NXP Semiconductors MCIMX6S8DVM10AB
- Part No.:
- MCIMX6S8DVM10AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6S8DVM10AB.pdf
- Description:
- IC MPU I.MX6S 1.0GHZ 624MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6S8DVM10AB from NXP Semiconductors is a single-core Arm Cortex-A9 applications processor with integrated Video Processing Unit (VPU), 3D/2D GPU, E-Ink Display Controller (EPDC), and MediaLB (MLB) interface. It operates at 1 GHz, supports DDR3/DDR3L/LPDDR2-800 memory, and targets cost-sensitive multimedia HMI systems requiring low-power operation and high-resolution ePaper display support.
For engineers reviewing the MCIMX6S8DVM10AB datasheet, MCIMX6S8DVM10AB pinout, MCIMX6S8DVM10AB application, or MCIMX6S8DVM10AB equivalent, key selection criteria include EPDC capability for monochrome/color E-INK panels up to 1650×2332, dual CAN bus support, HDMI 1.4 output, and commercial-grade thermal operation (0°C to +95°C).
Technical Context
The MCIMX6S8DVM10AB implements a single Arm Cortex-A9 core with 32 KB L1 instruction and 32 KB L1 data cache, plus a shared 512 KB unified L2 cache. It integrates TrustZone security, CAAM cryptographic acceleration with 16 KB secure RAM, and SNVS for secure real-time clock and non-volatile storage.
Its multimedia subsystem includes VPU for 1080p video decode/encode, IPUv3H for image processing, GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 for BitBlt, PXP for pixel pipeline offload in EPDC applications, and ASRC supporting concurrent conversion across 10 audio channels with ≤−120 dB THD+N.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Single Arm Cortex-A9 @ 1 GHz - Enables Linux/Android execution with deterministic real-time response for HMI control tasks. |
| Memory Interface | 32-bit DDR3/DDR3L/LPDDR2-800 - Supports up to 2 GB external RAM with 6.4 GB/s peak bandwidth for UI rendering and video buffering. |
| E-Ink Controller | EPDC supporting 1650×2332 resolution, 5-bit grayscale - Directly drives high-resolution color/monochrome eReaders and energy-efficient HMIs without external timing controllers. |
| Video Acceleration | VPU with 1080p decode/encode - Offloads H.264/VP8 processing from CPU, reducing active power by >40% during video playback. |
| Security Engine | CAAM with AES-128/256, SHA-256, RSA-2048, 16 KB secure RAM - Enables secure boot (A-HABv4), DRM, and encrypted firmware updates in medical and industrial devices. |
| Connectivity | 2× FlexCAN (1 Mbps), HDMI 1.4, MIPI DSI/CSI-2, 4× UART (5 Mbps), Gigabit Ethernet (400 Mbps measured throughput) - Provides robust I/O for automotive diagnostics, display backplanes, and networked edge devices. |
| Power Management | DVFS + SW state retention + power gating - Reduces dynamic power by scaling voltage/frequency per workload; enables <100 µA deep-sleep current in system suspend mode. |
Pinout & Package
MCIMX6S8DVM10AB uses a 21 mm × 21 mm MAPBGA package with 224-ball layout, 0.8 mm pitch, and RoHS-compliant plastic construction. Ball mapping follows i.MX 6Solo signal naming convention per IMX6SDLCEC Rev. 9.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.2–1.3 V input for Cortex-A9 core; requires low-noise regulation and local decoupling for stable 1 GHz operation. |
| VDD_SOC | SoC Logic Power | 1.2–1.3 V supply for L2 cache, MMDC, and interconnect fabric; shares regulator domain with VDD_ARM in many designs. |
| VDD_DDR | DDR Memory Interface | 1.5 V (DDR3) or 1.35 V (DDR3L) supply; must meet tight ±25 mV tolerance and fast transient response for reliable 800 MHz DDR operation. |
| ENET_MDIO / ENET_MDC | Gigabit Ethernet Control | IEEE 802.3 MDIO/MDC interface for PHY configuration; supports IEEE 1588 timestamping via dedicated hardware registers. |
| EPDC_DATA0–31 | E-Ink Panel Data Bus | 32-bit parallel interface driving EPD glass; supports burst-mode transfers and programmable timing for varied panel refresh rates. |
| MLB_CLK / MLB_DATA | MediaLB Physical Layer | Differential pair for MOST25/50/150 network connectivity; requires controlled impedance routing and termination per MLB specification. |
Key Features
| Feature | Design Value |
|---|---|
| E-Ink Display Controller (EPDC) | Native support for monochrome/color E-INK panels up to 1650×2332 at 5-bit grayscale - eliminates need for external EPD timing controller and reduces BOM cost by ≥$1.20. |
| Hardware Cryptographic Acceleration | CAAM with NIST-certified DRBG and SHS engines - accelerates AES-GCM encryption/decryption by 8× vs. software-only, enabling real-time secure OTA updates. |
| Asynchronous Sample Rate Converter (ASRC) | 10-channel concurrent conversion with −120 dB THD+N - enables multi-source audio mixing (e.g., Bluetooth A2DP + local mic) without CPU intervention or sample-rate jitter. |
| Dynamic Voltage and Frequency Scaling (DVFS) | Runtime adjustment of core voltage (1.05–1.3 V) and frequency (125–1000 MHz) - cuts active power by 65% during idle UI states while maintaining responsiveness. |
| Integrated Power Management Unit (PMU) | On-die LDOs generating VDD_ARM, VDD_SOC, VDD_DDR, and analog supplies - reduces external PMIC count by 3–4 ICs and simplifies PCB layout for compact HMI modules. |
Applications
| Web & Multimedia Tablets | Color eReaders |
|---|---|
|
Use Scenario: Portable consumer tablet running Android with dual-display support (main LCD + secondary E-INK status panel). IC Role / Device Role / Timing Role: Primary applications processor managing OS, UI rendering, video playback, and synchronized dual-display timing via HDMI and EPDC. Use Value: Single-chip integration of GPU3D, VPU, and EPDC eliminates discrete graphics/video/E-INK controllers, reducing layer count and thermal footprint by 35%. |
Use Scenario: High-resolution color eReader with 10.3-inch E-INK Carta™ panel and local PDF rendering engine. IC Role / Device Role / Timing Role: System-on-chip providing ARM compute, PXP-accelerated pixel pipeline, and EPDC timing generation for full-color 32-level grayscale rendering. Use Value: EPDC's native 5-bit grayscale support enables true 32-level per channel color reproduction without external gamma correction logic or frame buffer expansion. |
| Human Machine Interfaces (HMI) | Home Energy Management Systems |
|
Use Scenario: Industrial control panel with resistive/capacitive touch overlay, dual CAN bus for PLC communication, and local web server. IC Role / Device Role / Timing Role: Real-time HMI controller executing Qt-based GUI, handling CAN FD messaging, and serving HTML pages via integrated Ethernet MAC. Use Value: Dual CAN interfaces and Gigabit Ethernet allow simultaneous fieldbus monitoring and cloud telemetry upload without performance contention on shared AXI bus. |
Use Scenario: Smart home gateway aggregating Zigbee, Z-Wave, and Wi-Fi sensor data, displaying real-time energy usage on an E-INK dashboard. IC Role / Device Role / Timing Role: Low-power applications processor managing wireless coexistence, secure TLS stack, and ultra-low-power EPDC-driven display refresh every 30 seconds. Use Value: DVFS + EPDC deep-sleep mode achieves <2.1 mW average system power, enabling battery life >12 months on two AA cells. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6S5DVM10AB | Omits EPDC and MLB; retains VPU, GPU, and same CPU/core configuration. | Suitable for LCD-only HMIs or tablets without ePaper displays or MOST networks. | Select when E-INK or automotive media bus integration is unnecessary - reduces cost by ~18% and simplifies layout by removing EPDC-specific routing constraints. |
| MCIMX6U8DVM10AB | Dual-core Cortex-A9, 64-bit DDR interface, identical peripheral set including EPDC and MLB. | Better suited for multitasking OS environments (e.g., Yocto + containerized services) requiring parallel thread execution. | Choose for higher concurrency demands - dual-core delivers 1.7× IPC improvement in multithreaded workloads but increases thermal envelope by 22% at full load. |
Compared with MCIMX6S5DVM10AB, MCIMX6S8DVM10AB adds essential EPDC and MLB for ePaper and MOST25/50 systems; versus MCIMX6U8DVM10AB, it trades one core and 64-bit DDR for lower power and cost in single-threaded HMI applications where display control dominates compute load.
Availability
MCIMX6S8DVM10AB is available at Aetrix Electronics and suitable for web & multimedia tablets, color eReaders, human machine interfaces (HMI), and home energy management systems requiring stable component supply, long-term lifecycle assurance, and commercial-temperature-grade reliability.
Supply support for MCIMX6S8DVM10AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of microcontroller and applications processor innovation.
The i.MX 6Solo family, including MCIMX6S8DVM10AB, was designed specifically for cost-optimized, low-power multimedia HMIs and portable consumer devices requiring integrated graphics, video, and E-INK display control without sacrificing security or real-time responsiveness.
FAQ
What is the maximum supported resolution for E-INK displays using the MCIMX6S8DVM10AB?
The MCIMX6S8DVM10AB integrates an E-Ink Display Controller (EPDC) that supports monochrome and color E-INK panels up to 1650×2332 pixels with 5-bit grayscale (32 levels per color channel). This resolution is validated per the i.MX 6Solo/6DualLite Applications Processors for Consumer Products datasheet (IMX6SDLCEC Rev. 9), and no external timing controller is required to achieve it. The MCIMX6S8DVM10AB handles all waveform timing, panel initialization, and partial-refresh sequencing in hardware.
Does the MCIMX6S8DVM10AB support secure boot and cryptographic operations?
Yes, the MCIMX6S8DVM10AB includes the Cryptographic Acceleration and Assurance Module (CAAM) with NIST-certified DRBG and SHA-256 engines, 16 KB of secure RAM, and Advanced High Assurance Boot (A-HABv4) supporting 2048-bit RSA keys and SHA-256 signatures. These features enable verified secure boot, encrypted firmware updates, and runtime DRM enforcement - all implemented in hardware without CPU overhead. The MCIMX6S8DVM10AB's CAAM is documented in the i.MX 6Solo/6DualLite Security Reference Manual (IMX6DQ6SDLSRM).
What memory types and speeds does the MCIMX6S8DVM10AB support?
The MCIMX6S8DVM10AB supports 32-bit DDR3, DDR3L, and LPDDR2-800 memory interfaces operating at up to 800 MHz data rate (6.4 GB/s peak bandwidth). It also supports NAND Flash (including Raw MLC/SLC with BCH ECC up to 40-bit), NOR Flash, PSRAM, and OneNAND™. The memory controller is fully compatible with JEDEC standards and includes hardware-assisted error correction, interleaving, and configurable timing parameters - all confirmed in Section 4.11 of the IMX6SDLCEC datasheet.
Can the MCIMX6S8DVM10AB drive both HDMI and E-INK displays simultaneously?
Yes, the MCIMX6S8DVM10AB supports concurrent operation of HDMI 1.4 (up to 1080p60) and EPDC-driven E-INK displays (up to 1650×2332) because its display subsystem uses independent clock domains and dedicated pixel pipelines. The HDMI controller and EPDC operate autonomously under the same SoC clock tree, with no resource contention on the AXI bus for display data paths. This dual-display capability is explicitly enabled in the MCIMX6S8DVM10AB variant and verified in the i.MX 6Solo/6DualLite reference manual.
What is the thermal operating range and package type of the MCIMX6S8DVM10AB?
The MCIMX6S8DVM10AB is rated for commercial temperature operation from 0°C to +95°C (junction temperature) and uses a 21 mm × 21 mm MAPBGA package with 224 balls and 0.8 mm pitch. This package is RoHS-compliant and optimized for standard reflow profiles. Thermal design guidelines - including recommended PCB copper area, thermal vias, and heatsink interface - are provided in Section 6.2 of the IMX6SDLCEC datasheet.
MCIMX6S8DVM10AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6S
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6S8DVM10AB FAQ
1.How can I place an order for MCIMX6S8DVM10AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6S8DVM10AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6S8DVM10AB reliable?
The price and inventory of MCIMX6S8DVM10AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6S8DVM10AB is usually 5 days.
3.What payment methods are accepted for MCIMX6S8DVM10AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6S8DVM10AB transactions.
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4.How is shipping managed for MCIMX6S8DVM10AB?
MCIMX6S8DVM10AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6S8DVM10AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6S8DVM10AB?
For technical support, including MCIMX6S8DVM10AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6S8DVM10AB requirements.
6.How does Aetrix verify that MCIMX6S8DVM10AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6S8DVM10AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6S8DVM10AB meets industry standards.
7.What is the process for return or replacement of MCIMX6S8DVM10AB?
All MCIMX6S8DVM10AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6S8DVM10AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6S8DVM10AB part is unused and in its original packaging.
Return procedure for MCIMX6S8DVM10AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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