-LCD with animated transitions. IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS, managing GPU/VPU compositing and CAN bus telemetry ingestion. Use Value: Dual IPUv3H units perform hardware-accelerated overlay blending and resolution scaling - enabling 60 Hz refresh with zero CPU load on critical gauge rendering paths. |
Use Scenario: Concurrent playback of navigation voice guidance, Bluetooth telephony, and high-bitrate music streaming while decoding live traffic video. IC Role / Device Role / Timing Role: Central multimedia hub coordinating eMMC storage, HDMI output, USB OTG, and dual-band Wi-Fi/BT coexistence via shared SDIO interface. Use Value: Dedicated VPU offloads 1080p H.264 decode from CPU cores - preserving >70% CPU bandwidth for real-time speech recognition and map rendering. |
| Digital Rear-View Mirror | Telematics Control Unit (TCU) |
Use Scenario: Low-latency processing of wide-angle camera feed with dynamic contrast enhancement and mirror distortion correction. IC Role / Device Role / Timing Role: Vision-processing SoC performing ISP pipeline (demosaic, denoise, gamma) using IPUv3H and ASRC for audio-video sync with backup chime. Use Value: Hardware ASRC converts microphone sample rate (48 kHz) to display audio path (44.1 kHz) - eliminates software resampling jitter in safety-critical alert generation. |
Use Scenario: Secure vehicle-to-cloud connectivity with OTA firmware updates, GNSS positioning, and cellular modem management. IC Role / Device Role / Timing Role: Secure host processor managing CAAM-encrypted firmware downloads, SNVS-backed secure RTC, and dual CAN gateways for body/EPS networks. Use Value: CAAM's 16 KB secure RAM stores decryption keys isolated from main memory - meeting UNECE R156 cybersecurity management system (CSMS) audit requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive multimedia processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6Q5AVT10AD | Same i.MX 6Quad core, 1 GHz, but rated for −40°C to +105°C (industrial grade) and lacks automotive qualification documentation | Not certified for ASIL-B systems; no AEC-Q100 Grade 2 validation or automotive PPAP support | Select only for non-safety-critical infotainment sub-systems where extended temperature margin is unnecessary |
| MCIMX8MQ5CVAD8A | Arm Cortex-A53 quad-core (1.5 GHz), Vivante GC7000Lite GPU, no VPU - uses 14 nm process vs. 40 nm for MCIMX6Q6AVT10AE | Supports Android 11+ and Vulkan 1.1 but lacks hardware H.265 decode and ASIL-B-ready boot ROM | Choose for next-gen Linux-based IVI with AI inference offload, not for legacy QNX-based clusters requiring pin-compatible migration |
Compared with MCIMX6Q6AVT10AE, MCIMX6Q5AVT10AD omits automotive qualification evidence and thermal derating data, while MCIMX8MQ5CVAD8A shifts to a new architecture with higher performance but breaks backward compatibility in boot flow, memory mapping, and peripheral register layout - making it unsuitable for drop-in replacement in certified production programs.
Availability
MCIMX6Q6AVT10AE is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply through 2030 and beyond.
Supply support for MCIMX6Q6AVT10AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of automotive IC heritage and AEC-Q100 qualified product lines.
The i.MX 6 series was designed specifically for automotive infotainment and digital cockpit applications, integrating multimedia acceleration, functional safety features, and automotive-grade reliability into a single SoC platform - with MCIMX6Q6AVT10AE representing the highest-performance automotive-qualified variant.
FAQ
What is the maximum operating junction temperature for MCIMX6Q6AVT10AE?
The MCIMX6Q6AVT10AE is qualified for automotive temperature grade A (−40°C to +125°C junction). Its thermal design requires heatsink attachment to the lid and PCB copper pour under the package to maintain ≤125°C under sustained 1 GHz CPU + GPU + VPU load. Thermal throttling activates at 115°C to preserve reliability.
Does MCIMX6Q6AVT10AE support secure boot with cryptographic verification?
Yes, MCIMX6Q6AVT10AE implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, version control, and warm-boot capability. The boot ROM validates signed firmware images stored in eMMC or NAND before execution - enforced by CSU and CAAM hardware blocks.
Can MCIMX6Q6AVT10AE drive multiple displays simultaneously?
Yes, MCIMX6Q6AVT10AE supports up to four concurrent displays: one HDMI 1.4 port, two LVDS channels (each up to WUXGA@60Hz), one MIPI DSI (2-lane @ 1 Gbps), and one parallel RGB interface. Total pixel throughput reaches 450 Mpixels/sec at 24 bpp - verified in NXP's i.MX 6Quad SABRE Auto reference design.
What memory types does MCIMX6Q6AVT10AE support via its MMDC interface?
MCIMX6Q6AVT10AE supports DDR3-1066, DDR3L-1066, and LPDDR2-800 via its 64-bit MMDC interface. It also supports interleaved mode for dual x32 LPDDR2 configurations. External NOR Flash, NAND Flash (with BCH up to 40-bit ECC), PSRAM, and OneNAND are supported through the GPMI and EIM peripherals.
Is MCIMX6Q6AVT10AE pin-compatible with other i.MX 6Quad variants like MCIMX6Q4AVT10AE?
Yes, MCIMX6Q6AVT10AE shares identical FCPBGA-624 pinout and ball assignment with all i.MX 6Quad automotive variants (e.g., MCIMX6Q4AVT10AE, MCIMX6Q6AVT08AE). Differences are limited to fuse settings, VPU inclusion, and speed binning - allowing same PCB layout across speed and feature SKUs.
MCIMX6Q6AVT10AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6Q6AVT10AE FAQ
1.How can I place an order for MCIMX6Q6AVT10AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6Q6AVT10AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6Q6AVT10AE reliable?
The price and inventory of MCIMX6Q6AVT10AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6Q6AVT10AE is usually 5 days.
3.What payment methods are accepted for MCIMX6Q6AVT10AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6Q6AVT10AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6Q6AVT10AE?
MCIMX6Q6AVT10AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6Q6AVT10AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6Q6AVT10AE?
For technical support, including MCIMX6Q6AVT10AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6Q6AVT10AE requirements.
6.How does Aetrix verify that MCIMX6Q6AVT10AE is sourced from the original manufacturer or authorized distributors?
All MCIMX6Q6AVT10AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6Q6AVT10AE meets industry standards.
7.What is the process for return or replacement of MCIMX6Q6AVT10AE?
All MCIMX6Q6AVT10AE units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6Q6AVT10AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6Q6AVT10AE part is unused and in its original packaging.
Return procedure for MCIMX6Q6AVT10AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6Q6AVT10AE Tags
-
AT91SAM9260B-CU-999
Microchip Technology
-
AT91SAM9G25-CU
Microchip Technology
-
ATSAMA5D27C-CU
Microchip Technology
-
AT91SAM9X35-CU
Microchip Technology
-
AT91SAM9X25-CU
Microchip Technology
-
MCIMX6Y2CVM08AB
NXP Semiconductors
.JPG)
-
AM3352BZCZ100
Texas Instruments
-
AT91SAM9260B-CU
Microchip Technology
-
AT91SAM9260B-QU
Microchip Technology
-
ATSAMA5D31A-CU
Microchip Technology
-
AT91SAM9G20B-CU-999
Microchip Technology
-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
