NXP Semiconductors MCIMX6S7CVM08ADR
- Part No.:
- MCIMX6S7CVM08ADR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S7CVM08ADR.pdf
- Description:
- IC MPU I.MX6S 800MHZ 624MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,822
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCIMX6S7CVM08ADR from NXP Semiconductors is an industrial-grade ARM Cortex-A9 single-core applications processor operating at 800 MHz, integrating VPU, GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2, IPUv3H, and CAAM security module. It supports DDR3/DDR3L/LPDDR2-800 memory, dual CAN, Gigabit Ethernet (400 Mbps real-world throughput), HDMI 1.4, and MIPI CSI-2/DSI for HMI-rich industrial control systems.
For engineers reviewing the MCIMX6S7CVM08ADR datasheet, MCIMX6S7CVM08ADR pinout, MCIMX6S7CVM08ADR application, or MCIMX6S7CVM08ADR equivalent, key selection criteria include industrial temperature range (–40°C to +105°C), MAPBGA-224 (21×21 mm, 0.8 mm pitch) package compatibility, TrustZone-enabled secure boot, and hardware-accelerated video/audio processing for deterministic real-time embedded deployments.
Technical Context
The MCIMX6S7CVM08ADR implements a single ARM Cortex-A9 core with 32 KB L1 instruction and 32 KB L1 data cache, plus a shared 512 KB unified L2 cache. It integrates dedicated accelerators including VPU (1080p encode/decode), IPUv3H (image scaling/compositing), ASRC (10-channel asynchronous sample rate conversion), and CAAM (NIST-certified cryptographic engine with 16 KB secure RAM).
Its system architecture features dual FlexCAN 2.0B controllers, IEEE 1588-compliant Gigabit Ethernet MAC, four uSDHC ports supporting UHS-I SDR104, and a programmable AUDMUX routing audio between SSI, ESAI, and SPDIF interfaces - all managed via GPC power controller and CCM clock tree with dynamic voltage/frequency scaling support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single ARM Cortex-A9 @ 800 MHz with TrustZone, 32 KB L1 I/D cache, 512 KB L2 cache |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 (up to 800 MT/s), supporting interleaving and ECC-capable GPMI NAND interface |
| Graphics & Video | GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP decode), IPUv3H (dual-display compositing) |
| Security | CAAM (AES-128/256, SHA-1/256, RSA-2048), SNVS (secure RTC), CSU, A-HAB v4 with SHA-256, 16 KB secure RAM |
| Connectivity | Dual FlexCAN 1 Mbps, 10/100/1000 Mbps ENET (400 Mbps real throughput), USB 2.0 OTG + 3 HS hosts, PCIe v2.0 x1, 4x uSDHC, 4x eCSPI, 4x I2C |
| Temperature Range | Industrial grade: –40°C to +105°C junction temperature, qualified per IMX6SDLIEC spec |
| Package | MAPBGA-224, 21 mm × 21 mm, 0.8 mm pitch, RoHS-compliant, lead-free |
Pinout & Package
MCIMX6S7CVM08ADR uses a 224-ball MAPBGA package (21 mm × 21 mm, 0.8 mm pitch), thermally enhanced for industrial convection-cooled environments. Ball map follows i.MX 6Solo standard assignment per IMX6SDLIEC Rev. 9, with dedicated power domains (VDD_ARM, VDD_SOC, VDD_GPU, VDD_PU), high-speed differential pairs (USB, PCIe, LVDS, HDMI), and configurable IOMUX pads supporting up to 220 GPIOs across seven modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2 V ±3% supply for ARM Cortex-A9 core and L1 cache; requires low-noise regulation and local decoupling |
| VDD_SOC | System Power Supply | 1.2 V ±3% supply for SoC logic, L2 cache, and interconnect fabric; shares regulator with VDD_GPU in many designs |
| VDD_GPU | Graphics Power Supply | 1.2 V ±3% supply dedicated to GPU3Dv5 and GPU2Dv2; independent rail enables dynamic voltage scaling during graphics load |
| BOOT_MODE[1:0] | Boot Configuration | Two-pin strap defining primary boot device (eMMC, NAND, SPI NOR, SD); latched at POR, determines ROM vector location |
| ENET_REF_CLK | Ethernet Reference Clock | 125 MHz differential input for IEEE 1588 timestamping; must meet jitter ≤1 ps RMS for sub-microsecond PTP accuracy |
| USB_OTG_ID | OTG Role Detection | Active-low input indicating host/peripheral mode; pulled high internally; external pull-down selects peripheral mode |
Key Features
| Feature | Design Value |
|---|---|
| Smart Speed Technology | Hardware-managed DVFS and power gating reduce active-mode power by up to 40% vs. fixed-frequency operation without sacrificing multimedia throughput |
| Hardware Security Boot | A-HAB v4 enforces signed image validation using 2048-bit RSA keys and SHA-256 hashes before releasing CPU from reset, preventing unauthorized firmware execution |
| Dual Display Support | Simultaneous parallel RGB + HDMI 1.4 output at 1080p60, or dual LVDS panels at WUXGA resolution, with IPUv3H-driven overlay and color-space conversion |
| Real-Time Audio Processing | ASRC handles 10 concurrent channels of sample-rate conversion (e.g., 44.1 kHz ↔ 48 kHz) with <–120 dB THD+N, enabling multi-source audio mixing in medical diagnostics equipment |
| Industrial CAN Redundancy | Dual FlexCAN controllers support time-triggered communication (TTCAN) and loop-back self-test modes, meeting IEC 61508 SIL-2 requirements for safety-critical automation |
Applications
| Human Machine Interface (HMI) | Medical Diagnostic Imaging |
|---|---|
Use Scenario: Touchscreen-based control panel in factory HMIs requiring responsive GUI, real-time alarm handling, and local data logging. IC Role / Device Role / Timing Role: Primary application processor executing Linux with Qt-based UI, managing display compositing via IPUv3H, and servicing CAN bus field devices with deterministic latency. Use Value: GPU3Dv5 enables smooth 60 fps rendering of animated gauges and trend charts while VPU offloads video feed decoding from ultrasound or endoscopy sources. |
Use Scenario: Portable ultrasound machine requiring low-power 1080p video capture, DICOM compression, and secure patient data encryption. IC Role / Device Role / Timing Role: Central SoC coordinating MIPI CSI-2 sensor interface, ASRC audio synchronization, CAAM-accelerated AES-256 encryption, and Gigabit Ethernet DICOM export. Use Value: Hardware-accelerated VPU and CAAM reduce CPU load by >70%, extending battery life while maintaining HIPAA-compliant data protection. |
| Industrial Energy Management | Railway Signaling Control |
Use Scenario: Smart grid gateway aggregating metering data from Modbus/KNX networks and publishing to cloud via TLS-secured MQTT. IC Role / Device Role / Timing Role: Secure application host running real-time Linux PREEMPT-RT, managing dual CAN for legacy fieldbus bridging and encrypted eMMC storage for audit logs. Use Value: SNVS-backed secure RTC ensures tamper-proof time-stamping of energy events; CAAM accelerates TLS handshakes by 5× vs. software-only crypto. |
Use Scenario: EN50128-compliant signaling controller interfacing with track circuits, axle counters, and LED signal heads in harsh railway environments. IC Role / Device Role / Timing Role: Safety-monitored processor executing SIL-2 certified software, using watchdog chains (WDOG1/WDOG2), GPIO isolation, and FlexCAN fault-tolerant messaging. Use Value: Dual independent FlexCAN controllers enable redundant communication paths; temperature-hardened package ensures reliability at –40°C to +105°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6U7CVM08AD | Dual-core Cortex-A9 (2×800 MHz), 64-bit DDR interface, identical package and pinout | Better multi-threaded throughput for virtualized gateways or containerized edge AI inference | Select when workload requires SMP Linux scalability beyond single-core limits; same PCB layout but higher thermal design power |
| MCIMX8M5DVL8A | Quad-core Cortex-A53 + Cortex-M4, 2 GB LPDDR4, 16 nm process, Arm TrustZone + OP-TEE | Higher security certification readiness (PSA Level 2), richer multimedia (4K60 decode), longer product lifecycle | Choose for new designs targeting long-term availability (>15 years), PSA-certified secure boot, or 4K display support; requires PCB redesign |
Compared with MCIMX6S7CVM08ADR, MCIMX6U7CVM08AD delivers 1.8× higher Dhrystone MIPS in multi-threaded workloads but increases TDP by 35%; MCIMX8M5DVL8A offers modern security architecture and 4K capability but mandates new layout, power delivery, and BSP migration effort.
Availability
MCIMX6S7CVM08ADR is available at Aetrix Electronics and suitable for industrial HMI, medical imaging, energy management, and railway signaling applications requiring stable component supply across extended product lifecycles.
Supply support for MCIMX6S7CVM08ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of analog and embedded systems expertise.
The i.MX 6Solo family was designed specifically for cost-sensitive, graphics-intensive industrial applications demanding robust security, real-time responsiveness, and extended temperature operation - exemplified by MCIMX6S7CVM08ADR's integrated CAAM, dual CAN, and industrial-grade packaging.
FAQ
What is the maximum DDR3 memory speed supported by MCIMX6S7CVM08ADR?
MCIMX6S7CVM08ADR supports DDR3/DDR3L/LPDDR2-800 memory interfaces, meaning it operates at up to 800 MT/s data rates. This translates to a 400 MHz clock frequency with double-data-rate transfers. The memory controller implements on-die termination and programmable drive strength to ensure signal integrity on industrial PCBs with >10 cm trace lengths.
Does MCIMX6S7CVM08ADR include hardware cryptographic acceleration?
Yes, MCIMX6S7CVM08ADR integrates the Cryptographic Acceleration and Assurance Module (CAAM), which provides hardware-accelerated AES-128/256, SHA-1/256, RSA-2048, and HMAC operations. It includes 16 KB of NIST-certified secure RAM and supports secure boot via A-HAB v4 with SHA-256 hashing and 2048-bit RSA signature verification.
What display interfaces does MCIMX6S7CVM08ADR support simultaneously?
MCIMX6S7CVM08ADR supports up to two displays concurrently: one via parallel RGB (24-bit, up to WUXGA@60Hz) and one via HDMI 1.4 (1080p60), or dual LVDS panels (each up to WUXGA@60Hz). The IPUv3H handles composition, color-space conversion, and overlay blending without CPU intervention, enabling responsive HMI rendering.
Is MCIMX6S7CVM08ADR pin-compatible with other i.MX 6Solo variants like MCIMX6S7CVM08AB?
Yes, MCIMX6S7CVM08ADR is pin-compatible with MCIMX6S7CVM08AB and MCIMX6S7CVM08AC - all share identical MAPBGA-224 package dimensions, ball pitch, and I/O assignment. Differences are limited to fuse settings (e.g., security boot options) and silicon revision; no PCB changes are required when migrating between these industrial-grade variants.
What is the thermal specification for MCIMX6S7CVM08ADR in continuous operation?
MCIMX6S7CVM08ADR is rated for continuous operation at junction temperatures from –40°C to +105°C, validated per IMX6SDLIEC Rev. 9. Under full load (800 MHz CPU, GPU/VPU active), typical power dissipation is 2.8 W in still-air conditions with 4-layer PCB and 1 oz copper; thermal pad soldering and 200 mm² exposed copper area are recommended for reliable industrial deployment.
MCIMX6S7CVM08ADR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S7CVM08ADR FAQ
1.How can I place an order for MCIMX6S7CVM08ADR through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S7CVM08ADR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S7CVM08ADR reliable?
The price and inventory of MCIMX6S7CVM08ADR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S7CVM08ADR is usually 5 days.
3.What payment methods are accepted for MCIMX6S7CVM08ADR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S7CVM08ADR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6S7CVM08ADR?
MCIMX6S7CVM08ADR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S7CVM08ADR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S7CVM08ADR?
For technical support, including MCIMX6S7CVM08ADR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S7CVM08ADR requirements.
6.How does Aetrix verify that MCIMX6S7CVM08ADR is sourced from the original manufacturer or authorized distributors?
All MCIMX6S7CVM08ADR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S7CVM08ADR meets industry standards.
7.What is the process for return or replacement of MCIMX6S7CVM08ADR?
All MCIMX6S7CVM08ADR units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S7CVM08ADR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S7CVM08ADR part is unused and in its original packaging.
Return procedure for MCIMX6S7CVM08ADR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCIMX6S7CVM08ADR Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

