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NXP Semiconductors MCIMX6QP4AVT8AB

Part No.:
MCIMX6QP4AVT8AB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
624-FBGA, FCBGA
Datasheet:
AetrixMCIMX6QP4AVT8AB.pdf
Description:
IC MPU I.MX6QP 1.0GHZ 624FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,793

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Product details

Overview

MCIMX6QP4AVT8AB from NXP Semiconductors is an automotive-grade i.MX 6QuadPlus applications processor featuring four Arm Cortex-A9 cores operating at 852 MHz, integrated OpenGL ES 3.0 3D GPU (198 MTri/s), dual image processing units (IPUv3H), and hardware video processing for 1080p decode/encode. It targets reconfigurable instrument clusters and high-performance infotainment systems in vehicles.

For engineers reviewing the MCIMX6QP4AVT8AB datasheet, MCIMX6QP4AVT8AB pinout, MCIMX6QP4AVT8AB application, or MCIMX6QP4AVT8AB equivalent, key selection considerations include its FCPBGA-624 package, automotive temperature range (−40°C to +125°C), DDR3/DDR3L/LPDDR2 memory interface, dual FlexCAN 1 Mbps interfaces, and support for HDMI 1.4, MIPI DSI/CSI-2, and Gigabit Ethernet with IEEE 1588.

Technical Context

The MCIMX6QP4AVT8AB implements a symmetric quad-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor. Its SoC-level architecture integrates dedicated accelerators including VPU, GPU3Dv6, GPU2Dv3, GPUVG, ASRC, and CAAM with 16 KB secure RAM.

It supports dynamic voltage and frequency scaling (DVFS), smart speed power management, and multiple low-power states. Memory subsystem includes boot ROM (96 KB), OCRAM (512 KB), secure/non-secure RAM (16 KB), and external interfaces for DDR3-1066, LPDDR2-800, NAND Flash (with BCH up to 40-bit ECC), NOR Flash, and eMMC 4.41.

Key Specifications

ParameterValue and Actual Design Meaning
CPU Core4× Arm Cortex-A9 @ 852 MHz - Enables concurrent real-time HMI rendering, media decoding, and vehicle network processing
GPUOpenGL ES 3.0 3D GPU (198 MTri/s) - Supports complex 3D instrument cluster graphics with OpenCL acceleration
Memory Interface64-bit DDR3/DDR3L/LPDDR2 up to 1066/800 MHz - Delivers >6.4 GB/s bandwidth for multi-display pixel pipelines
Video AccelerationHardware VPU + dual IPUv3H - Enables simultaneous 1080p decode + encode + image enhancement without CPU load
Automotive InterfacesDual FlexCAN 1 Mbps + MLB 150 Mbps + ESAI audio - Meets ASAM/ISO 26262-compliant vehicle network and audio subsystem requirements
SecurityCAAM (16 KB secure RAM), A-HAB v4, TrustZone, SNVS RTC - Provides secure boot, encrypted storage, and runtime integrity for OTA updates
PackageFCPBGA-624, 21 × 21 mm, 0.8 mm pitch, lidded - Automotive-qualified mechanical form factor with thermal lid for under-hood deployment
Temperature Range−40°C to +125°C junction - Validated for engine bay proximity and dashboard-mounted infotainment operation

Pinout & Package

MCIMX6QP4AVT8AB is housed in a 21 mm × 21 mm FCPBGA package with 624 balls and 0.8 mm pitch. The lidded construction provides enhanced thermal dissipation and mechanical protection required for automotive environments.

Pin/TerminalCircuit RoleDesign Meaning
VDD_ARMCore Power Supply1.2 V ±3% supply for Arm Cortex-A9 cores and L1/L2 caches; requires low-noise regulation
VDD_SOCSoC Logic Power1.1 V ±3% supply for interconnect, peripherals, and GPU; decoupled separately from VDD_ARM
VDD_DDRDDR Memory Interface1.35 V (DDR3L) or 1.5 V (DDR3) supply; must meet tight slew rate and noise specs per JEDEC
CLKIN_24MPrimary Oscillator Input24 MHz crystal input mandatory for USB PHY clocking and system timing reference
CAN1_TX / CAN1_RXFlexCAN Channel 1Differential pair supporting ISO 11898-2 compliant 1 Mbps CAN FD-ready physical layer
HDMI_TX_CLK / HDMI_TX_DATA[0:3]HDMI 1.4 TransmitterTMDS clock and data lanes; require controlled impedance routing and ESD protection

Key Features

FeatureDesign Value
Quad-core Cortex-A9 with TrustZoneEnables secure separation of instrument cluster UI (non-secure world) and safety-critical firmware (secure world)
Triple GPU architecture (3D/2D/OpenVG)Allows concurrent rendering of vector-based gauges (OpenVG), bitmap overlays (2D), and 3D terrain maps (3D)
Dual independent IPUv3H unitsPermits simultaneous camera feed preprocessing (e.g., distortion correction) and display composition (e.g., split-screen HUD)
ASRC with 10-channel conversionSupports synchronized multi-source audio (e.g., Bluetooth call + navigation voice + cabin mic) at differing sample rates
CAAM with NIST-certified PRNGMeets FIPS 140-2 Level 2 requirements for cryptographic key generation and secure boot validation
PCIe v2.0 x1 endpoint/rootEnables direct connection to automotive radar processors or cellular modems without bridge IC overhead

Applications

Reconfigurable Instrument ClusterHigh-Performance Infotainment

Use Scenario: Digital cockpit with dynamic gauge layout, ADAS warnings, and driver attention monitoring.

IC Role / Device Role / Timing Role: Primary application processor executing QNX or Android Automotive OS, managing real-time display compositing and CAN message aggregation.

Use Value: Dual IPUv3H enables simultaneous camera-in-the-loop processing and 60 Hz WUXGA rendering; 852 MHz clock ensures deterministic response under full HMI load.

Use Scenario: Central infotainment unit supporting rear-seat entertainment, wireless CarPlay/Android Auto, and over-the-air map updates.

IC Role / Device Role / Timing Role: Main SoC handling multimedia decode, touch UI, Bluetooth/Wi-Fi coexistence, and secure OTA update verification.

Use Value: Hardware VPU offloads 1080p HEVC decode from CPU; CAAM accelerates AES-256 decryption of signed firmware images.

Multi-Display Head-Up Display (HUD)Vehicle Connectivity Gateway

Use Scenario: Augmented reality HUD projecting navigation cues onto windshield with real-time sensor fusion.

IC Role / Device Role / Timing Role: Graphics-intensive compute node driving MIPI DSI to HUD controller while ingesting CAN/LIN sensor data.

Use Value: OpenGL ES 3.0 GPU renders 3D AR overlays with depth-aware occlusion; ASRC synchronizes HUD audio alerts with vehicle speed pulses.

Use Scenario: In-vehicle gateway bridging CAN FD, Ethernet AVB, and LTE modem for cloud telemetry and remote diagnostics.

IC Role / Device Role / Timing Role: Secure network hub performing protocol translation, firewall filtering, and encrypted tunneling between domains.

Use Value: Dual FlexCAN ports handle chassis and powertrain networks; PCIe v2.0 connects to LTE module for <50 ms latency telemetry upload.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive applications processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCIMX6QP6AVT8ABFull-featured variant with VPU enabled; same 852 MHz speed grade and packageRequired for applications needing hardware-accelerated video encode (e.g., dashcam recording)Select MCIMX6QP6AVT8AB when VPU functionality is needed; MCIMX6QP4AVT8AB disables VPU to reduce power and cost
MCIMX6QP4AVT1ABSame feature set but rated for 1 GHz operation (996 MHz with 24 MHz crystal)Suitable for compute-bound workloads like AI-based driver monitoring or multi-zone audio DSPChoose MCIMX6QP4AVT1AB only if higher CPU throughput is validated necessary; thermal design must accommodate increased power

Compared with MCIMX6QP4AVT8AB, MCIMX6QP6AVT8AB adds VPU capability for video encode while maintaining identical pinout and thermal profile, whereas MCIMX6QP4AVT1AB increases CPU performance by ~17% at the cost of higher junction temperature and stricter cooling requirements.

Availability

MCIMX6QP4AVT8AB is available at Aetrix Electronics and suitable for reconfigurable instrument clusters, high-performance infotainment systems, and multi-display head-up displays requiring stable component supply across automotive production lifecycles.

Supply support for MCIMX6QP4AVT8AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 6QuadPlus product line was designed specifically for automotive human-machine interface (HMI) applications demanding high graphics throughput, functional safety readiness, and long-term supply stability in harsh environments.

FAQ

What is the maximum operating frequency of the MCIMX6QP4AVT8AB?

The MCIMX6QP4AVT8AB is rated for 852 MHz operation. This speed grade is guaranteed under automotive temperature conditions (−40°C to +125°C) when using the required 24 MHz crystal input for USB and system timing. Attempting to run above this frequency violates the qualified specification and may cause instability or thermal shutdown.

Does the MCIMX6QP4AVT8AB include hardware video encoding capability?

No, the MCIMX6QP4AVT8AB is the "no VPU" variant of the i.MX 6QuadPlus family. Its video processing unit (VPU) is disabled in silicon. For hardware-accelerated video encode (e.g., H.264/H.265), use MCIMX6QP6AVT8AB, which enables the full VPU feature set while retaining identical package, pinout, and thermal characteristics.

What package type and ball count does the MCIMX6QP4AVT8AB use?

The MCIMX6QP4AVT8AB uses a 21 mm × 21 mm FCBGA package with 624 solder balls and 0.8 mm pitch. It is lidded for improved thermal dissipation and mechanical robustness, meeting automotive qualification standards for vibration and thermal cycling reliability.

Which automotive communication interfaces are integrated into the MCIMX6QP4AVT8AB?

The MCIMX6QP4AVT8AB integrates two FlexCAN 2.0B controllers (1 Mbps each), one MLB 150 Mbps interface, and an ESAI audio interface supporting up to 260 kHz sampling. These interfaces enable direct connection to vehicle networks, MOST-based audio systems, and multi-channel digital audio codecs without external transceivers.

Is the MCIMX6QP4AVT8AB qualified for ASIL-B or higher functional safety levels?

The MCIMX6QP4AVT8AB itself is not ASIL-certified, but it includes hardware features-such as lockstep-capable peripherals, memory ECC, watchdog timers, and secure boot-that support ASIL-B system-level compliance when implemented per ISO 26262 guidelines. NXP provides safety manuals and FMEDA reports to assist in qualifying end-system designs.

MCIMX6QP4AVT8AB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
624-FBGA, FCBGA
Series:
i.MX6QP
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
4 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Supplier Device Package:
624-FCBGA (21x21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

MCIMX6QP4AVT8AB FAQ

1.How can I place an order for MCIMX6QP4AVT8AB through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6QP4AVT8AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6QP4AVT8AB reliable?

The price and inventory of MCIMX6QP4AVT8AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6QP4AVT8AB is usually 5 days.

3.What payment methods are accepted for MCIMX6QP4AVT8AB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6QP4AVT8AB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6QP4AVT8AB?

MCIMX6QP4AVT8AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6QP4AVT8AB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6QP4AVT8AB?

For technical support, including MCIMX6QP4AVT8AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6QP4AVT8AB requirements.

6.How does Aetrix verify that MCIMX6QP4AVT8AB is sourced from the original manufacturer or authorized distributors?

All MCIMX6QP4AVT8AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6QP4AVT8AB meets industry standards.

7.What is the process for return or replacement of MCIMX6QP4AVT8AB?

All MCIMX6QP4AVT8AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6QP4AVT8AB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6QP4AVT8AB part is unused and in its original packaging.

Return procedure for MCIMX6QP4AVT8AB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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