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NXP Semiconductors MCIMX6S1AVM08AB
- Part No.:
- MCIMX6S1AVM08AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S1AVM08AB.pdf
- Description:
- IC MPU I.MX6S 800MHZ 624MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,848
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Product details
Overview
MCIMX6S1AVM08AB from NXP Semiconductors is a single-core Arm Cortex-A9 applications processor designed for cost-sensitive, power-efficient consumer electronics. It operates at up to 1 GHz, integrates a Video Processing Unit (VPU), 2D/3D GPU, EPD controller for E-INK displays, and supports DDR3/DDR3L/LPDDR2-800 memory. It targets embedded HMI, portable medical devices, and IP phones requiring rich multimedia with low thermal footprint.
For engineers reviewing the MCIMX6S1AVM08AB datasheet, MCIMX6S1AVM08AB pinout, MCIMX6S1AVM08AB application, or MCIMX6S1AVM08AB equivalent, key selection criteria include its 1 GHz Cortex-A9 core, integrated EPDC supporting 1650×2332 E-INK panels, dual CAN interfaces, HDMI 1.4 output, and commercial temperature grade (0°C to +95°C) in a 21×21 mm MAPBGA package.
Technical Context
The MCIMX6S1AVM08AB implements a single Arm Cortex-A9 MPCore with TrustZone security, 32 KB L1 instruction and data caches, and a shared 512 KB L2 cache. Its memory subsystem includes boot ROM (96 KB), OCRAM (128 KB), and secure RAM (16 KB), with support for DDR3-800, LPDDR2-800, and NAND Flash with BCH up to 40-bit ECC.
It integrates dedicated hardware accelerators including VPU for 1080p video decode/encode, GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2, IPUv3H for image processing, PXP for pixel pipeline offload, and ASRC for multi-channel asynchronous audio sample rate conversion - all coordinated via AXI/AHB switch fabric and managed by GPC power controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A9 @ up to 1 GHz - delivers ~2000 DMIPS for real-time OS and multimedia workloads. |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 - enables 6.4 GB/s peak bandwidth for high-resolution UI and video buffering. |
| Graphics Acceleration | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - renders complex GUIs and overlays without CPU load; supports dual-display compositing. |
| E-INK Support | Integrated EPDC - drives color/monochrome E-INK panels up to 1650×2332 at 5-bit grayscale, eliminating external display controllers. |
| Video Processing | VPU with 1080p decode/encode - offloads H.264/VP8/MPEG-4 decoding, reducing CPU utilization by >70% during playback. |
| Connectivity | Dual FlexCAN (1 Mbps), HDMI 1.4, MIPI CSI-2 & DSI, USB 2.0 OTG + 3 hosts, PCIe v2.0 x1 - enables automotive-grade comms, high-res displays, and peripheral expansion. |
| Security | CAAM (16 KB secure RAM), SNVS, CSU, A-HABv4 - enables secure boot, AES/SHA/RSA acceleration, and tamper-resistant key storage. |
Pinout & Package
MCIMX6S1AVM08AB uses a 224-ball MAPBGA package (21 mm × 21 mm, 0.8 mm pitch), RoHS-compliant, with ball map defined per NXP's i.MX 6Solo/6DualLite Package Information (Rev. 9). Signal assignments follow standardized naming per IMX6 Series Signal Name Mapping (EB792).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for Cortex-A9 core; requires low-noise regulation and local decoupling for stable 1 GHz operation. |
| VDD_SOC | SoC Logic Power | 1.1 V ±3% supply for L2 cache, interconnect, and peripheral logic; critical for AXI bus timing integrity. |
| VDD_DDR | DDR Memory Interface | 1.5 V (DDR3) or 1.35 V (DDR3L) supply; must meet tight slew rate and noise specs to maintain signal integrity on 32-bit bus. |
| CLKIN_24M | Primary Clock Input | 24 MHz crystal input - mandatory for USB PHY operation and system clock derivation; limits max SoC speed to 996 MHz. |
| BOOT_MODE[1:0] | Boot Configuration | Strapped pins determining boot source (eMMC, NAND, SPI NOR); must be pulled high/low at reset to select correct firmware path. |
| ENET_RXD[3:0] | Gigabit Ethernet Input | LVDS-compatible inputs for 10/100/1000 Mbps ENET; require matched trace lengths and 50 Ω termination for <400 Mbps throughput. |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling (DVFS) across CPU, GPU, and VPU domains reduces active power by up to 40% during audio-only tasks. |
| EPD Controller Integration | Hardware-accelerated waveform management for E-INK panels eliminates need for external timing controllers and reduces BOM count by 3–5 components. |
| Multi-Standard Video Codec | Hardware VPU supports H.264 BP/MP/HP, MPEG-4 ASP, VP8, and VC-1 decode - enables smooth 1080p playback at <300 mW total SoC power. |
| Secure Boot Chain | A-HABv4 with SHA-256, 2048-bit RSA, and version control ensures authenticated firmware loading and prevents unauthorized code execution. |
| Flexible Display Interfaces | Simultaneous parallel RGB + HDMI 1.4 or LVDS + MIPI DSI outputs allow dual independent displays (e.g., main UI + status panel) without external muxing. |
Applications
| Industrial HMI | Portable Medical Device |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with real-time diagnostics and alarm logging. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based HMI stack, driving 7-inch LVDS display and reading CAN bus sensor data. Use Value: Integrated EPDC enables ultra-low-power E-INK status panel alongside primary LCD; dual CAN ports simplify connection to legacy industrial networks. |
Use Scenario: Battery-powered vital signs monitor with ECG, SpO₂, and temperature sensing, displaying waveforms and trends on grayscale E-INK screen. IC Role / Device Role / Timing Role: Central SoC managing sensor acquisition, signal processing, and E-INK refresh - leveraging DVFS to extend battery life beyond 72 hours. Use Value: On-chip ASRC handles multi-channel audio sampling; PXP accelerates pixel-level contrast enhancement for clinical readability on monochrome E-INK. |
| IP Phone with Video | Home Energy Gateway |
Use Scenario: VoIP endpoint with HD video calling, Bluetooth headset pairing, and local SIP registration. IC Role / Device Role / Timing Role: Applications processor running Android-based telephony stack, encoding/decoding H.264 video via VPU, and managing USB audio class drivers. Use Value: GPU3Dv5 renders smooth video call UI; HDMI 1.4 output enables external monitor mirroring; integrated USB PHY eliminates external transceiver. |
Use Scenario: Smart home hub aggregating Zigbee/Z-Wave sensors, controlling HVAC via RS485, and displaying energy usage on ePaper dashboard. IC Role / Device Role / Timing Role: Embedded Linux host interfacing with multiple protocols (UART, I²C, CAN, USB) while refreshing E-INK display every 5 minutes. Use Value: CAAM accelerates TLS handshakes for cloud MQTT; EPDC manages partial-refresh waveforms to minimize display power; 5 UARTs support concurrent protocol bridges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6S5DVM10AB | Same core, same package, but includes VPU, GPU, MLB, no EPDC; rated for 1 GHz at commercial temp. | Lacks integrated EPD controller - requires external display controller for E-INK; better suited for LCD/HDMI-only designs. | Select when E-INK is not required and lower BOM cost is prioritized over display integration. |
| MCIMX6U5DVM10AB | Dual-core Cortex-A9, same peripherals and package; includes VPU, GPU, MLB, no EPDC; 1 GHz performance. | Higher compute throughput for multitasking OS environments; lacks EPDC but adds second core for parallel sensor/data handling. | Choose for applications needing concurrent video decode + network stack + UI rendering without E-INK dependency. |
Compared with MCIMX6S1AVM08AB, MCIMX6S5DVM10AB removes EPDC to reduce cost and silicon area, while MCIMX6U5DVM10AB doubles CPU cores and adds inter-core cache coherency - both retain identical I/O, memory, and security blocks but trade off display integration or single-core efficiency for different workload profiles.
Availability
MCIMX6S1AVM08AB is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, IP phones, and home energy gateways requiring stable component supply, long-term lifecycle assurance, and qualified commercial-grade SoCs.
Supply support for MCIMX6S1AVM08AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and edge AI.
The i.MX 6Solo family, including MCIMX6S1AVM08AB, was engineered specifically for cost-optimized, multimedia-rich consumer and industrial edge devices requiring low-power E-INK support, robust security, and flexible interface scalability.
FAQ
What is the maximum operating frequency of the MCIMX6S1AVM08AB?
The MCIMX6S1AVM08AB operates at up to 1 GHz under commercial temperature conditions (0°C to +95°C). This maximum frequency assumes use of a 24 MHz crystal input for USB functionality; if a different clock source is used, higher frequencies may be achievable per NXP's IMX6SDLCEC Rev. 9 specification.
Does the MCIMX6S1AVM08AB support E-INK displays?
Yes, the MCIMX6S1AVM08AB integrates a dedicated EPD controller (EPDC) that supports both color and monochrome E-INK panels up to 1650×2332 resolution with 5-bit grayscale. This hardware block manages waveform timing and partial refresh without CPU intervention, making it ideal for ultra-low-power eReader and status display applications.
What memory types does the MCIMX6S1AVM08AB support?
The MCIMX6S1AVM08AB supports DDR3, DDR3L, and LPDDR2-800 memory interfaces at 32-bit width, plus NAND Flash (with BCH up to 40-bit ECC), NOR Flash, PSRAM, and OneNAND™. It does not support DDR4 or LPDDR3, and its memory controller is optimized for low-latency access in multimedia and real-time embedded use cases.
Is the MCIMX6S1AVM08AB pin-compatible with other i.MX 6Solo variants?
Yes, the MCIMX6S1AVM08AB shares the same 224-ball MAPBGA package (21×21 mm, 0.8 mm pitch) and ball map with other i.MX 6Solo parts like MCIMX6S5DVM10AB and MCIMX6S8DVM10AB. Signal compatibility is maintained across the family per NXP's updated signal naming convention, enabling layout reuse where peripheral requirements align.
What security features are implemented in the MCIMX6S1AVM08AB?
The MCIMX6S1AVM08AB includes Arm TrustZone, CAAM with 16 KB secure RAM, SNVS with secure RTC, CSU for fuse-based policy enforcement, and A-HABv4 for secure boot using SHA-256 and 2048-bit RSA. These features enable encrypted firmware updates, runtime integrity checking, and tamper-resistant key storage - validated per NXP's i.MX 6Solo Security Reference Manual (IMX6DQ6SDLSRM).
MCIMX6S1AVM08AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S1AVM08AB FAQ
1.How can I place an order for MCIMX6S1AVM08AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S1AVM08AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S1AVM08AB reliable?
The price and inventory of MCIMX6S1AVM08AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S1AVM08AB is usually 5 days.
3.What payment methods are accepted for MCIMX6S1AVM08AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S1AVM08AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6S1AVM08AB?
MCIMX6S1AVM08AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S1AVM08AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S1AVM08AB?
For technical support, including MCIMX6S1AVM08AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S1AVM08AB requirements.
6.How does Aetrix verify that MCIMX6S1AVM08AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6S1AVM08AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S1AVM08AB meets industry standards.
7.What is the process for return or replacement of MCIMX6S1AVM08AB?
All MCIMX6S1AVM08AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S1AVM08AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S1AVM08AB part is unused and in its original packaging.
Return procedure for MCIMX6S1AVM08AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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