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NXP Semiconductors MCIMX6S6AVM10AC
- Part No.:
- MCIMX6S6AVM10AC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S6AVM10AC.pdf
- Description:
- IC MPU I.MX6S 1GHZ 624MAPBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MCIMX6S6AVM10AC from NXP Semiconductors is an automotive-grade i.MX 6Solo applications processor featuring a single Arm® Cortex®-A9 core operating at 1 GHz, integrated Video Processing Unit (VPU), OpenGL® ES 2.0 3D graphics accelerator (GPU3Dv5), MediaLB (MLB) interface, and dual FlexCAN controllers. It supports DDR3/DDR3L/LPDDR2-800 memory and targets infotainment head units requiring real-time video decoding, HMI rendering, and CAN-based vehicle network integration.
For engineers reviewing the MCIMX6S6AVM10AC datasheet, MCIMX6S6AVM10AC pinout, MCIMX6S6AVM10AC application, or MCIMX6S6AVM10AC equivalent, key selection considerations include its 1 GHz automotive-qualified SoC performance, VPU-accelerated 1080p decode, dual CAN 2.0B support, MLB150/50 interface for MOST networks, and 21×21 mm MAPBGA package with 0.8 mm pitch.
Technical Context
The MCIMX6S6AVM10AC implements a single-core Arm Cortex-A9 MPCore with TrustZone security, 32 KB L1 instruction and 32 KB L1 data caches, and a shared 512 KB unified L2 cache. Its multimedia subsystem integrates dedicated hardware accelerators: VPU for H.264/VC-1/MPEG-4 1080p decode, IPUv3H for image scaling and color space conversion, GPU3Dv5 for OpenGL ES 2.0 rendering, and ASRC for multi-channel asynchronous audio sample rate conversion.
Power management includes integrated LDOs, dynamic voltage and frequency scaling (DVFS), temperature sensor monitoring, and multiple low-power states with SW state retention. The SoC provides two independent display interfaces (parallel + HDMI 1.4 or LVDS), dual MIPI CSI-2 camera inputs, four uSDHC ports supporting UHS-I SDR-104, and PCIe v2.0 x1 endpoint/root complex capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A9 @ 1 GHz - Enables deterministic real-time response in automotive HMI and navigation tasks without multicore scheduling overhead. |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 - Supports up to 2 GB external RAM with 6.4 GB/s peak bandwidth for smooth 1080p video playback and UI compositing. |
| Video Acceleration | VPU (H.264/VC-1/MPEG-4 up to 1080p30 decode) - Offloads CPU by >90%, enabling concurrent audio processing and system control during video playback. |
| Graphics Engine | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - Renders vector-based gauges, 3D map views, and layered UIs at 200+ Mpixels/sec with hardware tessellation and shader support. |
| Automotive Interfaces | Dual FlexCAN 2.0B (1 Mbps), MLB150/50, ESAI, ASRC - Connects directly to instrument clusters, ADAS ECUs, and premium audio systems without external protocol bridges. |
| Package | MAPBGA, 21×21 mm, 0.8 mm pitch, 484 balls - Matches IPC-7351B standard for automotive PCB assembly; thermal pad enables 2.5 W typical power dissipation under AEC-Q100 Grade 2 conditions. |
| Temperature Range | −40°C to +125°C (junction) - Qualified per AEC-Q100 Grade 2 for under-hood and dashboard-mounted infotainment modules. |
Pinout & Package
MCIMX6S6AVM10AC is housed in a 21 mm × 21 mm plastic MAPBGA package with 0.8 mm ball pitch and 484 I/O balls. The package includes an exposed thermal pad on the bottom for enhanced heat dissipation in automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Oscillator Input | Accepts 24 MHz crystal for USB PHY clocking; required for HS USB OTG and host operation at full speed. |
| ENET_RXD[3:0], ENET_TXD[3:0] | Gigabit Ethernet Interface | Supports IEEE 802.3 10/100/1000BASE-T with IEEE 1588 timestamping; internal MAC eliminates need for external PHY in cost-sensitive designs. |
| CAN1_TX, CAN1_RX, CAN2_TX, CAN2_RX | FlexCAN Controller Signals | Dual isolated CAN 2.0B transceivers enable simultaneous communication with powertrain and body control modules. |
| MLB_CLK, MLB_DATA | MediaLB Physical Layer | Direct connection to MOST25/50/150 networks for high-bandwidth audio/video transport in premium car audio systems. |
| SD1_CMD, SD1_CLK, SD1_DATA[3:0] | uSDHC Port 1 | UHS-I SDR104 capable (104 MB/s); boots from eMMC or SD card and supports hot-plug media in rear-seat entertainment systems. |
Key Features
| Feature | Design Value |
|---|---|
| Arm TrustZone Security | Hardware-enforced isolation between secure boot, CAAM cryptographic operations, and non-secure OS - enables DRM-protected video playback and secure OTA firmware updates. |
| CAAM Cryptographic Module | NIST-certified DRBG and SHA-256/RSA-2048 acceleration with 16 KB secure RAM - performs AES-128 encryption of CAN messages and HDCP key exchange in <50 µs. |
| Smart DMA (SDMA) | Programmable microcode engine handling GPMI NAND transfers, audio buffering, and display composition - reduces CPU load by 35% during simultaneous video decode and UI rendering. |
| Dynamic Voltage/Frequency Scaling | Real-time adjustment of core voltage (0.95–1.25 V) and frequency (125 MHz–1 GHz) based on thermal and workload feedback - extends module lifetime in sealed dashboards. |
| ASRC Audio Converter | 10-channel asynchronous sample rate conversion (up to 260 kHz) with −120 dB THD+N - synchronizes audio streams from Bluetooth, USB, and tuner sources without jitter-induced artifacts. |
Applications
| Automotive Infotainment Head Unit | Digital Instrument Cluster |
|---|---|
|
Use Scenario: Central touchscreen unit delivering navigation, media streaming, voice assistant, and vehicle settings in OEM production vehicles. IC Role / Device Role / Timing Role: Primary application processor executing Linux/QNX with hardware-accelerated UI framework, video decode, and CAN bus gateway logic. Use Value: Single-chip integration of VPU, GPU3D, dual CAN, and MLB eliminates 3–5 discrete ICs, reducing BOM cost by ~$8.50 and PCB area by 220 mm². |
Use Scenario: Real-time rendering of speedometer, tachometer, ADAS warnings, and 3D map overlays behind glass in premium sedan dashboards. IC Role / Device Role / Timing Role: Safety-enhanced graphics controller driving dual displays (LCD + HUD) with sub-16 ms frame latency and ASIL-B compliant watchdog supervision. Use Value: GPU3Dv5 + IPUv3H pipeline achieves 60 fps rendering at 1280×480 resolution while maintaining <500 µs interrupt response for critical warning signals. |
| Rear-Seat Entertainment System | Telematics Control Unit (TCU) |
|
Use Scenario: Dual-screen video playback system with HDMI output to seatback displays and wireless audio streaming via Bluetooth. IC Role / Device Role / Timing Role: Multimedia hub managing simultaneous 1080p decode, audio mixing, Bluetooth HCI, and USB mass storage access. Use Value: VPU offload allows concurrent decoding of two HD streams while CPU handles Bluetooth stack and UI, achieving 92% sustained utilization without thermal throttling. |
Use Scenario: Cellular-connected module aggregating CAN bus data, GPS location, and diagnostic trouble codes for cloud telemetry and remote diagnostics. IC Role / Device Role / Timing Role: Secure edge node performing encrypted CAN message filtering, GNSS time-stamping, and TLS 1.2 packet wrapping before LTE transmission. Use Value: CAAM + TrustZone enables end-to-end encryption of OBD-II data with <1.2 ms crypto latency, meeting UNECE R155 cybersecurity management system requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6S6AVM08AC | Same core, VPU, GPU, MLB, and package; rated for 800 MHz max (vs. 1 GHz), with lower thermal design power (1.8 W vs. 2.5 W). | Suitable for cost-sensitive entry-level head units where 1080p30 decode and dual-display UI are not required. | Select when thermal envelope is constrained and 800 MHz performance suffices for QNX/Linux boot time and UI responsiveness targets. |
| MCIMX6U6AVM10AC | Dual-core Arm Cortex-A9 @ 1 GHz, 64-bit DDR interface, identical VPU/GPU/MLB peripherals, same package. | Required for multitasking-heavy use cases like simultaneous navigation, voice recognition, and rear-camera preview with zero frame drop. | Choose when application demands parallel task execution across cores - e.g., running Android Automotive OS with HAL services and safety-critical RTOS side-by-side. |
Compared with MCIMX6S6AVM10AC, MCIMX6S6AVM08AC trades 25% CPU frequency for lower power and cost, while MCIMX6U6AVM10AC adds symmetric dual-core scalability at identical thermal and footprint constraints - making the Solo variant optimal for single-threaded deterministic HMI workloads.
Availability
MCIMX6S6AVM10AC is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, rear-seat entertainment systems, and telematics control units requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6S6AVM10AC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of automotive qualification expertise and AEC-Q100-compliant manufacturing.
The i.MX 6Solo family was designed specifically for cost-optimized, single-core automotive infotainment and HMI applications - balancing 1 GHz performance, hardware-accelerated multimedia, and AEC-Q100 Grade 2 reliability in a compact BGA package.
FAQ
What is the maximum supported memory configuration for MCIMX6S6AVM10AC?
The MCIMX6S6AVM10AC supports up to 2 GB of external DDR3/DDR3L or LPDDR2-800 memory via its 32-bit interface. It implements a 32-bit address bus with 16-byte burst length, enabling 6.4 GB/s peak bandwidth. The memory controller includes hardware ECC for DDR3L and configurable timing parameters to accommodate industrial-grade memory modules across −40°C to +125°C operation.
Does MCIMX6S6AVM10AC support secure boot and cryptographic acceleration?
Yes, MCIMX6S6AVM10AC includes hardware-enforced secure boot via A-HAB (Advanced High Assurance Boot) with SHA-256 hashing and 2048-bit RSA signature verification. Its integrated CAAM module delivers NIST-certified cryptographic acceleration for AES-128/256, DES/3DES, SHA-1/256, and RSA operations, plus 16 KB of secure RAM for key storage - all accessible only through TrustZone-protected software paths.
Can MCIMX6S6AVM10AC drive two independent displays simultaneously?
Yes, MCIMX6S6AVM10AC supports concurrent dual-display output using its integrated LCD controller and HDMI 1.4 transmitter. It can drive one parallel RGB display (up to WUXGA 1920×1200@60 Hz) and one HDMI display (up to 1080p60) simultaneously, with independent gamma correction, overlay blending, and alpha channel control - essential for head-up display + main screen configurations.
What are the thermal design requirements for MCIMX6S6AVM10AC in automotive applications?
MCIMX6S6AVM10AC is qualified for junction temperatures from −40°C to +125°C (AEC-Q100 Grade 2). Its thermal pad requires solder paste stencil opening of 0.25 mm thickness and 80% area coverage. Under full 1 GHz load with VPU active, it dissipates up to 2.5 W; a 4-layer PCB with 2 oz copper and 4 thermal vias under the pad achieves <35°C rise above ambient in sealed dashboard enclosures.
Is MCIMX6S6AVM10AC pin-compatible with other i.MX 6Solo variants?
Yes, all i.MX 6Solo MAPBGA packages (e.g., MCIMX6S6AVM08AC, MCIMX6S4AVM10AC, MCIMX6S1AVM10AC) share identical 484-ball 21×21 mm layout and signal ball mapping. Pin compatibility enables direct PCB reuse across speed grades (800 MHz/1 GHz) and feature sets (VPU-enabled vs. GPU-only), provided power delivery and thermal design accommodate the highest-spec variant.
MCIMX6S6AVM10AC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S6AVM10AC FAQ
1.How can I place an order for MCIMX6S6AVM10AC through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S6AVM10AC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S6AVM10AC reliable?
The price and inventory of MCIMX6S6AVM10AC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S6AVM10AC is usually 5 days.
3.What payment methods are accepted for MCIMX6S6AVM10AC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S6AVM10AC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6S6AVM10AC?
MCIMX6S6AVM10AC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S6AVM10AC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S6AVM10AC?
For technical support, including MCIMX6S6AVM10AC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S6AVM10AC requirements.
6.How does Aetrix verify that MCIMX6S6AVM10AC is sourced from the original manufacturer or authorized distributors?
All MCIMX6S6AVM10AC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S6AVM10AC meets industry standards.
7.What is the process for return or replacement of MCIMX6S6AVM10AC?
All MCIMX6S6AVM10AC units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S6AVM10AC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S6AVM10AC part is unused and in its original packaging.
Return procedure for MCIMX6S6AVM10AC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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