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NXP Semiconductors MCIMX6S5EVM10ABR

Part No.:
MCIMX6S5EVM10ABR
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
624-LFBGA
Datasheet:
AetrixMCIMX6S5EVM10ABR.pdf
Description:
IC MPU I.MX6S 1.0GHZ 624MAPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,844

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Product details

Overview

MCIMX6S5EVM10ABR from NXP Semiconductors is an i.MX 6Solo applications processor featuring a single Arm® Cortex®-A9 core operating at 1 GHz, integrated Video Processing Unit (VPU), 3D/2D graphics accelerators (GPU3Dv5/GPU2Dv2), and MediaLB (MLB) interface - all in a 21 mm × 21 mm MAPBGA package with 0.8 mm pitch. It targets extended-temperature embedded systems requiring multimedia-rich HMI, portable medical devices, and IP-connected consumer electronics.

For engineers reviewing the MCIMX6S5EVM10ABR datasheet, MCIMX6S5EVM10ABR pinout, MCIMX6S5EVM10ABR application, or MCIMX6S5EVM10ABR equivalent, key selection criteria include its extended commercial temperature range (–20°C to +105°C), absence of EPDC (E-Ink Display Controller), support for DDR3/DDR3L/LPDDR2-800 memory, dual CAN interfaces, and hardware-accelerated video decode up to 1080p.

Technical Context

The MCIMX6S5EVM10ABR implements a symmetric Arm Cortex-A9 MPCore platform with 32 KB L1 instruction and data caches, 512 KB unified L2 cache, NEON MPE co-processor, and TrustZone security. Its memory subsystem supports 32-bit DDR3/DDR3L/LPDDR2-800 at 800 MHz (400 MHz clock), with boot ROM (96 KB), OCRAM (128 KB), and secure RAM (16 KB).

It integrates dedicated accelerators including VPU (H.264/VC-1/MPEG-4 decode), IPUv3H (image processing), PXP (pixel pipeline), ASRC (asynchronous sample rate conversion), and CAAM (cryptographic acceleration with NIST-certified PRNG). Power management includes DVFS, SW state retention, and on-chip LDOs.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreSingle Arm Cortex-A9 @ 1 GHz - delivers 2000 DMIPS for real-time OS and multimedia workloads
Memory Interface32-bit DDR3/DDR3L/LPDDR2-800 - enables up to 12.8 GB/s bandwidth for high-resolution UI rendering
Graphics AccelerationGPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - supports concurrent 3D UI and 2D compositing without CPU load
Video ProcessingVPU with 1080p decode - offloads H.264/VC-1/MPEG-4 decoding, reducing CPU utilization by >70% in media playback
SecurityCAAM + TrustZone + A-HAB v4 - enables secure boot, AES/SHA-256 acceleration, and 2048-bit RSA key verification
Temperature Range–20°C to +105°C (Extended Commercial) - validated for industrial HMI and portable medical enclosures without active cooling
PackageMAPBGA, 21 mm × 21 mm, 0.8 mm pitch, 484-ball - compatible with standard PCB assembly processes and thermal vias for SoC-level heat dissipation

Pinout & Package

MCIMX6S5EVM10ABR uses a 484-ball MAPBGA package (Case 2240), 21 mm × 21 mm, 0.8 mm pitch, RoHS-compliant. Ball map follows i.MX 6Solo signal naming convention per IMX6SDLCEC Rev. 9.

Pin/Terminal Circuit Role Design Meaning
VDD_ARMCore power supply1.2 V ±3% input for Cortex-A9 core; requires low-noise regulation and local decoupling
VDD_SOCSoC logic power1.2 V ±3% for L2 cache, interconnect, and peripheral domains; shared rail with GPU/VPU
VDD_DDRDDR memory interface1.5 V (DDR3) or 1.35 V (DDR3L) - must be sequenced after VDD_SOC during power-up
CLK_24MUSB reference clock24 MHz crystal input - mandatory for USB OTG/host PHY operation; limits max SoC speed to 996 MHz
ENET_RXD[3:0]Gigabit Ethernet receiveLVDS-capable inputs supporting IEEE 802.3ab; requires matched trace lengths and 100 Ω differential termination
CAN1_TX / CAN1_RXFlexCAN controller 1Differential pair for 1 Mbps CAN FD-ready bus; supports ISO 11898-2 physical layer with external transceiver

Key Features

Feature Design Value
MediaLB (MLB) InterfaceDirect connection to MOST25/50/150 networks with DTCP cipher accelerator - eliminates need for external bridge IC in automotive infotainment audio distribution
ASRC Engine10-channel asynchronous sample rate conversion with <–120 dB THD+N - enables simultaneous multi-source audio mixing (e.g., Bluetooth + HDMI + local codec) without jitter-induced artifacts
Smart DMA (SDMA)Independent programmable DMA controller with 32-channel arbitration - handles GPMI NAND transfers, camera sensor streaming, and display buffering without CPU intervention
EPIT & GPT TimersTwo Enhanced Periodic Interrupt Timers + four General Purpose Timers - provide precise sub-millisecond timing for motor control, PWM generation, and real-time task scheduling
Secure Non-Volatile Storage (SNVS)Integrated SRTC + tamper-detect circuitry - maintains time-of-day and cryptographic keys across full power cycles and brown-out events

Applications

Industrial HMI Portable Medical Device

Use Scenario: Touch-enabled panel PC in factory automation cabinet with ambient temperature up to 65°C.

IC Role / Device Role / Timing Role: Main applications processor executing Linux-based HMI stack, driving dual LVDS displays and managing CAN bus communication with PLCs.

Use Value: Extended temperature rating (–20°C to +105°C) ensures reliable operation without forced air cooling; dual CAN ports enable redundant fieldbus connectivity.

Use Scenario: Battery-powered ultrasound imaging handheld with real-time Doppler processing and DICOM export.

IC Role / Device Role / Timing Role: System-on-chip handling image acquisition via MIPI CSI-2, GPU-accelerated beamforming visualization, and encrypted Wi-Fi transmission.

Use Value: VPU offloads 1080p video decode for patient video review; CAAM enables HIPAA-compliant AES-256 encryption of stored images.

IP Phone Gateway Home Energy Management Hub

Use Scenario: VoIP gateway aggregating SIP endpoints, Bluetooth headsets, and PSTN analog lines in residential wiring closet.

IC Role / Device Role / Timing Role: Applications processor running Asterisk PBX, managing ESAI/SSI audio routing, USB OTG for firmware updates, and Gigabit Ethernet backhaul.

Use Value: ESAI supports 260 kHz stereo I2S with 7.1 channel output for multi-room audio; four UARTs enable legacy RS485 building automation integration.

Use Scenario: DIN-rail mounted energy monitor aggregating smart meter data, Z-Wave sensors, and solar inverter telemetry for cloud reporting.

IC Role / Device Role / Timing Role: Central controller interfacing with eMMC storage, dual CAN buses (for EVSE and PV inverters), and secure TLS over Ethernet/Wi-Fi.

Use Value: MLB interface supports legacy home audio network bridging; SNVS-backed secure boot prevents unauthorized firmware replacement in field-deployed units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MCIMX6U5EVM10ABDual-core Cortex-A9 (2×), same VPU/GPU/MLB, identical package and temp gradeHigher compute throughput for multi-threaded Linux services (e.g., Docker containers, dual-display compositing)Select when application requires parallel task execution beyond single-core capability - no PCB change needed
MCIMX6S5DVM10ABIdentical core, VPU, GPU, MLB, and memory interface; differs only in temperature grade (0°C to +95°C commercial)Suitable for climate-controlled indoor environments only; lower cost due to reduced test screeningChoose for cost-sensitive consumer products where ambient temperature remains below 60°C

Compared with MCIMX6S5EVM10ABR, MCIMX6U5EVM10AB offers scalable performance via dual cores without altering thermal or layout design, while MCIMX6S5DVM10AB reduces BOM cost in thermally benign deployments - both retain full software compatibility and pinout.

Availability

MCIMX6S5EVM10ABR is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, and IP-connected home energy systems requiring stable component supply across multi-year production cycles.

Supply support for MCIMX6S5EVM10ABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, mobile, and communication infrastructure markets.

The i.MX 6Solo family, including MCIMX6S5EVM10ABR, was designed specifically for cost-optimized, multimedia-rich embedded applications demanding high performance per watt and extended temperature reliability - targeting HMI, medical, and smart home edge nodes.

FAQ

What is the maximum DDR3 memory speed supported by MCIMX6S5EVM10ABR?

MCIMX6S5EVM10ABR supports DDR3/DDR3L/LPDDR2-800 memory interfaces, with a maximum data rate of 800 MT/s (400 MHz clock). This translates to a theoretical peak bandwidth of 12.8 GB/s for the 32-bit bus. The memory controller is fully compliant with JEDEC DDR3 standards and includes hardware-calibrated impedance matching for signal integrity.

Does MCIMX6S5EVM10ABR include an E-Ink Display Controller (EPDC)?

No, MCIMX6S5EVM10ABR does not include the EPDC module. Per Table 1 in IMX6SDLCEC Rev. 9, the "5" in the part number suffix indicates "With VPU, GPU, MLB, no EPDC". This distinguishes it from variants like MCIMX6S8xxx which include EPDC support for color/monochrome E-Ink panels up to 1650×2332 resolution.

What USB configurations are available on MCIMX6S5EVM10ABR?

MCIMX6S5EVM10ABR provides one high-speed USB 2.0 OTG port (with integrated PHY) and three high-speed USB 2.0 host ports: one with integrated HS PHY and two with integrated HS-IC USB (High-Speed Inter-Chip) PHYs. All support 480 Mbps operation and comply with USB 2.0 specifications.

Is MCIMX6S5EVM10ABR pin-compatible with other i.MX 6Solo variants in the same package?

Yes, MCIMX6S5EVM10ABR is pin-compatible with all i.MX 6Solo processors in the 484-ball MAPBGA package (21 mm × 21 mm, 0.8 mm pitch), including MCIMX6S5DVM10AB and MCIMX6S8EVM10AB. Signal ball assignments follow the standardized i.MX 6 series naming convention defined in IMX6SDLCEC Rev. 9.

What security features are implemented in MCIMX6S5EVM10ABR?

MCIMX6S5EVM10ABR integrates Arm TrustZone, CAAM (Cryptographic Acceleration and Assurance Module) with NIST-certified PRNG, SNVS (Secure Non-Volatile Storage), CSU (Central Security Unit), and A-HAB v4 (Advanced High Assurance Boot). These enable secure boot, AES/SHA-256 acceleration, 2048-bit RSA key verification, and tamper-resistant key storage - all confirmed in the i.MX 6Solo Security Reference Manual (IMX6DQ6SDLSRM).

MCIMX6S5EVM10ABR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
624-LFBGA
Series:
i.MX6S
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
-
USB:
USB 2.0 + PHY (4)
Voltage - I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Supplier Device Package:
624-MAPBGA (21x21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

MCIMX6S5EVM10ABR FAQ

1.How can I place an order for MCIMX6S5EVM10ABR through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6S5EVM10ABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6S5EVM10ABR reliable?

The price and inventory of MCIMX6S5EVM10ABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S5EVM10ABR is usually 5 days.

3.What payment methods are accepted for MCIMX6S5EVM10ABR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S5EVM10ABR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6S5EVM10ABR?

MCIMX6S5EVM10ABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6S5EVM10ABR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6S5EVM10ABR?

For technical support, including MCIMX6S5EVM10ABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S5EVM10ABR requirements.

6.How does Aetrix verify that MCIMX6S5EVM10ABR is sourced from the original manufacturer or authorized distributors?

All MCIMX6S5EVM10ABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S5EVM10ABR meets industry standards.

7.What is the process for return or replacement of MCIMX6S5EVM10ABR?

All MCIMX6S5EVM10ABR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S5EVM10ABR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6S5EVM10ABR part is unused and in its original packaging.

Return procedure for MCIMX6S5EVM10ABR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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