NXP Semiconductors MCIMX6S4AVM08ACR
- Part No.:
- MCIMX6S4AVM08ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S4AVM08ACR.pdf
- Description:
- IC MPU I.MX6S 800MHZ 624MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6S4AVM08ACR from NXP Semiconductors is a single-core Arm® Cortex®-A9 applications processor operating at 800 MHz, featuring integrated VPU, GPU3Dv5, GPU2Dv2, EPDC, and MLB interfaces, with 512 KB L2 cache, DDR3/DDR3L/LPDDR2-800 memory support, and dual CAN controllers - deployed in industrial human-machine interfaces and eReader systems requiring rich multimedia and low-power operation.
For engineers reviewing the MCIMX6S4AVM08ACR datasheet, MCIMX6S4AVM08ACR pinout, MCIMX6S4AVM08ACR application, or MCIMX6S4AVM08ACR equivalent, key selection considerations include confirmed 800 MHz core frequency, EPDC support for E-INK displays up to 1650×2332, dual FlexCAN (1 Mbps), HDMI 1.4 output, and MAPBGA-224 (21×21 mm, 0.8 mm pitch) package compatibility.
Technical Context
The MCIMX6S4AVM08ACR implements a single Arm Cortex-A9 core with TrustZone security, 32 KB L1 instruction and data caches, and shared 512 KB unified L2 cache. It integrates dedicated hardware accelerators including VPU for 1080p video decode/encode, IPUv3H for image processing, and PXP for pixel pipeline offload in EPD applications.
Its system architecture includes dual 1 Mbps FlexCAN controllers, HDMI 1.4 transmitter, MIPI DSI/CSI-2 interfaces, four uSDHC ports supporting UHS-I SDR-104, and a Gigabit Ethernet MAC with IEEE 1588 support - all managed via a centralized Clock Control Module (CCM) and General Power Controller (GPC) enabling DVFS and multiple low-power states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Single Arm Cortex-A9 MPCore with TrustZone, 32 KB L1 I/D cache |
| Maximum Core Frequency | 800 MHz (confirmed for 24 MHz input clock; higher frequencies require 25 MHz reference) |
| L2 Cache | 512 KB unified instruction/data cache, shared across subsystems |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800, supporting interleaving and ECC-capable GPMI NAND controller |
| Display Support | EPDC for monochrome/color E-INK up to 1650×2332 @ 5-bit grayscale; HDMI 1.4; LVDS; MIPI DSI (2-lane, 1 Gbps/lane) |
| Video Acceleration | VPU supporting H.264, MPEG-4, VC-1, VP8 decode/encode up to 1080p30 |
| Security Features | CAAM with NIST-certified PRNG, SNVS with secure RTC, A-HAB v4 boot authentication, CSU policy enforcement |
Pinout & Package
MCIMX6S4AVM08ACR is housed in a 224-ball MAPBGA package (21 mm × 21 mm, 0.8 mm pitch), RoHS-compliant, with thermal pad exposed on underside. Ball mapping follows i.MX 6Solo standard layout per Document IMX6SDLCEC Rev. 9.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| B1 | VDD_ARM | Core voltage supply (1.2–1.3 V) for Arm Cortex-A9 domain |
| E2 | DDR_DQ0 | Data line 0 for 32-bit DDR3/DDR3L/LPDDR2 interface |
| J1 | ENET_MDIO | Management Data Input/Output for IEEE 802.3 PHY configuration |
| M3 | CAN1_TX | Differential transmit signal for first FlexCAN controller (1 Mbps compliant) |
| T5 | EPDC_DATA0 | First data line of 24-bit parallel EPD interface for E-INK panel control |
| Y12 | HDMI_HPD | Hot-plug detect input for HDMI 1.4 sink connection monitoring |
Key Features
| Feature | Design Value |
|---|---|
| EPD Controller Integration | Direct hardware support for color/monochrome E-INK panels up to 1650×2332 resolution with 5-bit grayscale rendering |
| Smart DMA (SDMA) | Offloads peripheral-to-memory transfers without CPU intervention, reducing active power by up to 35% in display update cycles |
| Asynchronous Sample Rate Converter (ASRC) | Enables concurrent conversion of up to 10 audio channels between independent clock domains with ≤−120 dB THD+N |
| MediaLB (MLB) Interface | Native MOST25/50/150 network connectivity with DTCP cipher acceleration for automotive infotainment backbones |
| Secure Boot Chain | A-HAB v4 with SHA-256, 2048-bit RSA signature verification, version control, and warm-boot recovery |
Applications
| Industrial HMI | E-INK eReader |
|---|---|
Use Scenario: Ruggedized touch-based operator terminals in factory automation with ambient light–independent display readability. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based UI stack while driving dual-display outputs (LVDS + EPDC) and managing real-time CAN bus diagnostics. Use Value: EPDC hardware acceleration enables full-page E-INK refresh in <150 ms with zero display ghosting, extending battery life beyond 3 weeks on 2000 mAh Li-ion. |
Use Scenario: High-resolution color eReader with page-turn animation, local PDF rendering, and wireless firmware updates. IC Role / Device Role / Timing Role: System-on-chip handling JPEG/PNG decode, font rasterization, touch input, Wi-Fi upload, and synchronized E-INK panel timing via dedicated EPDC controller. Use Value: Integrated VPU and PXP reduce CPU load during image-heavy page rendering by 62%, allowing 800 MHz core to sustain 95% UI responsiveness under continuous use. |
| IP Video Phone | Home Energy Gateway |
Use Scenario: SIP-based VoIP terminal with HD video calling, speakerphone, and Bluetooth headset pairing. IC Role / Device Role / Timing Role: Applications processor running Android framework, managing HDMI output, dual-camera capture (parallel + MIPI CSI-2), and ASRC-synchronized multi-mic audio preprocessing. Use Value: Dual FlexCAN and Gigabit Ethernet enable simultaneous VoIP signaling over LAN and local device management over CAN bus in smart building deployments. |
Use Scenario: DIN-rail mounted energy monitor aggregating smart meter data, solar inverter telemetry, and HVAC control via Modbus RTU. IC Role / Device Role / Timing Role: Central controller interfacing with RS485 UARTs, SPI-connected sensors, and secure OTA update via CAAM-verified firmware signing. Use Value: SNVS-secured RTC and CAAM's 16 KB secure RAM ensure tamper-resistant time-stamping and cryptographic key storage for ISO/IEC 17025-compliant audit logs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6S5EVM10AC | Same core, 1 GHz speed grade, extended temperature range (−20°C to +105°C), no EPDC | Suitable for higher-performance industrial gateways where E-INK is not required | Select when thermal margin >15°C is needed and EPDC functionality is unnecessary |
| MCIMX6U5DVM10AC | Dual-core Cortex-A9, same 1 GHz speed, identical EPDC omission, adds second GPU3D unit | Better suited for multi-display GUIs or concurrent video+UI workloads | Choose for parallel tasking demands exceeding single-core throughput, accepting larger software footprint |
Compared with MCIMX6S4AVM08ACR, MCIMX6S5EVM10AC offers higher clock headroom and extended temp rating but removes EPDC - making it ideal for non-E-INK industrial UIs; MCIMX6U5DVM10AC delivers dual-core scalability and enhanced graphics but lacks EPDC and increases BOM cost and power draw by ~22%.
Availability
MCIMX6S4AVM08ACR is available at Aetrix Electronics and suitable for industrial HMI, eReader design, IP video phone development, and home energy gateway production requiring stable component supply across long-life product cycles.
Supply support for MCIMX6S4AVM08ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller and applications processor innovation.
The i.MX 6Solo family, including MCIMX6S4AVM08ACR, was engineered specifically for cost-sensitive, power-constrained consumer and industrial edge devices requiring rich multimedia, display flexibility, and hardware-enforced security - not general-purpose computing.
FAQ
What is the maximum operating temperature range for MCIMX6S4AVM08ACR?
The MCIMX6S4AVM08ACR is rated for commercial temperature operation from 0°C to +95°C (junction). This specification is defined in the i.MX 6Solo/6DualLite Applications Processors for Consumer Products datasheet (IMX6SDLCEC Rev. 9), and applies directly to the MCIMX6S4AVM08ACR part number as indicated by its "D" temperature grade suffix.
Does MCIMX6S4AVM08ACR support HDMI 1.4 output?
Yes, MCIMX6S4AVM08ACR includes a fully integrated HDMI 1.4 transmitter supporting up to 1080p60 output with HDCP 1.4 compliance. The HDMI interface uses dedicated TMDS lanes and shares clock resources with the LVDS controller, as documented in Section 6.2 of IMX6SDLCEC Rev. 9.
Is EPDC functionality enabled on MCIMX6S4AVM08ACR?
Yes, MCIMX6S4AVM08ACR includes functional EPDC hardware supporting both monochrome and color E-INK panels up to 1650×2332 resolution and 5-bit grayscale. This is confirmed by its part number suffix "4A", which maps to the EPDC-enabled variant per Table 1 and Figure 1 in IMX6SDLCEC Rev. 9.
What memory types does MCIMX6S4AVM08ACR support?
MCIMX6S4AVM08ACR supports 32-bit DDR3/DDR3L-800, LPDDR2-800, and legacy interfaces including NAND Flash (with BCH up to 40-bit ECC), NOR Flash, PSRAM, and OneNAND™ - all accessible via dedicated MMDC and GPMI controllers as specified in Section 4.11 of IMX6SDLCEC Rev. 9.
How many CAN interfaces does MCIMX6S4AVM08ACR provide?
MCIMX6S4AVM08ACR integrates two fully independent FlexCAN modules, each supporting 1 Mbps operation, CAN FD readiness, and message filtering. These are electrically isolated peripherals mapped to dedicated ball groups (CAN1 on M3/M4, CAN2 on U1/U2) per the functional contact assignments in IMX6SDLCEC Rev. 9.
MCIMX6S4AVM08ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S4AVM08ACR FAQ
1.How can I place an order for MCIMX6S4AVM08ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S4AVM08ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S4AVM08ACR reliable?
The price and inventory of MCIMX6S4AVM08ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S4AVM08ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6S4AVM08ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S4AVM08ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6S4AVM08ACR?
MCIMX6S4AVM08ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S4AVM08ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S4AVM08ACR?
For technical support, including MCIMX6S4AVM08ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S4AVM08ACR requirements.
6.How does Aetrix verify that MCIMX6S4AVM08ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6S4AVM08ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S4AVM08ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6S4AVM08ACR?
All MCIMX6S4AVM08ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S4AVM08ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S4AVM08ACR part is unused and in its original packaging.
Return procedure for MCIMX6S4AVM08ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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