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NXP Semiconductors MCIMX6QP6AVT8ABR
- Part No.:
- MCIMX6QP6AVT8ABR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-FBGA, FCBGA
- Datasheet:
-
MCIMX6QP6AVT8ABR.pdf
- Description:
- IC MPU I.MX6QP 852MHZ 624FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,074
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Product details
Overview
MCIMX6QP6AVT8ABR from NXP Semiconductors is an automotive-grade quad-core Arm Cortex-A9 application processor with integrated 3D/2D graphics, video processing unit (VPU), and dual FlexCAN interfaces. It operates at 852 MHz, supports DDR3/DDR3L/LPDDR2 memory, and delivers up to 198 MTri/s OpenGL ES 3.0 graphics performance. It is deployed in reconfigurable instrument clusters and high-performance infotainment systems requiring real-time multimedia, secure boot, and ASIL-B–capable functional safety support.
For engineers reviewing the MCIMX6QP6AVT8ABR datasheet, MCIMX6QP6AVT8ABR pinout, MCIMX6QP6AVT8ABR application, or MCIMX6QP6AVT8ABR equivalent, key selection criteria include its FCPBGA-529 package (21 × 21 mm, 0.8 mm pitch), automotive temperature range (−40°C to +125°C), integrated CAAM cryptographic module, dual 1 Mbps FlexCAN ports, and hardware-accelerated 1080p video decode/encode.
Technical Context
The MCIMX6QP6AVT8ABR implements a symmetric quad-core Arm Cortex-A9 MPCore platform with 32 KB L1 instruction/data caches per core and a shared 1 MB L2 cache. Its SoC-level architecture integrates dedicated accelerators including GPU3Dv6 (OpenGL ES 3.0), GPU2Dv3, GPUVG (OpenVG 1.1), VPU, dual IPUv3H image processors, and ASRC for multi-channel audio sample rate conversion.
It features a multilevel memory system supporting DDR3-1066, LPDDR2-800, NAND Flash (with BCH up to 40-bit ECC), NOR Flash, and 512 KB on-chip OCRAM. Power management includes DVFS, software state retention, and integrated LDOs managed by the PMU - enabling operation across automotive power domains with thermal monitoring via on-die sensor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Quad-core Arm Cortex-A9 r2p10, 852 MHz max - enables concurrent HMI rendering, media playback, and vehicle network stack execution. |
| Graphics Acceleration | GPU3Dv6 (198 MTri/s OpenGL ES 3.0), GPU2Dv3, GPUVG - supports triple-display output with 450 Mpixels/sec aggregate pixel throughput. |
| Video Processing | VPU + dual IPUv3H - enables simultaneous 1080p60 decode and encode with hardware-accelerated deinterlacing and color space conversion. |
| Memory Interface | 64-bit DDR3/DDR3L/LPDDR2 controller (up to DDR3-1066) - provides >6.4 GB/s bandwidth for graphics and video buffers. |
| Automotive Interfaces | Dual FlexCAN 2.0B (1 Mbps), MLB 150 Mbps, ESAI (260 kHz stereo), ASRC (10-channel) - meets CAN FD–adjacent networking and high-fidelity audio routing needs. |
| Security | CAAM (16 KB secure RAM, NIST-certified PRNG), SNVS, A-HAB v4 (SHA-256, 2048-bit RSA), TrustZone - enables secure boot, DRM, and encrypted firmware updates. |
| Package | FCPBGA-529, 21 × 21 mm, 0.8 mm pitch, lidded - qualified for automotive underhood environments with validated thermal dissipation. |
Pinout & Package
MCIMX6QP6AVT8ABR is housed in a 21 mm × 21 mm FCPBGA package with 529 balls and 0.8 mm pitch. The package is lidded and qualified for automotive applications (−40°C to +125°C junction temperature).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK_24M | Primary crystal oscillator input | Required 24 MHz reference for USB PHY and system clock generation; limits max SoC speed to 996 MHz if used. |
| ENET_RXD0–3 | Gigabit Ethernet receive data | Supports IEEE 1588-compliant 10/100/1000 Mbps MAC; actual throughput capped at ~400 Mbps due to internal bus constraints. |
| FLEXCAN1_TX/RX | Controller Area Network channel 1 | Dual isolated CAN transceivers supported; compliant with ISO 11898-1 for automotive body/chassis networks. |
| HDMI_TX | HDMI 1.4 transmitter interface | Carries TMDS video/audio signals up to 1080p60; requires external level-shifting and ESD protection per design guide. |
| LVDS_CLK+/− | LVDS display clock differential pair | Drives WUXGA-resolution displays at 60 Hz; supports dual-LVDS mode for higher resolution or dual-panel configurations. |
| SD1_CMD/DAT0–3 | eMMC/uSDHC interface port 1 | Supports UHS-I SDR104 (104 MB/s) and eMMC 4.41; used for boot storage and application firmware partitioning. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across CPU, GPU, and VPU domains reduces active power by >40% vs. fixed-frequency operation. |
| Multi-Display Support | Five concurrent display interfaces (parallel LCD, HDMI 1.4, MIPI DSI, dual LVDS) - enables digital cluster + center display + rear-seat entertainment without external bridge ICs. |
| Hardware Security Engine | CAAM performs AES-256, SHA-256, RSA-2048, and HMAC operations in <10 µs - accelerates secure OTA update verification and DRM session keys. |
| ASRC Audio Processing | 10-channel asynchronous sample rate conversion with −120 dB THD+N - eliminates clock domain mismatches between GPS, Bluetooth, and head-unit audio sources. |
| Boot ROM with HAB | 96 KB immutable boot ROM implementing A-HAB v4 - enforces signed image validation before loading any user code, preventing unauthorized firmware execution. |
Applications
| Reconfigurable Instrument Cluster | High-Performance Infotainment Head Unit |
|---|---|
Use Scenario: Digital dashboard with animated gauges, ADAS warnings, and navigation overlays rendered in real time. IC Role / Device Role / Timing Role: Application processor executing QNX or Android Automotive OS, driving dual-LVDS + HDMI outputs with sub-16 ms display latency. Use Value: Quad-core CPU + GPU3Dv6 enables smooth 60 Hz UI compositing while VPU decodes camera feeds for surround-view display without CPU load. |
Use Scenario: In-vehicle multimedia system supporting voice-controlled navigation, wireless CarPlay/Android Auto, and rear-seat video streaming. IC Role / Device Role / Timing Role: Central multimedia hub managing USB OTG, PCIe-connected Wi-Fi/BT module, dual eMMC storage, and HDMI/MIPI display pipelines. Use Value: Integrated SDMA and GPMI offload NAND/eMMC I/O; CAAM accelerates TLS handshakes for cloud services; dual FlexCAN links to telematics and gateway ECUs. |
| Automotive HUD Controller | ADAS Video Processing Node |
Use Scenario: Augmented reality head-up display projecting speed, navigation arrows, and collision alerts onto windshield. IC Role / Device Role / Timing Role: Real-time graphics processor rendering vector-based HUD elements with precise timing sync to vehicle CAN bus data. Use Value: GPU2Dv3 + IPUv3H enable low-latency warping, keystone correction, and brightness adaptation using ASRC-synchronized ambient light sensor input. |
Use Scenario: Front-facing camera node performing lane detection, traffic sign recognition, and forward collision warning. IC Role / Device Role / Timing Role: Vision processing SoC receiving raw MIPI CSI-2 video, applying ISP pipeline, and feeding neural network accelerator (via PCIe or external AI chip). Use Value: CSI-2 receiver supports 4-lane 800 Mbps/lane; VPU handles H.264/H.265 encode of processed video for recording; FlexCAN reports alerts to vehicle network. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6QP6AVT1ABR | Same silicon, 1 GHz speed grade (vs. 852 MHz); requires 24 MHz clock → max SoC speed limited to 996 MHz. | Higher CPU/GPU throughput for compute-intensive HMI or multi-zone audio DSP; increased power/thermal demand. | Select when application requires >15% CPU-bound performance uplift and thermal design accommodates +1.8 W typical power delta. |
| MCIMX8MQ5CVLFZAC | Arm Cortex-A53 quad-core (1.5 GHz), Vivante GC7000Lite GPU, no VPU; supports LPDDR4, PCIe 2.0, and CAN FD. | Targeted at next-gen IVI with Linux-based virtualization, containerized apps, and CAN FD backbone; lacks hardware 1080p encode/decode. | Select for future-proof designs needing CAN FD, higher memory bandwidth, or hypervisor support - not for direct 1080p video pipeline replacement. |
Compared with MCIMX6QP6AVT8ABR, MCIMX6QP6AVT1ABR offers higher deterministic performance at elevated thermal cost, while MCIMX8MQ5CVLFZAC shifts toward scalable Linux virtualization and CAN FD but sacrifices dedicated video acceleration - making it unsuitable for legacy 1080p encode/decode–centric architectures.
Availability
MCIMX6QP6AVT8ABR is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and HUD controllers requiring stable component supply across extended production lifecycles and AEC-Q100–compliant sourcing.
Supply support for MCIMX6QP6AVT8ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 6DualPlus/6QuadPlus product line was designed specifically for high-reliability automotive applications demanding rich graphics, real-time multimedia, and hardware-enforced security - targeting digital clusters, infotainment, and ADAS edge nodes.
FAQ
What is the maximum operating temperature for MCIMX6QP6AVT8ABR?
The MCIMX6QP6AVT8ABR is rated for automotive temperature grade A (−40°C to +125°C junction temperature). This specification is validated per AEC-Q100 Grade 2 requirements and applies to the full FCPBGA-529 package under sustained thermal load with appropriate PCB copper pour and thermal vias. Derating curves for frequency vs. temperature are provided in Section 4.1 of the IMX6DQPAEC datasheet.
Does MCIMX6QP6AVT8ABR support secure boot, and how is it implemented?
Yes, MCIMX6QP6AVT8ABR implements Advanced High Assurance Boot (A-HAB v4) using on-die ROM code that validates signed images prior to execution. It leverages CAAM for cryptographic operations, SNVS for secure key storage, and CSU-configured fuse settings to enforce boot policy. The process requires SHA-256 hashing and 2048-bit RSA signature verification - all performed in hardware before any user code loads.
Can MCIMX6QP6AVT8ABR drive multiple displays simultaneously, and what interfaces are available?
Yes, MCIMX6QP6AVT8ABR supports up to four active displays concurrently via five physical interfaces: parallel LCD (24-bit, up to 225 Mpixels/sec), HDMI 1.4 (1080p60), MIPI DSI (2 lanes @ 1 Gbps), and dual LVDS (each up to 85 Mpixels/sec). Total aggregate pixel throughput reaches 450 Mpixels/sec at 24 bpp, enabling digital cluster + center display + rear-seat video without external display bridges.
What video codecs does the VPU in MCIMX6QP6AVT8ABR support?
The integrated Video Processing Unit (VPU) in MCIMX6QP6AVT8ABR supports hardware-accelerated decode and encode of H.264, H.263, MPEG-4, MPEG-2, VC-1, and DivX codecs at up to 1080p60 resolution. It also handles JPEG encode/decode and motion estimation for advanced video analytics - all with sub-10 ms latency and zero CPU utilization during playback.
Is MCIMX6QP6AVT8ABR pin-compatible with other i.MX 6QuadPlus variants like MCIMX6QP6AVT1ABR?
Yes, MCIMX6QP6AVT8ABR is pin-compatible with all members of the i.MX 6QuadPlus FCPBGA-529 family, including MCIMX6QP6AVT1ABR and MCIMX6QP4AVT8ABR. Ball mapping, power domains, and signal definitions are identical across speed grades and feature sets - allowing drop-in replacement on existing PCBs when thermal and power delivery margins permit.
MCIMX6QP6AVT8ABR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-FBGA, FCBGA
- Series:
- i.MX6QP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 4 Core, 32-Bit
- Speed:
- 852MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR3, DDR3L, LPDDR2
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-FCBGA (21x21)
- Additional Interfaces:
- CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
MCIMX6QP6AVT8ABR FAQ
1.How can I place an order for MCIMX6QP6AVT8ABR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6QP6AVT8ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6QP6AVT8ABR reliable?
The price and inventory of MCIMX6QP6AVT8ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6QP6AVT8ABR is usually 5 days.
3.What payment methods are accepted for MCIMX6QP6AVT8ABR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6QP6AVT8ABR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6QP6AVT8ABR?
MCIMX6QP6AVT8ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6QP6AVT8ABR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6QP6AVT8ABR?
For technical support, including MCIMX6QP6AVT8ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6QP6AVT8ABR requirements.
6.How does Aetrix verify that MCIMX6QP6AVT8ABR is sourced from the original manufacturer or authorized distributors?
All MCIMX6QP6AVT8ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6QP6AVT8ABR meets industry standards.
7.What is the process for return or replacement of MCIMX6QP6AVT8ABR?
All MCIMX6QP6AVT8ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6QP6AVT8ABR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6QP6AVT8ABR part is unused and in its original packaging.
Return procedure for MCIMX6QP6AVT8ABR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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