NXP Semiconductors MCIMX6S4AVM08AB
- Part No.:
- MCIMX6S4AVM08AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S4AVM08AB.pdf
- Description:
- IC MPU I.MX6S 800MHZ 624MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,948
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6S4AVM08AB from NXP Semiconductors is an i.MX 6Solo applications processor featuring a single Arm Cortex-A9 core operating at up to 800 MHz, integrated VPU and GPU for 1080p video decode/encode and OpenGL ES 2.0 graphics acceleration, and support for DDR3/DDR3L/LPDDR2-800 memory. It targets cost-sensitive consumer HMI and portable medical devices requiring rich multimedia with low power consumption.
For engineers reviewing the MCIMX6S4AVM08AB datasheet, MCIMX6S4AVM08AB pinout, MCIMX6S4AVM08AB application, or MCIMX6S4AVM08AB equivalent, key selection criteria include its 800 MHz CPU speed, EPDC-enabled E-INK display support up to 1650×2332, dual CAN 2.0B interfaces, Gigabit Ethernet controller (400 Mbps real-world throughput), and commercial temperature grade (0°C to +95°C) in a 21×21 mm MAPBGA package.
Technical Context
The MCIMX6S4AVM08AB implements a single-core Arm Cortex-A9 MPCore with TrustZone security, 32 KB L1 instruction and 32 KB L1 data cache, and a shared 512 KB L2 cache. Its memory subsystem supports 32-bit DDR3/DDR3L-800 and LPDDR2-800 with interleaving, plus NAND Flash with BCH up to 40-bit ECC.
It integrates dedicated hardware accelerators including VPU (H.264/VP8 decode/encode), IPUv3H (image processing), GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), PXP (pixel pipeline for EPD), and ASRC (asynchronous sample rate conversion for multi-channel audio). Power management includes DVFS, SW state retention, and on-chip LDOs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A9 @ up to 800 MHz - delivers 2000 DMIPS for embedded Linux-based UI and media tasks without thermal throttling under commercial conditions. |
| Memory Interface | 32-bit DDR3/DDR3L-800 or LPDDR2-800 - enables 6.4 GB/s peak bandwidth for high-resolution display buffering and video playback. |
| Graphics Acceleration | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - renders smooth 2D GUI overlays and 3D widgets on dual displays simultaneously. |
| Video Processing | VPU supporting H.264 BP/MP/HP, VP8, MPEG-4 - decodes 1080p30 video with <5% CPU load, freeing core for application logic. |
| E-INK Support | Integrated EPDC supporting color/monochrome E-INK up to 1650×2332 @ 5-bit grayscale - eliminates external display controller in eReader and energy meter designs. |
| Connectivity | Dual FlexCAN 2.0B, Gigabit Ethernet (400 Mbps real throughput), USB 2.0 OTG + 3 hosts, PCIe 2.0 x1 - enables robust industrial fieldbus, wired networking, and peripheral expansion. |
| Security | CAAM with NIST-certified PRNG, 16 KB secure RAM, A-HAB v4 boot authentication - meets DRM, secure boot, and firmware update requirements for connected devices. |
Pinout & Package
MCIMX6S4AVM08AB uses a 21 mm × 21 mm MAPBGA package with 2240 balls and 0.8 mm pitch. The package is RoHS-compliant and designed for standard reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | CPU Core Supply | 1.2–1.3 V input for Arm Cortex-A9 core; requires tight regulation (±3%) to sustain 800 MHz operation. |
| VDD_SOC | SoC Logic Supply | 1.2–1.3 V supply for L2 cache, GIC, CCM, and interconnect fabric; shares regulator domain with VDD_ARM in many reference designs. |
| VDD_DDR | DDR Memory Supply | 1.5 V (DDR3) or 1.35 V (DDR3L) supply; must be sequenced after VDD_SOC and before VDD_ARM per power-up timing requirements. |
| BOOT_MODE[1:0] | Boot Configuration | Pull-up/down resistors select boot source (eMMC, NAND, SPI NOR, or SD card); critical for factory programming and recovery. |
| ENET_RXD[3:0]/TXD[3:0] | Gigabit Ethernet PHY Interface | RMII/RGMII-capable pins; RGMII mode required for full 1000 Mbps link; trace length matching essential for signal integrity. |
| CAN1_TX/CAN1_RX | FlexCAN 2.0B Channel 1 | Differential bus interface compliant with ISO 11898-2; supports 1 Mbps baud rate with external transceiver (e.g., TJA1042). |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across CPU, GPU, VPU, and memory domains reduces active power by up to 40% versus fixed-frequency operation. |
| EPD Controller (EPDC) | Hardware-accelerated waveform management for monochrome/color E-INK panels eliminates host CPU involvement in refresh sequencing and partial updates. |
| ASRC with 10-channel concurrency | Enables simultaneous resampling of multiple audio streams (e.g., voice prompt + background music + telemetry tone) without CPU intervention. |
| CAAM Cryptographic Engine | Offloads AES-128/256, SHA-1/256, RSA-2048, and HMAC operations from main CPU, reducing boot time and improving secure OTA update latency. |
| MLB Interface (MediaLB) | Direct connection to MOST25/50/150 networks with optional DTCP cipher acceleration - enables automotive infotainment gateway functionality without external bridge IC. |
Applications
| Web & Multimedia Tablets | Human Machine Interfaces (HMI) |
|---|---|
Use Scenario: Entry-level Android-based tablet for kiosk, retail signage, and educational use with 7–10 inch LCD or LVDS display. IC Role / Device Role / Timing Role: Main application processor executing OS, rendering UI via GPU2D/GPU3D, driving display through parallel/LVDS/HDMI, and decoding streaming video via VPU. Use Value: Integrated VPU and GPU eliminate need for discrete media co-processors; 800 MHz Cortex-A9 provides responsive multitouch response while maintaining <1.5 W typical power draw. |
Use Scenario: Industrial control panel with dual-display capability (main UI + auxiliary status screen) and CAN-connected PLC communication. IC Role / Device Role / Timing Role: Central HMI controller managing touch input, real-time CAN messaging, dual-display output, and local data logging to eMMC. Use Value: Dual CAN controllers enable redundant fieldbus links; EPDC support allows optional E-INK auxiliary display for ultra-low-power status monitoring during standby. |
| Portable Medical Devices | Home Energy Management Systems |
Use Scenario: Battery-powered patient monitor with color LCD, audio alerts, and Bluetooth/Wi-Fi connectivity for data upload. IC Role / Device Role / Timing Role: System-on-chip handling sensor data acquisition (via UART/I2C), GUI rendering, audio playback (via ESAI/SSI), and wireless comms protocol stack. Use Value: CAAM enables HIPAA-compliant encrypted data storage; ASRC synchronizes audio alerts with variable-rate sensor sampling without jitter. |
Use Scenario: Smart home gateway aggregating Zigbee/Z-Wave sensors, controlling HVAC via RS485, and displaying energy usage on E-INK panel. IC Role / Device Role / Timing Role: Gateway SoC running Linux, bridging protocols, managing secure cloud TLS sessions, and updating monochrome E-INK display every 15 minutes. Use Value: EPDC's ultra-low refresh current (<10 µA in static mode) extends battery life to >5 years on coin cell; integrated USB OTG supports field firmware updates via thumb drive. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6S5DVM10AB | Same i.MX 6Solo family, 1 GHz max frequency, includes EPDC and VPU/GPU, but rated for 0°C–95°C commercial grade. | Higher CPU performance enables more complex UI frameworks (e.g., Qt Quick) and concurrent video+audio streaming. | Select when 1 GHz deterministic performance is required and board layout accommodates same 21×21 mm MAPBGA footprint. |
| MCIMX6U5DVM10AB | i.MX 6DualLite variant with dual Cortex-A9 cores (1 GHz), identical peripherals and EPDC/VPU/GPU, same package and temp grade. | Enables true parallel processing: one core for RTOS-based control tasks, second for Linux UI/media stack. | Choose for applications needing hard real-time responsiveness alongside rich multimedia - requires dual-core-aware software architecture. |
Compared with MCIMX6S4AVM08AB, MCIMX6S5DVM10AB offers higher clock headroom for burst workloads, while MCIMX6U5DVM10AB adds symmetric multiprocessing capability - both retain pin compatibility and identical power delivery requirements, simplifying migration paths within the i.MX 6Solo/DualLite family.
Availability
MCIMX6S4AVM08AB is available at Aetrix Electronics and suitable for human machine interfaces, portable medical devices, and home energy management systems requiring stable component supply across multi-year production cycles.
Supply support for MCIMX6S4AVM08AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise.
The i.MX 6Solo series was designed specifically for cost-optimized, multimedia-rich consumer and industrial edge devices requiring long-term availability, low-power operation, and hardware-accelerated graphics/video - MCIMX6S4AVM08AB reflects that focus with its balanced 800 MHz performance and integrated EPDC.
FAQ
What is the maximum operating frequency of the MCIMX6S4AVM08AB?
The MCIMX6S4AVM08AB operates at up to 800 MHz under commercial temperature conditions (0°C to +95°C) when supplied with a 24 MHz crystal input. This frequency is guaranteed per NXP's IMX6SDLCEC datasheet Rev. 9, and is limited by USB clocking constraints - using a 24 MHz reference ensures full USB 2.0 OTG and host functionality while maintaining stability.
Does the MCIMX6S4AVM08AB support E-INK displays?
Yes, the MCIMX6S4AVM08AB integrates a dedicated E-Paper Display Controller (EPDC) supporting both monochrome and color E-INK panels up to 1650×2332 resolution with 5-bit grayscale. This hardware block manages waveform lookup tables, partial refresh, and panel timing independently of the CPU, making it ideal for battery-powered eReaders and energy meters.
What memory types does the MCIMX6S4AVM08AB support?
The MCIMX6S4AVM08AB supports 32-bit DDR3/DDR3L-800, LPDDR2-800, NAND Flash (with BCH up to 40-bit ECC), NOR Flash, PSRAM, and eMMC 4.41. Its MMDC controller handles DDR timing calibration and refresh management autonomously, and the GPMI interface provides direct NAND access without external glue logic.
Is the MCIMX6S4AVM08AB pin-compatible with other i.MX 6Solo variants?
Yes, the MCIMX6S4AVM08AB shares the same 21×21 mm MAPBGA-2240 package and ball map with all i.MX 6Solo parts including MCIMX6S5DVM10AB and MCIMX6S5EVM10AB. Pin functions, power domains, and I/O voltage levels are identical - only fuse settings and silicon revision differ, enabling drop-in replacement in validated PCB layouts.
What security features are implemented in the MCIMX6S4AVM08AB?
The MCIMX6S4AVM08AB includes Arm TrustZone, CAAM cryptographic engine (AES-128/256, SHA-256, RSA-2048), 16 KB secure RAM, SNVS with tamper-detect RTC, and A-HAB v4 secure boot. These features enable encrypted firmware images, secure key storage, and runtime integrity checking - all documented in the i.MX 6Solo Security Reference Manual (IMX6DQ6SDLSRM).
MCIMX6S4AVM08AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S4AVM08AB FAQ
1.How can I place an order for MCIMX6S4AVM08AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S4AVM08AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S4AVM08AB reliable?
The price and inventory of MCIMX6S4AVM08AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S4AVM08AB is usually 5 days.
3.What payment methods are accepted for MCIMX6S4AVM08AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S4AVM08AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6S4AVM08AB?
MCIMX6S4AVM08AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S4AVM08AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S4AVM08AB?
For technical support, including MCIMX6S4AVM08AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S4AVM08AB requirements.
6.How does Aetrix verify that MCIMX6S4AVM08AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6S4AVM08AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S4AVM08AB meets industry standards.
7.What is the process for return or replacement of MCIMX6S4AVM08AB?
All MCIMX6S4AVM08AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S4AVM08AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S4AVM08AB part is unused and in its original packaging.
Return procedure for MCIMX6S4AVM08AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6S4AVM08AB Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

