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NXP Semiconductors MCIMX6QP6AVT1AB
- Part No.:
- MCIMX6QP6AVT1AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6QP6AVT1AB.pdf
- Description:
- IC MPU I.MX6QP 1.0GHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,552
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Product details
Overview
MCIMX6QP6AVT1AB from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor operating at 1 GHz, featuring integrated 3D/2D/OpenVG graphics accelerators, dual FlexCAN interfaces, HDMI 1.4, MIPI CSI-2/DSI, and 10/100/1000 Mbps Ethernet - deployed in reconfigurable instrument clusters and high-performance infotainment systems.
For engineers reviewing the MCIMX6QP6AVT1AB datasheet, MCIMX6QP6AVT1AB pinout, MCIMX6QP6AVT1AB application, or MCIMX6QP6AVT1AB equivalent, key selection considerations include automotive temperature grade (−40°C to +125°C), FCPBGA 21×21 mm package with 0.8 mm pitch, DDR3/DDR3L/LPDDR2 memory interface, and hardware-accelerated video processing with VPU and dual IPUv3H units.
Technical Context
The MCIMX6QP6AVT1AB implements a symmetric 4-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor - all running at up to 1 GHz under automotive thermal conditions. It integrates eight PLLs for domain-specific clock generation and supports dynamic voltage and frequency scaling (DVFS) across multiple power domains.
Its system architecture includes dedicated hardware accelerators: VPU for H.264/H.265 decode/encode, dual IPUv3H for image scaling/compositing, GPU3Dv6 (OpenGL ES 3.0), GPU2Dv3, and GPUVG - coordinated via a multi-layer AXI/AMBA interconnect fabric with Smart DMA (SDMA) for offloading peripheral data movement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 @ 1 GHz - delivers deterministic real-time response for safety-critical automotive UI rendering and concurrent OS tasks. |
| Graphics Acceleration | GPU3Dv6 (OpenGL ES 3.0, 198 MTri/s), GPU2Dv3, GPUVG - enables simultaneous 3D navigation, 2D overlays, and vector graphics on up to four displays. |
| Video Processing | VPU + dual IPUv3H - supports 1080p60 encode/decode and real-time image enhancement (deinterlacing, color correction, scaling) without CPU load. |
| Memory Interface | 64-bit DDR3/DDR3L-1066 & LPDDR2-800 - provides ≥17 GB/s peak bandwidth for multi-stream video buffering and HMI frame buffers. |
| Automotive Interfaces | Dual FlexCAN 2.0B (1 Mbps), MLB 150 Mbps, ESAI audio - meets ASAM/ISO 26262-compliant communication requirements for instrument cluster integration. |
| Security | CAAM (16 KB secure RAM), SNVS, A-HAB v4, TrustZone - enables secure boot, encrypted firmware updates, and DRM-protected media playback. |
| Package | FCPBGA, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive vibration/shock and thermal cycling per AEC-Q100 Grade 2. |
Pinout & Package
MCIMX6QP6AVT1AB uses a 521-ball FCPBGA package (21 × 21 mm, 0.8 mm pitch, lidded), designed for automotive PCB reliability with controlled impedance routing support and thermal pad grounding. Pin assignments follow standardized signal naming per IMX6 Series Signal Name Map (EB792).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling to maintain timing closure at 1 GHz. |
| VDD_SOC | SoC Logic Power | 1.1 V ±3% supply for L2 cache, GPC, CCM, and interconnect - critical for system-level DVFS coordination. |
| CLKIN_24M | Primary Oscillator Input | 24 MHz crystal reference - mandatory for USB PHY operation and system clock derivation; tolerance ≤±50 ppm. |
| ENET_RXD[3:0] | Gigabit Ethernet Receive Data | LVDS-compatible differential inputs - require matched trace lengths <5 mm and 100 Ω termination for IEEE 802.3 compliance. |
| CAN1_TX / CAN1_RX | FlexCAN Channel 1 Differential Pair | High-speed CAN physical layer interface - connects directly to ISO 11898-2 transceiver with common-mode choke and split termination. |
| CSI_D[3:0] / CSI_CLK | MIPI CSI-2 Data Lanes & Clock | High-speed serial camera interface - operates at up to 1 Gbps/lane; requires AC-coupled differential routing and 100 Ω differential impedance. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Hardware-managed power gating and state retention across CPU, GPU, and VPU domains - reduces active power by >40% vs. fixed-frequency operation in HMI idle states. |
| Multi-Display Support | Simultaneous drive of four independent display interfaces (parallel LCD, HDMI 1.4, LVDS, MIPI DSI) - enables digital cockpit with driver HUD + center stack + rear-seat entertainment. |
| Hardware Security Boot | A-HAB v4 with SHA-256, 2048-bit RSA, and eFUSE-based CSU policy enforcement - prevents unauthorized firmware execution and ensures chain-of-trust from ROM to OS. |
| ASRC Audio Conversion | Asynchronous Sample Rate Converter supporting 10 concurrent channels at ≤−120 dB THD+N - eliminates clock domain jitter between Bluetooth, GPS, and CAN audio sources. |
| PCIe v2.0 x1 Endpoint/Root | Gen2-compliant interface with integrated PHY - enables direct connection to automotive radar processors or NVMe storage without bridge IC. |
Applications
| Reconfigurable Instrument Cluster | High-Performance Infotainment |
|---|---|
Use Scenario: Digital dashboard with real-time vehicle telemetry, ADAS alerts, and animated 3D gauges rendered across multiple zones. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR Adaptive OS, managing display composition via dual IPUv3H, and synchronizing CAN/FlexRay data streams. Use Value: Achieves sub-30 ms latency from sensor input to pixel output using hardware-accelerated graphics pipelines and deterministic interrupt handling. | Use Scenario: In-vehicle multimedia system supporting Android Automotive OS, wireless CarPlay/Android Auto, and multi-zone audio playback. IC Role / Device Role / Timing Role: Central SoC hosting HLOS, driving HDMI/LVDS displays, decoding 4K video via VPU, and managing USB/PCIe peripherals. Use Value: Enables concurrent 1080p video decode, 3D UI rendering, and Bluetooth audio streaming with <5% CPU utilization due to dedicated accelerators. |
| Advanced Driver Assistance Display | Vehicle Connectivity Gateway |
Use Scenario: HUD projection unit overlaying lane departure warnings, blind-spot detection, and navigation arrows onto windshield. IC Role / Device Role / Timing Role: Real-time graphics processor generating AR-rendered content with precise timing alignment to camera feed via MIPI CSI-2 and GPU3Dv6 rasterization. Use Value: Delivers 60 Hz HUD refresh with <12 ms end-to-end pipeline latency using GPU timestamping and hardware compositor synchronization. | Use Scenario: Telematics control unit aggregating cellular, Wi-Fi, Bluetooth, and CAN bus data for OTA updates and remote diagnostics. IC Role / Device Role / Timing Role: Secure gateway SoC performing protocol translation (CAN ↔ TCP/IP), TLS encryption via CAAM, and secure firmware validation via A-HAB. Use Value: Meets UNECE R155 cybersecurity management system (CSMS) requirements through hardware-enforced secure boot and runtime attestation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP6AVT1AA | Lidded FCPBGA package vs. MCIMX6QP6AVT1AB's non-lidded variant - identical electrical specs and thermal resistance profile. | Same automotive temperature grade and feature set - differs only in mechanical lid presence for enhanced board-level EMI shielding. | Select MCIMX6QP6AVT1AA when EMI-sensitive cabin environments require additional RF isolation; otherwise MCIMX6QP6AVT1AB offers lower cost and equivalent performance. |
| MCIMX8MQ5CVAD8A | Arm Cortex-A53 quad-core @ 1.5 GHz, Vivante GC7000Lite GPU, no VPU - newer i.MX 8M Quad with updated security (SECO), but lacks dual IPUv3H and ASRC. | Targets next-gen infotainment with Linux-based HLOS; not drop-in compatible due to different pinout, DDR4 support, and missing FlexCAN/MLB interfaces. | Choose MCIMX8MQ5CVAD8A for long-term roadmap designs requiring Armv8-A, but retain MCIMX6QP6AVT1AB for legacy automotive platforms needing proven ASIL-B-capable peripherals and toolchain continuity. |
Compared with MCIMX6QP6AVT1AA, MCIMX6QP6AVT1AB offers identical functionality at lower BOM cost without lid; versus MCIMX8MQ5CVAD8A, it provides mature automotive interface support (FlexCAN, MLB, ESAI) and hardware video acceleration not present in the i.MX 8M series - making it optimal for production instrument clusters requiring ASIL-B compliance and 10+ year lifecycle assurance.
Availability
MCIMX6QP6AVT1AB is available at Aetrix Electronics and suitable for reconfigurable instrument clusters, high-performance infotainment systems, and advanced driver assistance displays requiring stable component supply across extended automotive product lifecycles.
Supply support for MCIMX6QP6AVT1AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications - with deep expertise in Arm-based application processors and automotive functional safety.
The i.MX 6DualPlus/6QuadPlus product line was engineered specifically for automotive human-machine interfaces, delivering graphics-rich, real-time, and ASIL-B-capable processing in harsh environmental conditions - with MCIMX6QP6AVT1AB representing the full-featured 1 GHz automotive variant.
FAQ
What is the maximum operating junction temperature for MCIMX6QP6AVT1AB?
The MCIMX6QP6AVT1AB is rated for automotive temperature grade A, with a specified junction temperature range of −40°C to +125°C. This rating is validated per AEC-Q100 Grade 2 requirements and applies under full 1 GHz operation with appropriate PCB thermal design - including use of the exposed thermal pad and recommended copper pour per NXP AN5307.
Does MCIMX6QP6AVT1AB support secure boot with cryptographic verification?
Yes, MCIMX6QP6AVT1AB implements Advanced High Assurance Boot (A-HAB) v4 with SHA-256 hashing, 2048-bit RSA signature verification, and eFUSE-based Central Security Unit (CSU) policy enforcement. The boot ROM validates signed images before loading, ensuring only authenticated firmware executes - a foundational requirement for ISO/SAE 21434 and UNECE R155 compliance.
What display interfaces does MCIMX6QP6AVT1AB natively support?
MCIMX6QP6AVT1AB supports five native display interfaces: one parallel 24-bit LCD port (up to WUXGA@60Hz), one HDMI 1.4 port, two LVDS ports (combined up to WUXGA@60Hz), and one MIPI DSI interface (2 lanes, up to 1 Gbps/lane). All can be active simultaneously with hardware compositor support via dual IPUv3H units.
Can MCIMX6QP6AVT1AB decode H.265 video in hardware?
Yes, MCIMX6QP6AVT1AB includes a dedicated Video Processing Unit (VPU) capable of hardware-accelerated decode of H.265 Main/Main10 profiles up to 1080p60 resolution. This offloads the Arm Cortex-A9 cores entirely, enabling concurrent video playback, UI rendering, and CAN bus monitoring without performance degradation.
Is MCIMX6QP6AVT1AB pin-compatible with other i.MX 6QuadPlus variants like MCIMX6QP4AVT1AB?
No, MCIMX6QP6AVT1AB is not pin-compatible with MCIMX6QP4AVT1AB. While both use the same 521-ball FCPBGA package, the "6" suffix denotes full-featured silicon with VPU, GPU, and MLB enabled, whereas the "4" suffix indicates a reduced-feature variant where those blocks are fused off - resulting in different ball functionality assignments and incompatible power/ground pin configurations.
MCIMX6QP6AVT1AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6QP
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, DDR3L, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6QP6AVT1AB FAQ
1.How can I place an order for MCIMX6QP6AVT1AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6QP6AVT1AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6QP6AVT1AB reliable?
The price and inventory of MCIMX6QP6AVT1AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6QP6AVT1AB is usually 5 days.
3.What payment methods are accepted for MCIMX6QP6AVT1AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6QP6AVT1AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6QP6AVT1AB?
MCIMX6QP6AVT1AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6QP6AVT1AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6QP6AVT1AB?
For technical support, including MCIMX6QP6AVT1AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6QP6AVT1AB requirements.
6.How does Aetrix verify that MCIMX6QP6AVT1AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6QP6AVT1AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6QP6AVT1AB meets industry standards.
7.What is the process for return or replacement of MCIMX6QP6AVT1AB?
All MCIMX6QP6AVT1AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6QP6AVT1AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6QP6AVT1AB part is unused and in its original packaging.
Return procedure for MCIMX6QP6AVT1AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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