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NXP Semiconductors MCIMX6QP6AVT1ABR
- Part No.:
- MCIMX6QP6AVT1ABR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6QP6AVT1ABR.pdf
- Description:
- I.MX 6 SERIES 32-BIT MPU, QUAD A
- Quantity:
- Payment:
- Shipping:
Inventory:1,762
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Product details
Overview
MCIMX6QP6AVT1ABR from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor operating at 1 GHz, featuring integrated VPU, GPU3D (OpenGL ES 3.0), GPU2D, OpenVG 1.1, dual IPUv3H, and dual FlexCAN interfaces. It delivers up to 198 MTri/s 3D graphics performance and supports 1080p video decode/encode, DDR3/DDR3L/LPDDR2 memory, and HDMI 1.4 output - deployed in reconfigurable instrument clusters and high-performance infotainment systems.
For engineers reviewing the MCIMX6QP6AVT1ABR datasheet, MCIMX6QP6AVT1ABR pinout, MCIMX6QP6AVT1ABR application, or MCIMX6QP6AVT1ABR equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FCPBGA 21×21 mm package with 0.8 mm pitch, full-featured multimedia accelerator suite, and compliance with ISO 26262 ASIL-B ready system-level safety architecture.
Technical Context
The MCIMX6QP6AVT1ABR implements a symmetric 4-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core and a shared 1 MB L2 cache. Its SoC-level memory subsystem integrates 512 KB OCRAM, 96 KB boot ROM with HABv4 secure boot, and support for DDR3-1066, LPDDR2-800, NAND Flash (with BCH up to 40-bit ECC), and NOR/PSRAM.
It integrates dedicated hardware accelerators including VPU (H.264/H.265 decode/encode), dual IPUv3H (for camera pipeline processing), ASRC (asynchronous sample rate conversion), CAAM (NIST-certified cryptographic engine with 16 KB secure RAM), and SNVS (Secure Real-Time Clock). Power management includes DVFS, software state retention, and on-chip LDOs managed by PMU.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 @ 1 GHz - enables concurrent real-time OS tasks and rich UI rendering in automotive HMI. |
| Graphics Engine | GPU3Dv6 (OpenGL ES 3.0) + GPU2Dv3 + GPUVG - delivers 198 MTri/s 3D, BitBlt acceleration, and OpenVG 1.1 vector graphics for smooth instrument cluster animation. |
| Video Processing | VPU with 1080p60 decode/encode - supports H.264, H.265, VP8, enabling multi-camera DVR and rear-seat entertainment playback. |
| Memory Interface | 64-bit DDR3/DDR3L-1066 & LPDDR2-800 - provides ≥8.5 GB/s bandwidth for high-resolution display compositing and multi-stream video buffering. |
| Automotive Interfaces | Dual FlexCAN 2.0B (1 Mbps) + MLB150 + ESAI + ASRC - enables robust in-vehicle networking, multi-zone audio routing, and time-synchronized sensor fusion. |
| Security | CAAM (16 KB secure RAM), SNVS, A-HABv4, TrustZone - supports secure boot, DRM, encrypted firmware updates, and ASIL-B functional safety alignment. |
| Package | FCPBGA, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive underhood environments with thermal dissipation optimized for sustained 1 GHz operation. |
Pinout & Package
MCIMX6QP6AVT1ABR is housed in a 21 mm × 21 mm Fine-Pitch Chip Array Ball Grid Array (FCPBGA) package with 0.8 mm ball pitch and integrated heat spreader lid. The package contains 521 I/O balls arranged in a 31 × 31 array with corner cutouts, supporting automotive-grade thermal and mechanical reliability per AEC-Q100 Grade 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply | 1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling for stable 1 GHz operation. |
| VDD_SOC | SoC logic power | 1.2 V ±3% supply for L2 cache, GPC, CCM, and interconnect - critical for timing closure across AXI/AHB fabric. |
| VDD_DDR | DDR interface power | 1.5 V (DDR3) or 1.35 V (DDR3L) supply - must meet tight slew rate and noise specs to maintain signal integrity on 64-bit bus. |
| CLK_24M | USB reference clock | 24 MHz crystal input - mandatory for USB 2.0 OTG/HS PHY operation; limits max SoC frequency to 996 MHz if used as primary clock source. |
| CAN1_TX / CAN1_RX | FlexCAN channel 1 differential pair | High-speed CAN 2.0B physical layer interface - supports 1 Mbps data rate and fault-tolerant signaling per ISO 11898-2. |
| ENET_MDIO / ENET_MDC | Ethernet management interface | I2C-like control bus for IEEE 802.3 PHY configuration - required for 10/100/1000BASE-T negotiation and IEEE 1588 timestamp calibration. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across CPU, GPU, VPU, and memory domains - reduces active power by >40% during partial-load HMI rendering without frame drops. |
| Multi-Display Support | Simultaneous drive of up to four displays (LVDS, HDMI 1.4, MIPI DSI, parallel RGB) at aggregate 450 Mpixels/sec - enables digital cockpit with independent instrument cluster + center stack + rear-seat displays. |
| Dual Camera Pipeline | Two independent MIPI CSI-2 receivers (up to 4 lanes each, 1 Gbps/lane) + dual IPUv3H - allows concurrent front ADAS vision + rear-view camera processing with zero CPU overhead. |
| Hardware Security Root of Trust | A-HABv4 with SHA-256, 2048-bit RSA, eFUSE-based CSU policy locking - ensures immutable boot chain and runtime attestation for OTA update verification. |
| Automotive Audio Architecture | ESAI + ASRC + AUDMUX + SPDIF - supports 7.1 multi-channel audio with asynchronous sample rate conversion between Bluetooth, tuner, and amplifier domains. |
Applications
| Reconfigurable Instrument Cluster | High-Performance Infotainment System |
|---|---|
Use Scenario: Digital dashboard with animated gauges, ADAS warnings, navigation overlays, and driver attention monitoring rendered on TFT-LCD or OLED display. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR Adaptive OS, managing GPU-accelerated UI composition, real-time CAN message ingestion, and VPU-assisted camera feed overlay. Use Value: Enables <100 ms latency from CAN event to visual alert via hardware-accelerated path, meeting ISO 26262 ASIL-B timing requirements for safety-critical HMI elements. | Use Scenario: In-vehicle head unit supporting Android Automotive OS, wireless CarPlay/Android Auto, multi-zone audio, and rear-seat streaming. IC Role / Device Role / Timing Role: Main SoC handling multimedia framework, HDMI/MIPI display output, dual-band Wi-Fi/BT coexistence, and secure media decoding in trusted execution environment. Use Value: Delivers 1080p60 video decode + 3D UI + 7.1 audio playback concurrently with <500 mW additional SoC power draw due to dedicated VPU/GPU/ASRC offload. |
| ADAS Vision Processing Hub | Vehicle-to-Everything (V2X) Gateway |
Use Scenario: Front-facing camera module performing lane departure warning, traffic sign recognition, and pedestrian detection using neural network inference. IC Role / Device Role / Timing Role: Vision preprocessing engine running OpenVX kernels on NEON MPE and IPUv3H, feeding feature vectors to external AI accelerator or internal Cortex-A9 NEON. Use Value: Achieves 30 FPS 1080p YUV422 processing with sub-frame latency (<16 ms) using hardware-resident ISP pipeline - eliminates need for external image signal processor. | Use Scenario: Central gateway aggregating CAN, LIN, Ethernet, and cellular (LTE-V2X) data for cloud telemetry, remote diagnostics, and over-the-air updates. IC Role / Device Role / Timing Role: Secure communication hub with CAAM-encrypted TLS handshake, FlexCAN message bridging, Gigabit Ethernet backhaul, and eMMC-based firmware storage. Use Value: Provides end-to-end encrypted OTA update delivery with verified signature chain (A-HABv4 → CAAM → SNVS RTC timestamp), satisfying UNECE R155 cybersecurity management system (CSMS) requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP6AVT1AA | Lidded FCPBGA package vs. unlidded (BR suffix); identical electrical specs, thermal resistance 0.3°C/W higher in BR variant. | Suitable for same automotive ambient conditions but requires marginally increased heatsink capacity in underhood deployments. | Select MCIMX6QP6AVT1ABR when board-level thermal design favors lower-cost unlidded package with validated airflow path. |
| MCIMX6QP4AVT1AB | Same package and temp grade, but lacks VPU hardware block - no hardware-accelerated video encode/decode capability. | Applicable only where video processing is software-only or handled externally; cannot support 1080p60 decode in real time. | Choose MCIMX6QP4AVT1AB only if VPU functionality is unused and BOM cost reduction outweighs loss of future video feature scalability. |
Compared with MCIMX6QP6AVT1AA, the MCIMX6QP6AVT1ABR offers identical core performance and security features but trades lid-based thermal enhancement for lower assembly cost and simplified rework. Against MCIMX6QP4AVT1AB, it adds indispensable VPU acceleration for automotive video pipelines - making it the only viable choice for infotainment or ADAS vision hubs requiring real-time 1080p processing.
Availability
MCIMX6QP6AVT1ABR is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and ADAS vision processing modules requiring stable component supply across extended product lifecycles (15+ years).
Supply support for MCIMX6QP6AVT1ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in Arm-based application processors and automotive functional safety.
The i.MX 6QuadPlus product line was designed specifically for high-reliability automotive human-machine interfaces, delivering integrated graphics, video, and safety-critical peripherals in a single die - targeting digital cockpits compliant with ISO 26262 ASIL-B.
FAQ
What is the maximum operating temperature range for MCIMX6QP6AVT1ABR?
The MCIMX6QP6AVT1ABR is rated for automotive junction temperature range of −40°C to +125°C, qualified per AEC-Q100 Grade 2. This enables deployment in under-hood and dashboard locations where ambient temperatures exceed 85°C, provided PCB thermal design maintains die temperature within specification under sustained 1 GHz load.
Does MCIMX6QP6AVT1ABR support secure boot with cryptographic verification?
Yes, MCIMX6QP6AVT1ABR implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, and eFUSE-based CSU policy locking. It validates boot images from internal boot ROM through OCRAM and external flash, ensuring only cryptographically signed firmware executes - a foundational requirement for ISO/SAE 21434 compliance.
Can MCIMX6QP6AVT1ABR drive multiple displays simultaneously?
Yes, MCIMX6QP6AVT1ABR supports up to four concurrent displays via independent interfaces: parallel RGB (225 Mpixels/sec), LVDS (170 Mpixels/sec), HDMI 1.4 (1080p60), and MIPI DSI (1 Gbps/lane). Its compositor engine and dual IPUv3H enable real-time blending, rotation, and overlay of content across displays - essential for digital cockpit architectures.
What memory types does MCIMX6QP6AVT1ABR support natively?
MCIMX6QP6AVT1ABR supports DDR3-1066, DDR3L-1066, and LPDDR2-800 via its 64-bit MMDC controller; NAND Flash (MLC/SLC, BCH up to 40-bit ECC); NOR Flash (16/32-bit); PSRAM; and OneNAND™. It does not support DDR4 or LPDDR3/4 - design must adhere to these specific memory families for compatibility.
Is MCIMX6QP6AVT1ABR pin-compatible with other i.MX 6QuadPlus variants?
Yes, all i.MX 6QuadPlus FCPBGA 21×21 mm packages - including MCIMX6QP6AVT1ABR, MCIMX6QP6AVT1AA, and MCIMX6QP4AVT1AB - share identical 521-ball pinout, signal mapping, and mechanical footprint. This enables direct PCB reuse across speed grades and feature sets, reducing layout validation effort and accelerating platform scalability.
MCIMX6QP6AVT1ABR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6DP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 1GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR3, DDR3L, LPDDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6QP6AVT1ABR FAQ
1.How can I place an order for MCIMX6QP6AVT1ABR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6QP6AVT1ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6QP6AVT1ABR reliable?
The price and inventory of MCIMX6QP6AVT1ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6QP6AVT1ABR is usually 5 days.
3.What payment methods are accepted for MCIMX6QP6AVT1ABR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6QP6AVT1ABR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6QP6AVT1ABR?
MCIMX6QP6AVT1ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6QP6AVT1ABR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6QP6AVT1ABR?
For technical support, including MCIMX6QP6AVT1ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6QP6AVT1ABR requirements.
6.How does Aetrix verify that MCIMX6QP6AVT1ABR is sourced from the original manufacturer or authorized distributors?
All MCIMX6QP6AVT1ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6QP6AVT1ABR meets industry standards.
7.What is the process for return or replacement of MCIMX6QP6AVT1ABR?
All MCIMX6QP6AVT1ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6QP6AVT1ABR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6QP6AVT1ABR part is unused and in its original packaging.
Return procedure for MCIMX6QP6AVT1ABR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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