NXP Semiconductors MCIMX6S5DVM10ADR

Overview

MCIMX6S5DVM10ADR from NXP Semiconductors is a single-core Arm Cortex-A9 applications processor operating at 1 GHz, featuring integrated VPU, GPU2D/GPU3D, and MLB interface - but excluding EPDC - in a 21 mm × 21 mm MAPBGA package with 0.8 mm pitch. It delivers 1080p video decode/encode, OpenGL ES 2.0 graphics acceleration, dual CAN, Gigabit Ethernet, and DDR3/DDR3L/LPDDR2-800 memory support for embedded HMI and multimedia terminals.

For engineers reviewing the MCIMX6S5DVM10ADR datasheet, MCIMX6S5DVM10ADR pinout, MCIMX6S5DVM10ADR application, or MCIMX6S5DVM10ADR equivalent, key selection criteria include confirmed absence of EPDC, commercial temperature grade (0°C to +95°C), 1 GHz core frequency with DVFS, 512 KB L2 cache allocation, and MLB interface support for MOST network integration.

Technical Context

The MCIMX6S5DVM10ADR implements a single Arm Cortex-A9 core with TrustZone security, 32 KB L1 instruction and data caches, and shares a 512 KB unified L2 cache exclusively with its sole CPU core. Its multimedia subsystem integrates VPU for H.264/VC-1/MPEG-4 decode and encode, GPU3Dv5 (OpenGL ES 2.0) and GPU2Dv2 for 2D/3D rendering, and ASRC supporting up to 10 concurrent audio sample rate conversions.

System-level connectivity includes four uSDHC ports (UHS-I SDR-104), three USB 2.0 hosts (one with HS PHY, two with HSIC PHY), one USB OTG with integrated HS PHY, PCIe v2.0 x1 endpoint/root complex, dual FlexCAN (1 Mbps), and ESAI supporting 260 kHz stereo I2S with 7.1-channel output - all managed via a configurable IOMUXC and clock control module (CCM) with eight PLLs.

Key Specifications

Pinout & Package

MCIMX6S5DVM10ADR is housed in a 224-ball MAPBGA package (21 mm × 21 mm, 0.8 mm pitch), compliant with JEDEC MO-270AB. Ball mapping follows i.MX 6Solo signal naming convention per IMX6SDLCEC Rev. 9, with dedicated power domains (VDD_ARM, VDD_SOC, VDD_GPU), DDR3 I/O banks (VDD_DDR, VREF_DDR), and high-speed interfaces routed to perimeter rows for impedance control.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6S8DVM10AD, MCIMX6S5DVM10ADR removes EPDC logic to reduce die area and dynamic power, while retaining full multimedia and connectivity capability for non-E-INK applications; versus MCIMX6U5DVM10AD, it trades dual-core scalability for lower cost, smaller footprint, and simpler thermal design in single-tasking systems.

Availability

MCIMX6S5DVM10ADR is available at Aetrix Electronics and suitable for industrial HMI terminals, automotive infotainment gateways, and medical display systems requiring stable component supply across multi-year production cycles.

Supply support for MCIMX6S5DVM10ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with over 50 years of embedded systems expertise.

The i.MX 6Solo family, including MCIMX6S5DVM10ADR, was designed specifically for cost-optimized multimedia HMI applications requiring rich graphics, video, and multi-protocol connectivity - not general-purpose computing.

FAQ

Does MCIMX6S5DVM10ADR support HDMI 1.4 output with HDCP?

MCIMX6S5DVM10ADR supports HDMI 1.4 video output but does not integrate HDCP encryption logic. HDCP compliance requires an external HDCP repeater or use of SCIMX6S5DVM10CD, which includes silicon-enforced HDCP keys. The MCIMX6S5DVM10ADR's HDMI transmitter outputs standard TMDS signals compatible with third-party HDCP dongles or certified receivers.

What is the maximum DDR3 memory capacity supported by MCIMX6S5DVM10ADR?

MCIMX6S5DVM10ADR supports up to 2 GB of DDR3/DDR3L/LPDDR2-800 memory using its 32-bit bus interface. This limit arises from address space constraints in the MMDC controller and is validated in the IMX6SDLCEC datasheet Section 4.11. Larger capacities require external memory expansion via FPGA or companion controller.

Can MCIMX6S5DVM10ADR operate without an external PMIC?

MCIMX6S5DVM10ADR integrates internal LDOs for select domains (e.g., VDDA_USB, VDDA_CSI), but requires an external PMIC to generate VDD_ARM (1.0–1.25 V), VDD_SOC (1.2–1.3 V), and VDD_GPU (1.05–1.2 V) with tight voltage tolerance and sequencing. The reference design EVK-MCIMX6S5 uses the PF0100 PMIC for full compliance.

Is the MLB interface on MCIMX6S5DVM10ADR compatible with MOST25, MOST50, and MOST150 physical layers?

Yes - the MLB interface on MCIMX6S5DVM10ADR supports all three MOST generations (25/50/150 Mbps) via programmable serializer/deserializer settings in the MLB controller register map. DTCP acceleration is enabled for MOST150 traffic, while MOST25/50 operate in legacy mode without encryption.

What boot devices are natively supported by MCIMX6S5DVM10ADR without external glue logic?

MCIMX6S5DVM10ADR supports direct boot from NAND Flash (with BCH40 ECC), SD/eMMC (via uSDHC0), SPI NOR Flash (via eCSPI), and OneNAND via its integrated boot ROM. Boot from SATA or PCIe SSD requires bootloader-level driver initialization and is not ROM-resident.