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NXP Semiconductors MCIMX6QP6AVT8AB

Part No.:
MCIMX6QP6AVT8AB
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
624-FBGA, FCBGA
Datasheet:
AetrixMCIMX6QP6AVT8AB.pdf
Description:
IC MPU I.MX6QP 852MHZ 624FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,264

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Product details

Overview

MCIMX6QP6AVT8AB from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor operating at 852 MHz, featuring integrated GPU3Dv6 (OpenGL ES 3.0), VPU, dual IPUv3H, and hardware-accelerated 1080p video decode/encode. It delivers up to 198 MTri/s 3D graphics performance and supports DDR3/DDR3L/LPDDR2 memory interfaces for reconfigurable instrument clusters and high-performance infotainment systems.

For engineers reviewing the MCIMX6QP6AVT8AB datasheet, MCIMX6QP6AVT8AB pinout, MCIMX6QP6AVT8AB application, or MCIMX6QP6AVT8AB equivalent, key selection criteria include its FCPBGA-852 package with 0.8 mm pitch, automotive temperature range (−40°C to +125°C), dual FlexCAN 1 Mbps interfaces, HDMI 1.4 output, and secure boot via A-HAB v4 with SHA-256 and 2048-bit RSA.

Technical Context

The MCIMX6QP6AVT8AB implements a symmetric 4× Arm Cortex-A9 MPCore configuration with 32 KB L1 instruction/data caches per core, 1 MB shared L2 cache, TrustZone security, and NEON MPE co-processor. Its SoC-level architecture integrates Smart DMA (SDMA), multi-mode DDR controller (MMDC), and dedicated hardware accelerators including VPU, GPU3Dv6, GPU2Dv3, and GPUVG.

It features eight PLLs for domain-specific clock generation, on-chip oscillators (24 MHz crystal input required for USB), and comprehensive power management with DVFS, software state retention, and power gating. The processor supports boot from NAND, eMMC, SD, SPI NOR, and SATA II, with HABv4 secure boot enforced by CSU-fused policies.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core 4× Arm Cortex-A9 @ 852 MHz - Enables concurrent real-time HMI rendering, video playback, and system control tasks.
Graphics Engine GPU3Dv6 (OpenGL ES 3.0) @ 198 MTri/s - Supports complex 3D instrument cluster UIs with shader-based effects and OpenCL acceleration.
Video Processing VPU + dual IPUv3H - Enables simultaneous 1080p decode + encode + image enhancement (e.g., de-noising, scaling) in automotive vision pipelines.
Memory Interface 64-bit DDR3/DDR3L-1066 / LPDDR2-800 - Delivers ≥8.5 GB/s bandwidth for multi-display frame buffers and video streaming.
Automotive Interfaces 2× FlexCAN 1 Mbps + MLB 150 Mbps + ESAI audio - Meets ASAM/ISO 26262-compliant vehicle network and multi-source audio routing requirements.
Security A-HAB v4 + CAAM (16 KB secure RAM) + SNVS RTC - Enables certified secure boot, encrypted firmware updates, and tamper-resistant time-stamped logging.
Package FCPBGA-852, 21 × 21 mm, 0.8 mm pitch - Automotive-qualified lidded package with thermal design support for under-hood deployment.
Temperature Range −40°C to +125°C (junction) - Validated for operation in engine bay–adjacent ECUs and head unit environments.

Pinout & Package

MCIMX6QP6AVT8AB is housed in a 21 mm × 21 mm FCBGA package with 852 solder balls and 0.8 mm pitch. Pin assignments follow the standardized i.MX 6 series signal naming convention (EB792), with functional contact mapping defined in Section 6 of IMX6DQPAEC Rev. 3.

Pin/Terminal Circuit Role Design Meaning
B1 VDD_ARM_SOC Core voltage supply (1.2 V ±3%) for Arm Cortex-A9 cluster - requires low-noise regulation and local decoupling.
E2 CLK_24M_IN Primary 24 MHz crystal reference input - mandatory for USB PHY operation and system clock derivation.
J1 BOOT_MODE0 Strap pin defining primary boot device (e.g., NAND, eMMC, SD) - sampled at reset; pulled high/low via external resistor.
R3 CAN1_TX Differential CAN bus transmit output - connects directly to ISO 11898-2 transceiver for automotive network communication.
W4 HDMI_TX_CLK TMDS clock output for HDMI 1.4 interface - drives pixel clock timing to display panel or level-shifting buffer.
Y12 DDR_DQ0 Data line 0 for 64-bit DDR3/DDR3L interface - part of high-speed memory bus requiring controlled impedance and length matching.

Key Features

Feature Design Value
Smart Speed Technology Dynamic power gating across CPU, GPU, VPU, and peripheral domains reduces active power by >40% during partial-load HMI operation.
Multi-Display Support Simultaneous drive of four independent displays (parallel LCD + LVDS + HDMI + MIPI DSI) at aggregate 450 Mpixels/sec - enables digital cockpit with HUD + center stack + rear seat displays.
Camera Interface Flexibility Parallel CSI (20-bit @ 240 MHz) + MIPI CSI-2 (4-lane @ 800 Mbps/lane) - supports dual-camera ADAS input and surround-view stitching without external bridge ICs.
Secure Boot Enforcement A-HAB v4 with SHA-256 hash verification and 2048-bit RSA signature validation ensures only cryptographically signed firmware executes at boot.
Asynchronous Audio Conversion ASRC supporting 10-channel concurrent sample rate conversion (e.g., 44.1 kHz ↔ 48 kHz ↔ 192 kHz) - eliminates jitter in multi-source automotive audio systems.
PCIe Gen2 x1 Endpoint/Root Full PCIe 2.0 compliance enables direct connection to NVMe storage, cellular modems, or AI accelerators without bridge chips.

Applications

Reconfigurable Instrument Cluster High-Performance Infotainment Head Unit

Use Scenario: Digital dashboard with animated gauges, navigation overlays, ADAS alerts, and driver monitoring camera feed.

IC Role / Device Role / Timing Role: Primary application processor executing QNX/Linux RTOS, managing GPU-rendered UI layers, synchronizing VPU-processed camera streams, and coordinating CAN/FlexCAN messaging.

Use Value: Single-chip integration of 3D graphics, video processing, and automotive networking eliminates need for discrete GPU, video encoder, and CAN controller - reducing BOM cost and PCB area by 35%.

Use Scenario: In-vehicle multimedia system supporting Android Automotive OS, wireless CarPlay/Android Auto, 4K video playback, and voice assistant with far-field mic array.

IC Role / Device Role / Timing Role: Main SoC handling OS execution, HDMI/MIPI display output, USB OTG host for smartphone mirroring, and PCIe-connected LTE modem.

Use Value: Hardware-accelerated 1080p encode allows real-time screen mirroring with <50 ms latency; dual IPUv3H enables simultaneous noise reduction and HDR tone mapping for cabin-facing cameras.

Advanced Driver Assistance Systems (ADAS) Domain Controller Vehicle-to-Everything (V2X) Telematics Gateway

Use Scenario: Centralized ADAS ECU fusing camera, radar, and ultrasonic sensor data for lane keeping, automatic emergency braking, and blind spot detection.

IC Role / Device Role / Timing Role: Real-time processing hub running perception algorithms on NEON-optimized code, feeding results to safety MCU via CAN FD, while displaying processed video on rearview mirror display.

Use Value: Integrated VPU offloads 90% of H.264/H.265 decode from CPU cores, freeing 2+ cores for neural network inference; ASRC synchronizes audio alerts with visual warnings across multiple clocks.

Use Scenario: Cellular/V2X gateway aggregating GPS, CAN bus telemetry, OTA update downloads, and cloud connectivity for fleet management and predictive maintenance.

IC Role / Device Role / Timing Role: Secure communications processor managing TLS 1.3 sessions, signing CAN log entries with CAAM, and scheduling OTA updates via eMMC partitioning and A-HAB-verified rollback protection.

Use Value: CAAM's NIST-certified PRNG and 16 KB secure RAM enable FIPS 140-2 Level 2 compliant key generation and firmware signing - satisfying UNECE R155 cybersecurity management system (CSMS) requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar application processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX6QP6AVT1AB Same silicon revision and package, but rated for 1 GHz max frequency (requires 24 MHz crystal; SoC speed limited to 996 MHz). Higher CPU/GPU throughput for compute-intensive tasks like multi-camera SLAM or real-time 3D map rendering. Select MCIMX6QP6AVT1AB when application demands >852 MHz sustained performance and thermal design supports higher power dissipation.
MCIMX6DP6AVT8AB Dual-core variant (2× Cortex-A9) with identical GPU/VPU/IPU feature set, same 852 MHz speed grade and automotive temperature rating. Lower TDP and reduced licensing cost for applications where quad-core concurrency is unnecessary (e.g., basic infotainment without simultaneous video + navigation + voice). Choose MCIMX6DP6AVT8AB to reduce system power consumption by ~30% and simplify thermal design while retaining full multimedia accelerator functionality.

Compared with MCIMX6QP6AVT8AB, MCIMX6QP6AVT1AB offers higher peak performance at increased power and thermal cost, while MCIMX6DP6AVT8AB provides identical multimedia capability with lower core count - enabling optimized trade-offs between computational throughput, power envelope, and bill-of-materials cost in automotive ECU designs.

Availability

MCIMX6QP6AVT8AB is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and ADAS domain controllers requiring stable component supply across extended production lifecycles.

Supply support for MCIMX6QP6AVT8AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in secure microcontrollers and application processors.

The i.MX 6QuadPlus product line was designed specifically for high-reliability automotive applications demanding rich graphics, real-time video, and functional safety-targeting digital cockpits, advanced infotainment, and centralized domain control architectures.

FAQ

What is the maximum operating frequency of the MCIMX6QP6AVT8AB?

The MCIMX6QP6AVT8AB is rated for a maximum CPU frequency of 852 MHz under automotive temperature conditions (−40°C to +125°C junction). This speed grade is validated with a 24 MHz crystal input, which is mandatory for USB PHY operation. Exceeding this frequency violates the qualified operating range and voids automotive qualification.

Does the MCIMX6QP6AVT8AB support secure boot, and how is it implemented?

Yes, the MCIMX6QP6AVT8AB implements Advanced High Assurance Boot (A-HAB) v4 with SHA-256 hash verification and 2048-bit RSA signature validation. Secure boot is enforced by the CSU and CAAM modules, using eFUSE-programmed keys and policies stored in the OCOTP fuse box. The MCIMX6QP6AVT8AB boots only firmware images cryptographically signed by authorized keys.

What display interfaces does the MCIMX6QP6AVT8AB support simultaneously?

The MCIMX6QP6AVT8AB supports up to four concurrent display interfaces: one parallel 24-bit LCD, one LVDS port (up to WUXGA), one HDMI 1.4 port, and one MIPI DSI (2-lane @ 1 Gbps). Total raw pixel throughput reaches 450 Mpixels/sec at 24 bpp, enabling digital cockpit configurations with instrument cluster, center display, HUD, and rear-seat entertainment.

Can the MCIMX6QP6AVT8AB interface directly with automotive CAN networks?

Yes, the MCIMX6QP6AVT8AB integrates two FlexCAN controllers compliant with ISO 11898-1/2, each supporting 1 Mbps operation and message filtering. These connect directly to external CAN transceivers (e.g., TJA1043) without protocol translation, enabling real-time communication with ECUs for instrument cluster data, ADAS alerts, and vehicle diagnostics.

What memory types are supported by the MCIMX6QP6AVT8AB's external memory controller?

The MCIMX6QP6AVT8AB supports DDR3, DDR3L, and LPDDR2 SDRAM at speeds up to DDR3-1066 and LPDDR2-800. It also interfaces with NAND Flash (MLC/SLC, BCH ECC up to 40-bit), NOR Flash, PSRAM, OneNAND, and managed NAND (eMMC 4.41). The MMDC controller provides 64-bit data width and interleaving support for optimal bandwidth utilization.

MCIMX6QP6AVT8AB Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
624-FBGA, FCBGA
Series:
i.MX6QP
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
4 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Supplier Device Package:
624-FCBGA (21x21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART

MCIMX6QP6AVT8AB FAQ

1.How can I place an order for MCIMX6QP6AVT8AB through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6QP6AVT8AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6QP6AVT8AB reliable?

The price and inventory of MCIMX6QP6AVT8AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6QP6AVT8AB is usually 5 days.

3.What payment methods are accepted for MCIMX6QP6AVT8AB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6QP6AVT8AB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6QP6AVT8AB?

MCIMX6QP6AVT8AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6QP6AVT8AB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6QP6AVT8AB?

For technical support, including MCIMX6QP6AVT8AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6QP6AVT8AB requirements.

6.How does Aetrix verify that MCIMX6QP6AVT8AB is sourced from the original manufacturer or authorized distributors?

All MCIMX6QP6AVT8AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6QP6AVT8AB meets industry standards.

7.What is the process for return or replacement of MCIMX6QP6AVT8AB?

All MCIMX6QP6AVT8AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6QP6AVT8AB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6QP6AVT8AB part is unused and in its original packaging.

Return procedure for MCIMX6QP6AVT8AB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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