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NXP Semiconductors MCIMX6S5EVM10ADR
- Part No.:
- MCIMX6S5EVM10ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S5EVM10ADR.pdf
- Description:
- IC MPU I.MX6S 1GHZ 624MAPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,658
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Product details
Overview
MCIMX6S5EVM10ADR from NXP Semiconductors is a single-core Arm Cortex-A9 applications processor operating at 1 GHz, supporting DDR3/DDR3L/LPDDR2-800 memory, integrated VPU and GPU2D/GPU3D accelerators, and dual CAN interfaces. It targets embedded HMI, portable medical devices, and IP phones requiring multimedia processing, low-power operation, and extended temperature support (–20°C to +105°C).
For engineers reviewing the MCIMX6S5EVM10ADR datasheet, MCIMX6S5EVM10ADR pinout, MCIMX6S5EVM10ADR application, or MCIMX6S5EVM10ADR equivalent, key selection criteria include its extended-temperature MAPBGA-484 package, absence of EPDC, presence of MLB and HDCP-disabled configuration, and compatibility with i.MX 6Solo-specific boot and power management architecture.
Technical Context
The MCIMX6S5EVM10ADR implements a single Arm Cortex-A9 core with 32 KB L1 instruction and data caches, 512 KB shared L2 cache, NEON MPE coprocessor, and TrustZone security. It integrates dedicated hardware accelerators including VPU (1080p decode/encode), GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), and ASRC for multi-channel audio sample rate conversion.
Its system-level architecture includes MMDC for DDR3/DDR3L/LPDDR2 memory control, GPMI for NAND Flash with BCH40 ECC, dual FlexCAN controllers (1 Mbps), four eCSPI, four I²C (400 kbps), five UARTs (up to 5 Mbps), and PCIe v2.0 x1 root/endpoint capability - all managed via CCM clock control and GPC power gating under DVFS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A9 @ 1 GHz - delivers 2000 DMIPS for real-time OS and application execution in resource-constrained embedded systems. |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 - supports up to 2 GB external RAM with interleaving disabled; enables low-latency access for multimedia buffers and OS footprint. |
| Graphics Acceleration | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - renders UI overlays, video compositing, and 2D graphics without CPU load, reducing system power by >30% vs software rendering. |
| Video Processing | VPU with 1080p decode/encode - offloads H.264/VC-1/MPEG-4 decoding and encoding, freeing CPU for network stack or application logic in IP phone or HMI use cases. |
| Temperature Range | –20°C to +105°C junction - validated for extended commercial environments such as industrial HMIs and portable medical equipment without derating. |
| Security Features | CAAM (16 KB secure RAM), SNVS, CSU, A-HABv4 - enables secure boot with SHA-256/2048-bit RSA, encrypted firmware updates, and tamper-resistant key storage for DRM or HIPAA-compliant data handling. |
| Package | MAPBGA-484, 21 mm × 21 mm, 0.8 mm pitch - compatible with standard PCB assembly processes; thermal pad enables efficient heat dissipation in fanless enclosures. |
Pinout & Package
MCIMX6S5EVM10ADR uses a 21 mm × 21 mm plastic MAPBGA package with 484 balls and 0.8 mm pitch. The package includes an exposed thermal pad on the underside for enhanced thermal performance in high-duty-cycle applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2–1.3 V input for Cortex-A9 core; requires tight regulation (±3%) and local decoupling to sustain 1 GHz operation under dynamic load. |
| VDD_SOC | SoC domain supply | 1.2–1.3 V for L2 cache, MMDC, and interconnect; shares regulator with VDD_ARM in many designs to simplify power tree. |
| VDD_DDR | DDR interface supply | 1.5 V (DDR3), 1.35 V (DDR3L), or 1.2 V (LPDDR2); must be sequenced after VDD_SOC and before reset release per boot requirements. |
| BOOT_MODE[1:0] | Boot configuration inputs | Pulled high/low at power-on to select boot source (eMMC, NAND, SPI NOR, or USB); determines initial ROM vector and peripheral initialization sequence. |
| FLEXCAN1_TX / RX | CAN 2.0B physical layer interface | Differential pair supporting 1 Mbps bus rate; requires external transceiver and termination for automotive-grade noise immunity in HMI or energy management systems. |
| ENET_MDIO / MDC | IEEE 802.3 management interface | Serial control bus for PHY register access; enables auto-negotiation, link status monitoring, and IEEE 1588 timestamp synchronization in Gigabit Ethernet applications. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage and Frequency Scaling (DVFS) | Reduces VDD_ARM from 1.3 V to 0.95 V and frequency from 1 GHz to 396 MHz during idle, cutting active power by 65% while maintaining real-time responsiveness. |
| Smart DMA (SDMA) controller | Offloads memory-to-peripheral transfers (e.g., camera → VPU → DDR) without CPU intervention, enabling zero-copy video pipelines and deterministic latency. |
| MLB (MediaLB) interface | Supports MOST25/50/150 networks with DTCP cipher acceleration - enables secure audio/video streaming in automotive infotainment gateways without external encryption ICs. |
| ASRC with 10-channel concurrency | Converts audio sampling rates (e.g., 44.1 kHz ↔ 48 kHz) across independent streams with <–120 dB THD+N - critical for multi-source audio mixing in IP phones and medical monitors. |
| Secure Non-Volatile Storage (SNVS) | Contains tamper-resistant SRTC and 2 KB OTP fuses for storing cryptographic keys, boot policy flags, and device-unique identifiers - foundational for FIPS 140-2 Level 2 compliance. |
Applications
| Industrial HMI | Portable Medical Monitor |
|---|---|
Use Scenario: Touch-enabled panel PC controlling PLCs and SCADA visualization in factory environments with ambient temperatures up to 65°C. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based Qt UI, driving dual LVDS displays, and managing real-time CAN bus diagnostics. Use Value: Extended temperature rating (–20°C to +105°C) ensures reliability without forced cooling; integrated GPU2D eliminates need for discrete graphics, reducing BOM cost by $1.80. |
Use Scenario: Battery-powered vital signs monitor capturing ECG, SpO₂, and temperature with wireless telemetry to hospital network. IC Role / Device Role / Timing Role: Central SoC running RTOS, processing sensor data via SDMA-accelerated ADC transfers, and encrypting patient records using CAAM before BLE transmission. Use Value: DVFS and power-gated peripherals extend battery life to 14 hours; SNVS-secured key storage meets HIPAA encryption-at-rest requirements. |
| IP Phone Endpoint | Home Energy Gateway |
Use Scenario: VoIP desk phone with HD voice, touchscreen GUI, and SIP registration over Gigabit Ethernet. IC Role / Device Role / Timing Role: Applications processor hosting SIP stack, performing acoustic echo cancellation via NEON-optimized algorithms, and rendering UI on HDMI display. Use Value: ASRC handles simultaneous 8-kHz telephony and 48-kHz media streams; integrated ENET MAC with IEEE 1588 support enables sub-100 µs jitter for QoS-critical RTP packets. |
Use Scenario: Smart home hub aggregating Zigbee, Z-Wave, and Wi-Fi sensor data, displaying energy analytics on e-Ink display, and uploading to cloud via LTE. IC Role / Device Role / Timing Role: System controller interfacing with multiple radios, managing secure OTA firmware updates via A-HABv4, and driving monochrome EPD display (not enabled in this variant). Use Value: MLB interface supports legacy home automation networks; CAAM accelerates TLS 1.2 handshake, reducing cloud connection time by 320 ms versus software-only crypto. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6S5DVM10AC | Commercial temperature grade (0°C to +95°C); identical core, memory, and peripheral configuration. | Suitable for indoor consumer electronics only; not rated for thermal cycling in industrial enclosures. | Select when cost sensitivity outweighs environmental robustness and board layout allows rework for thermal pad grounding. |
| MCIMX6U5EVM10AD | Dual-core Cortex-A9, same 1 GHz speed, extended temp, but adds EPDC and removes MLB; larger 624-ball package. | Better for e-Ink display-centric designs (eReaders), worse for MOST network integration or space-constrained layouts. | Choose only if dual-core parallelism is required and EPDC functionality justifies 29% larger PCB area and $2.40 higher unit cost. |
Compared with MCIMX6S5EVM10ADR, MCIMX6S5DVM10AC sacrifices extended temperature operation for lower procurement cost, while MCIMX6U5EVM10AD trades MLB connectivity and compact packaging for dual-core throughput and EPD support - making MCIMX6S5EVM10ADR optimal for thermally demanding, CAN/MLB-based embedded gateways where single-core efficiency suffices.
Availability
MCIMX6S5EVM10ADR is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, and IP phone endpoints requiring stable component supply, long-term lifecycle assurance, and extended-temperature qualification.
Supply support for MCIMX6S5EVM10ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with annual R&D investment exceeding $1.2 billion.
The i.MX 6Solo family, including MCIMX6S5EVM10ADR, was designed specifically for cost-sensitive, multimedia-rich embedded applications requiring balanced performance, power efficiency, and extended temperature resilience - targeting human-machine interfaces and portable professional electronics.
FAQ
What is the maximum DDR3 memory bandwidth supported by MCIMX6S5EVM10ADR?
MCIMX6S5EVM10ADR supports a 32-bit DDR3/DDR3L interface running at 800 MHz data rate, delivering a theoretical peak bandwidth of 3.2 GB/s. Real-world sustained bandwidth is ~2.1 GB/s due to MMDC arbitration overhead and command scheduling latency, sufficient for 1080p video playback and dual-display rendering without frame drops.
Does MCIMX6S5EVM10ADR include hardware support for secure boot?
Yes, MCIMX6S5EVM10ADR implements Advanced High Assurance Boot (A-HABv4) with SHA-256 hashing, 2048-bit RSA signature verification, and version control. Secure boot validates signed firmware images stored in eMMC or NAND before execution, enforced by the CSU and CAAM modules within MCIMX6S5EVM10ADR.
Can MCIMX6S5EVM10ADR drive two independent displays simultaneously?
Yes, MCIMX6S5EVM10ADR supports concurrent output to two displays via its integrated LCD controller and HDMI 1.4 port. One display may use parallel RGB (up to WUXGA@60 Hz), while the second uses HDMI (up to 1080p@60 Hz), with pixel compositing handled by GPU2D to avoid CPU involvement.
What is the role of the MLB interface in MCIMX6S5EVM10ADR?
The MLB (MediaLB) interface in MCIMX6S5EVM10ADR provides native connectivity to MOST25/50/150 automotive networks, enabling high-bandwidth audio/video streaming and control messaging. It includes DTCP cipher acceleration for content protection, allowing MCIMX6S5EVM10ADR to serve as a secure gateway between infotainment head units and external sensors.
How does MCIMX6S5EVM10ADR manage thermal performance in extended-temperature operation?
MCIMX6S5EVM10ADR incorporates silicon-proven thermal throttling logic that reduces CPU frequency and voltage when die temperature exceeds 95°C. Its MAPBGA-484 package features an exposed thermal pad, and the internal temperature sensor feeds real-time data to the GPC for adaptive DVFS - ensuring continuous operation up to +105°C junction without system reset.
MCIMX6S5EVM10ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S5EVM10ADR FAQ
1.How can I place an order for MCIMX6S5EVM10ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S5EVM10ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S5EVM10ADR reliable?
The price and inventory of MCIMX6S5EVM10ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S5EVM10ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6S5EVM10ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S5EVM10ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6S5EVM10ADR?
MCIMX6S5EVM10ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S5EVM10ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S5EVM10ADR?
For technical support, including MCIMX6S5EVM10ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S5EVM10ADR requirements.
6.How does Aetrix verify that MCIMX6S5EVM10ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6S5EVM10ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S5EVM10ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6S5EVM10ADR?
All MCIMX6S5EVM10ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S5EVM10ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S5EVM10ADR part is unused and in its original packaging.
Return procedure for MCIMX6S5EVM10ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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