NXP Semiconductors MCIMX6S5EVM10ACR

Overview

MCIMX6S5EVM10ACR from NXP Semiconductors is an i.MX 6Solo applications processor featuring a single Arm Cortex-A9 core operating at 1 GHz, integrated VPU and GPU for 1080p video decode/encode and OpenGL ES 2.0 graphics acceleration, 512 KB L2 cache, and support for DDR3/DDR3L/LPDDR2-800 memory. It targets embedded HMI, portable medical devices, and IP phones requiring multimedia capability with extended temperature operation (–20°C to +105°C).

For engineers reviewing the MCIMX6S5EVM10ACR datasheet, MCIMX6S5EVM10ACR pinout, MCIMX6S5EVM10ACR application, or MCIMX6S5EVM10ACR equivalent, key selection criteria include its extended-temperature BGA package, absence of EPDC (no E-Ink controller), inclusion of MLB interface, and dual CAN bus support-critical for industrial HMI and connected medical designs.

Technical Context

The MCIMX6S5EVM10ACR implements a single-core Arm Cortex-A9 MPCore with TrustZone security, 32 KB L1 instruction and data caches, and a shared 512 KB unified L2 cache. Its memory subsystem supports 32-bit DDR3/DDR3L/LPDDR2-800 up to 800 MHz, while its multimedia subsystem integrates VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP), GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), and IPUv3H for image processing.

Power management includes Dynamic Voltage and Frequency Scaling (DVFS), on-chip LDOs, temperature sensor monitoring, and multiple low-power states. Connectivity features two FlexCAN 2.0B controllers (1 Mbps), Gigabit Ethernet (IEEE 1588 compliant), four UARTs (up to 5 Mbps), four I²C interfaces (400 kbps), PCIe v2.0 x1, HDMI 1.4, MIPI DSI/CSI-2, and MLB interface for MOST network integration.

Key Specifications

Pinout & Package

MCIMX6S5EVM10ACR uses a 21 mm × 21 mm MAPBGA package with 0.8 mm pitch and 484 balls (Case 2240). Pin assignments follow the i.MX 6Solo signal naming convention defined in IMX6SDLCEC Rev. 9, with dedicated ball groups for DDR3, VPU/GPU power domains, and high-speed interfaces including HDMI, PCIe, and dual CAN.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with MCIMX6S5DVM10AC, MCIMX6S5EVM10ACR provides guaranteed operation at –20°C startup and +105°C junction, critical for unheated enclosures; versus MCIMX6U5EVM10AC, it offers lower power, simpler thermal management, and identical peripheral integration at reduced core count-ideal for deterministic single-threaded HMI and medical UI tasks.

Availability

MCIMX6S5EVM10ACR is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, and IP phones requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MCIMX6S5EVM10ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The i.MX 6Solo family, including MCIMX6S5EVM10ACR, was designed specifically for cost-sensitive, multimedia-rich embedded applications demanding extended temperature operation, hardware-accelerated video/audio, and robust security-targeting HMI, medical, and communications endpoints.

FAQ

What is the maximum operating temperature specification for MCIMX6S5EVM10ACR?

The MCIMX6S5EVM10ACR is rated for extended commercial temperature operation with a junction temperature range of –20°C to +105°C. This specification is validated per NXP's IMX6SDLCEC datasheet Rev. 9 and enables reliable deployment in industrial enclosures and portable medical equipment without active cooling. The part's thermal design must maintain die temperature within this window under worst-case power dissipation conditions.

Does MCIMX6S5EVM10ACR include an E-Ink display controller (EPDC)?

No, MCIMX6S5EVM10ACR does not include the EPDC module. Per Table 1 in the IMX6SDLCEC datasheet, the "5" in the part number denotes configuration with VPU, GPU, and MLB-but explicitly excludes EPDC. For E-Ink support, engineers must select variants such as MCIMX6S8EVM10AC (which includes EPDC) or implement external EPD timing controllers.

What package type and ball count does MCIMX6S5EVM10ACR use?

MCIMX6S5EVM10ACR uses a 21 mm × 21 mm MAPBGA package with 0.8 mm pitch and 484 balls (NXP Case 2240). This package is documented in Section 6.2 of IMX6SDLCEC Rev. 9 and shares mechanical and thermal characteristics with other i.MX 6Solo/6DualLite family members, enabling consistent PCB layout practices across product generations.

Which security features are implemented in MCIMX6S5EVM10ACR?

MCIMX6S5EVM10ACR integrates CAAM (Cryptographic Acceleration and Assurance Module) with AES-128/256, SHA-1/256, and TRNG; SNVS (Secure Non-Volatile Storage) with SRTC; CSU (Central Security Unit); and A-HABv4 (Advanced High Assurance Boot) supporting 2048-bit RSA and SHA-256. These features enable secure boot, encrypted firmware updates, and runtime key protection-all verified in the i.MX 6Solo Security Reference Manual (IMX6DQ6SDLSRM).

Can MCIMX6S5EVM10ACR support dual-display output simultaneously?

Yes, MCIMX6S5EVM10ACR supports concurrent dual-display operation using combinations such as HDMI + LVDS, HDMI + parallel RGB, or LVDS + parallel RGB-up to a total raw pixel rate of 450 Mpixels/sec at 24 bpp. This capability is enabled by its integrated LCD controller, HDMI 1.4 transmitter, and LVDS serializer, as detailed in Section 1.2 of IMX6SDLCEC Rev. 9.