NXP Semiconductors MCIMX6QP5EYM1AB
- Part No.:
- MCIMX6QP5EYM1AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA, FCBGA
- Datasheet:
-
MCIMX6QP5EYM1AB.pdf
- Description:
- IC MPU I.MX6QP 1.0GHZ 624FCPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:120
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Product details
Overview
MCIMX6QP5EYM1AB from NXP Semiconductors is a quad-core Arm Cortex-A9 applications processor operating at 1 GHz, featuring integrated VPU, GPU3D (OpenGL ES 3.0), GPU2D, and OpenVG 1.1 accelerators, with 1 MB L2 cache, DDR3/DDR3L/LPDDR2 memory interface, and support for HDMI 1.4, MIPI DSI/CSI-2, and Gigabit Ethernet - deployed in high-end portable media players and industrial HMI systems.
For engineers reviewing the MCIMX6QP5EYM1AB datasheet, MCIMX6QP5EYM1AB pinout, MCIMX6QP5EYM1AB application, or MCIMX6QP5EYM1AB equivalent, key selection considerations include its 21 × 21 mm FCPBGA package, extended commercial temperature range (–20°C to +105°C), dual CAN 2.0B interfaces, hardware-accelerated video decode up to 1080p, and TrustZone-enabled secure boot architecture.
Technical Context
The MCIMX6QP5EYM1AB implements a symmetric 4× Arm Cortex-A9 MPCore cluster with private L1 caches (32 KB I/D per core), shared 1 MB L2 cache, SCU, GIC supporting 128 interrupts, and NEON MPE co-processor - all clocked at 1 GHz under extended commercial conditions. It integrates dedicated multimedia accelerators including VPU, dual IPUv3H, GPU3Dv6, GPU2Dv3, and GPUVG.
Its system-level architecture includes MMDC supporting DDR3-1066/DDR3L-1066/LPDDR2-800, four uSDHC ports (UHS-I SDR-104), PCIe v2.0 x1 root/endpoint, dual FlexCAN 1 Mbps controllers, and CAAM with 16 KB secure RAM - all managed via CCM/GPC/SRC power and clock subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 4× Arm Cortex-A9 @ 1 GHz - enables concurrent OS, UI, and media tasks without software scheduling bottlenecks. |
| L2 Cache | 1 MB unified - reduces off-chip memory traffic and improves deterministic latency for real-time display pipelines. |
| Graphics Units | GPU3D (OpenGL ES 3.0), GPU2D, GPUVG - delivers hardware-accelerated 2D compositing, 3D rendering, and vector graphics for responsive HMI. |
| Video Processing | VPU + dual IPUv3H - supports 1080p60 encode/decode and parallel image processing for multi-camera systems. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 up to 1066 MHz - provides ≥8.5 GB/s bandwidth for high-resolution display and video buffers. |
| Package | FCPBGA, 21 × 21 mm, 0.8 mm pitch, non-lidded - compatible with standard PCB assembly processes and thermal management for embedded enclosures. |
| Temperature Grade | Extended commercial (–20°C to +105°C junction) - validated for fanless industrial panels and automotive infotainment head units. |
Pinout & Package
MCIMX6QP5EYM1AB is housed in a 21 × 21 mm FCPBGA package with 521 solder balls (non-lidded), designed for high-density routing and thermal dissipation in compact embedded systems. Pin assignments follow the i.MX 6QuadPlus signal naming convention defined in IMX6DQPCEC Rev. 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN_24M | Primary oscillator input | 24 MHz reference required for USB PHY operation and system clock derivation; deviation >±50 ppm invalidates HS USB compliance. |
| VDD_ARM | Core voltage supply | 1.2 V ±3% regulated input powering Cortex-A9 cores and L1/L2 caches; requires low-noise, high-PSRR LDO or DC-DC. |
| VDD_SOC | SoC logic voltage | 1.1 V ±3% supply for MMDC, GPC, CCM, and interconnect fabric - critical for DDR timing stability and boot reliability. |
| BOOT_MODE[1:0] | Boot configuration strap | Pulled high/low at power-on to select boot device (eMMC, NAND, SPI NOR, or SD); latched before internal ROM execution begins. |
| ENET_RXD[3:0] | Gigabit Ethernet receive data | LVDS-compatible inputs for IEEE 802.3ab 1000BASE-T PHY interface; require controlled impedance (100 Ω differential) routing. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone Security | Hardware-enforced isolation between secure/non-secure worlds - enables certified DRM, secure boot (A-HABv4), and CAAM-protected key storage. |
| DVFS Support | Dynamic voltage/frequency scaling across CPU, GPU, and VPU domains - reduces active power by up to 40% during audio-only playback vs. full UI load. |
| Multi-display Engine | Simultaneous drive of up to four displays (HDMI + LVDS + MIPI DSI + parallel RGB) at combined 450 Mpixels/sec - eliminates external TCON for multi-screen kiosks. |
| NAND ECC | BCH40 error correction engine - corrects up to 40-bit errors per 1 KB page, enabling reliable use of cost-optimized MLC NAND in industrial logging systems. |
| ASRC Audio Engine | 10-channel asynchronous sample rate conversion - allows simultaneous playback of Bluetooth A2DP (44.1 kHz), HDMI audio (48 kHz), and local codec (96 kHz) without software resampling artifacts. |
Applications
| Industrial HMI Panel | Medical Imaging Terminal |
|---|---|
|
Use Scenario: Fanless 15-inch touchscreen panel in factory automation control room, running Linux with Qt-based UI and real-time PLC data overlay. IC Role / Device Role / Timing Role: Primary applications processor executing UI rendering, EtherCAT master stack, and local video diagnostics - synchronized via GPT timers and SNVS RTC. Use Value: GPU3D + GPU2D acceleration ensures 60 Hz UI refresh with <12 ms input-to-display latency; VPU decodes diagnostic ultrasound clips without CPU load. |
Use Scenario: Portable ultrasound imaging workstation with dual 1080p displays: one for live B-mode scan, one for DICOM annotation and PACS upload. IC Role / Device Role / Timing Role: Central SoC managing MIPI CSI-2 camera sensor input, HDMI output, eMMC storage, and Gigabit Ethernet DICOM transfer - coordinated via SDMA and ASRC. Use Value: Dual IPUv3H enables real-time noise reduction and edge enhancement on live scan feed; CAAM encrypts patient data before network transmission. |
| Automotive Infotainment Head Unit | High-End Portable Media Player |
|
Use Scenario: In-dash navigation system with Android Automotive OS, supporting voice assistant, rear-view camera, and wireless CarPlay mirroring. IC Role / Device Role / Timing Role: Applications processor handling Android framework, HAL drivers for FlexCAN (vehicle bus), LVDS display, and USB OTG - booted via A-HABv4 from eMMC. Use Value: Hardware-accelerated OpenGL ES 3.0 renders smooth 3D map navigation; dual FlexCAN interfaces connect to instrument cluster and ADAS modules. |
Use Scenario: 4K-capable portable media player with HDMI-out, dual-band Wi-Fi, and 12-hour battery life - decoding HEVC/H.265 content from microSD. IC Role / Device Role / Timing Role: Media-centric SoC executing VPU decode, GPU2D compositing of subtitles/UI, and uSDHC DMA transfers - managed by DVFS and smart power gating. Use Value: VPU supports 4K30 decode with <300 mW power draw; LPDDR2-800 interface enables fast buffer swapping for seamless chapter transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP5EVT2AB | 1.2 GHz speed grade, lidded FCPBGA package, same temperature grade - higher peak CPU throughput but requires 24 MHz clock derating to 996 MHz for USB compliance. | Preferred for compute-bound workloads (e.g., multi-stream transcoding) where thermal headroom allows sustained 1.2 GHz operation. | Select when >1 GHz deterministic performance is required and board layout accommodates lid-based thermal solution. |
| i.MX 8M Mini (NXP MMC845A) | Arm Cortex-A53 quad-core @ 1.8 GHz, integrated GC7000Lite GPU, 2 GB LPDDR4 support, and updated security (SECO firmware) - newer architecture with lower idle power. | Better suited for next-gen designs requiring AI inference (via NN accelerator), USB 3.0, and long-term roadmap support beyond 2027. | Choose for new designs prioritizing longevity, AI-ready toolchain, and lower active power - not drop-in compatible due to pinout and boot changes. |
Compared with MCIMX6QP5EYM1AB, MCIMX6QP5EVT2AB offers higher clock headroom at the cost of thermal complexity, while i.MX 8M Mini provides architectural modernization and AI readiness but requires full hardware redesign and software migration.
Availability
MCIMX6QP5EYM1AB is available at Aetrix Electronics and suitable for industrial HMI panels, medical imaging terminals, and automotive infotainment head units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6QP5EYM1AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6QuadPlus product line was engineered for graphics-intensive embedded applications demanding high-performance CPU, GPU, and VPU integration within a single die - targeting human-machine interfaces, portable media, and industrial control systems.
FAQ
What is the maximum DDR3 speed supported by MCIMX6QP5EYM1AB?
The MCIMX6QP5EYM1AB supports DDR3-1066 (532 MHz) operation with 64-bit bus width, delivering up to 8.5 GB/s theoretical bandwidth. This is confirmed in Section 4.10 (MMDC) of IMX6DQPCEC Rev. 3. The controller also supports DDR3L-1066 and LPDDR2-800, with interleaving modes enabled for dual-channel configurations. System-level timing validation must account for board-level signal integrity and VDD_SOC regulation stability.
Does MCIMX6QP5EYM1AB support secure boot, and how is it implemented?
Yes, MCIMX6QP5EYM1AB implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, and version control. Secure boot is enforced by the Boot ROM using fuses programmed via OCOTP, with CAAM providing secure key storage and CSU locking security policy registers at reset. This flow is detailed in the i.MX 6Dual/6Quad Security Reference Manual (IMX6DQ6SDLSRM).
Can MCIMX6QP5EYM1AB drive multiple displays simultaneously, and what interfaces are available?
Yes, MCIMX6QP5EYM1AB supports up to four concurrent displays: one HDMI 1.4 port, one LVDS dual-channel port (up to WUXGA), one MIPI DSI (2-lane, 1 Gbps), and one parallel RGB (24-bit, up to 225 Mpixels/sec). Total raw pixel throughput reaches 450 Mpixels/sec at 24 bpp, as specified in Section 1.2 of IMX6DQPCEC Rev. 3. Display synchronization is managed via LDB and IPUv3H modules.
What is the role of the CAAM module in MCIMX6QP5EYM1AB, and how much secure memory does it provide?
The Cryptographic Acceleration and Assurance Module (CAAM) in MCIMX6QP5EYM1AB performs AES-128/256, DES/3DES, SHA-1/256, and RSA operations with NIST-certified PRNG. It includes 16 KB of dedicated secure RAM for key storage and cryptographic context - isolated from general memory space and accessible only via secure world software. This is documented in Section 1.2 and Table 2 of IMX6DQPCEC Rev. 3.
Is MCIMX6QP5EYM1AB pin-compatible with other i.MX 6QuadPlus variants like MCIMX6QP5EVT2AB?
Yes, MCIMX6QP5EYM1AB and MCIMX6QP5EVT2AB share identical 521-ball FCPBGA footprint and signal mapping per IMX6DQPCEC Rev. 3 Section 6.2, differing only in thermal lid presence (non-lidded vs. lidded) and speed grade (1.0 GHz vs. 1.2 GHz). Both use YM suffix for non-lidded packages and AB suffix for extended commercial temperature grade, confirming mechanical and electrical compatibility for drop-in replacement in thermally constrained layouts.
MCIMX6QP5EYM1AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA, FCBGA
- Series:
- i.MX6QP
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3L, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCPBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6QP5EYM1AB FAQ
1.How can I place an order for MCIMX6QP5EYM1AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6QP5EYM1AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6QP5EYM1AB reliable?
The price and inventory of MCIMX6QP5EYM1AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6QP5EYM1AB is usually 5 days.
3.What payment methods are accepted for MCIMX6QP5EYM1AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6QP5EYM1AB transactions.
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4.How is shipping managed for MCIMX6QP5EYM1AB?
MCIMX6QP5EYM1AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6QP5EYM1AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6QP5EYM1AB?
For technical support, including MCIMX6QP5EYM1AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6QP5EYM1AB requirements.
6.How does Aetrix verify that MCIMX6QP5EYM1AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6QP5EYM1AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6QP5EYM1AB meets industry standards.
7.What is the process for return or replacement of MCIMX6QP5EYM1AB?
All MCIMX6QP5EYM1AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6QP5EYM1AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6QP5EYM1AB part is unused and in its original packaging.
Return procedure for MCIMX6QP5EYM1AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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