NXP Semiconductors MCIMX6S6AVM08ACR
- Part No.:
- MCIMX6S6AVM08ACR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S6AVM08ACR.pdf
- Description:
- IC MPU I.MX6S 800MHZ 624MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6S6AVM08ACR from NXP Semiconductors is an automotive-grade i.MX 6Solo applications processor featuring a single Arm Cortex-A9 core running at 800 MHz, integrated VPU and GPU for 1080p video decode/encode and OpenGL ES 2.0 graphics, dual CAN interfaces, and 21 mm × 21 mm MAPBGA package with 0.8 mm pitch - deployed in automotive instrument clusters and infotainment head units.
For engineers reviewing the MCIMX6S6AVM08ACR datasheet, MCIMX6S6AVM08ACR pinout, MCIMX6S6AVM08ACR application, or MCIMX6S6AVM08ACR equivalent, key selection criteria include automotive temperature range (−40°C to +125°C), DDR3/DDR3L/LPDDR2-800 memory interface, hardware-accelerated multimedia subsystems (VPU/IPU/GPU), and FlexCAN v2.0 compliance for vehicle network integration.
Technical Context
The MCIMX6S6AVM08ACR implements a single-core Arm Cortex-A9 MPCore with TrustZone security, 32 KB L1 instruction and data caches, and 512 KB unified L2 cache. It integrates dedicated hardware accelerators including VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP), IPUv3H for image scaling/compositing, GPU3Dv5 (OpenGL ES 2.0), and GPU2Dv2 for BitBlt operations.
Its system architecture includes dual FlexCAN controllers (1 Mbps), ESAI and SSI audio interfaces supporting up to 260 kHz sampling, ASRC for multi-channel asynchronous sample rate conversion, and a full suite of automotive-qualified peripherals: MLB150 interface, secure boot via A-HABv4, CAAM cryptographic engine with 16 KB secure RAM, and SNVS with secure RTC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A9 @ 800 MHz - delivers deterministic real-time response for HMI rendering and telematics processing |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 - supports up to 2 GB external RAM with interleaved access for sustained bandwidth |
| Video Acceleration | VPU with H.264 BP/MP/HP decode/encode - enables concurrent 1080p30 video playback and recording without CPU load |
| Graphics Engine | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - renders vector-based UIs and overlays with sub-16 ms frame latency |
| Automotive Interfaces | Dual FlexCAN v2.0 (1 Mbps) + MLB150 - connects directly to CAN bus and MOST networks without external bridge ICs |
| Security Subsystem | CAAM + A-HABv4 + SNVS - provides hardware-enforced secure boot, AES-256/SHA-256 acceleration, and tamper-resistant key storage |
| Package | MAPBGA-298, 21 mm × 21 mm, 0.8 mm pitch - qualified for automotive reflow profiles and board-level reliability testing |
Pinout & Package
MCIMX6S6AVM08ACR uses a 21 mm × 21 mm MAPBGA package with 298 balls and 0.8 mm pitch, designed for automotive PCB assembly and thermal management under −40°C to +125°C junction conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Oscillator Input | Accepts 24 MHz crystal for USB PHY clock generation and system timing reference |
| ENET_RXD[3:0] | Ethernet Receive Data | 4-bit parallel RMII interface supporting IEEE 1588 timestamping for time-sensitive networking |
| FLEXCAN1_TX / FLEXCAN2_TX | CAN Transmitter Output | Differential CAN-H outputs compliant with ISO 11898-2, routed to external CAN transceivers |
| MLB_CLK / MLB_DATA | MOST Bus Interface | Low-jitter differential pair for 150 Mbps MediaLB physical layer connection to MOST25/50/150 nodes |
| VDD_ARM / VDD_SOC | Core Power Supplies | Separate 1.2 V (ARM domain) and 1.1 V (SOC domain) inputs enable independent DVFS control |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Dynamic voltage/frequency scaling across ARM, GPU, VPU, and memory domains reduces active power by up to 40% vs fixed-frequency operation |
| Hardware Security Chain | A-HABv4 boot ROM validates signed firmware images using 2048-bit RSA keys before loading into CAAM-secured RAM |
| ASRC Multi-Channel Conversion | Simultaneous 10-channel sample rate conversion (e.g., 44.1 kHz → 48 kHz) with <−120 dB THD+N for premium audio systems |
| IPUv3H Image Pipeline | Real-time deinterlacing, color space conversion (YUV↔RGB), and alpha blending for dual-display cluster instrumentation |
| PCIe v2.0 x1 Endpoint | Configurable as root complex or endpoint - enables direct attachment of automotive ADAS sensors or NVMe storage modules |
Applications
| Automotive Instrument Cluster | Infotainment Head Unit |
|---|---|
Use Scenario: Digital gauge display with animated speedometer, fuel level, ADAS warnings, and navigation turn indicators. IC Role / Device Role / Timing Role: Primary application processor executing QNX or Linux-based HMI stack with real-time rendering pipeline. Use Value: GPU3Dv5 + IPUv3H enables 60 fps overlay compositing across two LVDS displays while maintaining <50 µs interrupt latency for safety-critical alerts. | Use Scenario: In-vehicle multimedia hub supporting Bluetooth audio streaming, HDMI video output, rear-seat entertainment, and voice-controlled navigation. IC Role / Device Role / Timing Role: Central SoC managing concurrent video decode (VPU), audio processing (ESAI/ASRC), and network connectivity (ENET + USB OTG). Use Value: Integrated VPU decodes H.264 1080p30 video while CPU remains free for speech recognition and cloud API handling. |
| Telematics Control Unit (TCU) | Advanced Driver Assistance System (ADAS) Gateway |
Use Scenario: Cellular-connected module aggregating GPS, CAN bus diagnostics, OTA update handling, and emergency call (eCall) services. IC Role / Device Role / Timing Role: Secure host processor running certified eCall stack with CAAM-accelerated TLS 1.2 and SNVS-backed certificate storage. Use Value: Dual FlexCAN ports monitor powertrain and chassis networks simultaneously; MLB150 links to rear camera and surround-view ECUs. | Use Scenario: Sensor fusion gateway consolidating radar, camera, and ultrasonic inputs for parking assistance and blind-spot detection. IC Role / Device Role / Timing Role: High-bandwidth media router forwarding MIPI CSI-2 camera streams to vision processors and timestamping CAN messages via ENET PTP. Use Value: GPMI NAND controller with BCH40 ECC stores calibrated sensor models; PCIe x1 connects to AI accelerator for real-time object detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6S7AVM08AC | Same i.MX 6Solo core but adds EPDC (ePaper Display Controller); 128 KB OCRAM vs 128 KB on MCIMX6S6AVM08ACR | Targeted at digital signage with bistable displays; lacks MLB150 interface required for MOST integration | Select only if ePaper support is mandatory and MOST connectivity is not needed. |
| MCIMX6U5AVM08AC | Dual-core i.MX 6DualLite variant with identical VPU/GPU/MLB features but higher 1 GHz max frequency and 64-bit DDR interface | Suitable for multi-domain systems requiring concurrent infotainment + instrument cluster rendering | Choose when workload exceeds single-core throughput; requires revised DDR layout and thermal design. |
Compared with MCIMX6S6AVM08ACR, MCIMX6S7AVM08AC trades MLB150 for EPDC - limiting automotive network compatibility - while MCIMX6U5AVM08AC doubles CPU throughput at the cost of increased power and PCB complexity, making it optimal only for multi-OS partitioning use cases.
Availability
MCIMX6S6AVM08ACR is available at Aetrix Electronics and suitable for automotive instrument clusters, infotainment head units, and telematics control units requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX6S6AVM08ACR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, high-performance processors and connectivity solutions.
The i.MX 6Solo family - including MCIMX6S6AVM08ACR - was engineered specifically for cost-optimized automotive infotainment and digital cluster applications requiring functional safety readiness, hardware security, and rich multimedia acceleration.
FAQ
What is the maximum operating temperature specification for MCIMX6S6AVM08ACR?
The MCIMX6S6AVM08ACR is rated for automotive temperature grade A (−40°C to +125°C junction temperature), validated per AEC-Q100 Grade 2 requirements. This allows deployment in under-hood and dashboard-mounted modules without derating, provided board-level thermal design meets NXP's recommended copper pour and via guidelines in AN5307.
Does MCIMX6S6AVM08ACR support secure boot with hardware root-of-trust?
Yes, MCIMX6S6AVM08ACR implements A-HABv4 (Advanced High Assurance Boot) with hardware-enforced chain-of-trust: boot ROM verifies signed firmware images using 2048-bit RSA keys stored in eFUSE, then loads authenticated code into CAAM-secured RAM. This prevents unauthorized firmware execution and ensures runtime integrity.
Can MCIMX6S6AVM08ACR drive two independent displays simultaneously?
Yes, MCIMX6S6AVM08ACR supports concurrent dual-display operation via its integrated LCD controller and LVDS transmitter - one display via parallel RGB interface (up to WUXGA@60Hz), and a second via LVDS serial port (up to WUXGA@60Hz). The IPUv3H handles real-time composition and alpha blending between layers.
What video codecs are accelerated by the VPU in MCIMX6S6AVM08ACR?
The VPU in MCIMX6S6AVM08ACR provides hardware-accelerated decode and encode for H.264 Baseline/Main/High Profile (BP/MP/HP), MPEG-4 ASP, and VC-1 AP. It supports 1080p30 decode/encode with sub-10 ms latency and zero CPU utilization, enabling simultaneous playback and recording in automotive infotainment systems.
Is MCIMX6S6AVM08ACR pin-compatible with other i.MX 6Solo variants like MCIMX6S4AVM08AC?
No, MCIMX6S6AVM08ACR is not pin-compatible with MCIMX6S4AVM08AC. While both share the same 21 mm × 21 mm MAPBGA-298 package, their ball assignments differ significantly due to feature-specific signal routing - notably, MCIMX6S6AVM08ACR includes MLB150 signals absent in MCIMX6S4AVM08AC, requiring unique PCB layout and power sequencing.
MCIMX6S6AVM08ACR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S6AVM08ACR FAQ
1.How can I place an order for MCIMX6S6AVM08ACR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S6AVM08ACR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S6AVM08ACR reliable?
The price and inventory of MCIMX6S6AVM08ACR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S6AVM08ACR is usually 5 days.
3.What payment methods are accepted for MCIMX6S6AVM08ACR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S6AVM08ACR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6S6AVM08ACR?
MCIMX6S6AVM08ACR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S6AVM08ACR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S6AVM08ACR?
For technical support, including MCIMX6S6AVM08ACR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S6AVM08ACR requirements.
6.How does Aetrix verify that MCIMX6S6AVM08ACR is sourced from the original manufacturer or authorized distributors?
All MCIMX6S6AVM08ACR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S6AVM08ACR meets industry standards.
7.What is the process for return or replacement of MCIMX6S6AVM08ACR?
All MCIMX6S6AVM08ACR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S6AVM08ACR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S6AVM08ACR part is unused and in its original packaging.
Return procedure for MCIMX6S6AVM08ACR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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