NXP Semiconductors MCIMX6U5EVM10AB
- Part No.:
- MCIMX6U5EVM10AB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 624-LFBGA
- Datasheet:
-
MCIMX6U5EVM10AB.pdf
- Description:
- IC MPU I.MX6DL 1.0GHZ 624MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCIMX6U5EVM10AB from NXP Semiconductors is a dual-core Arm Cortex-A9 applications processor operating at 1 GHz, featuring integrated VPU, GPU, and MediaLB (MLB) interfaces but excluding the E-INK Display Controller (EPDC). It supports DDR3/DDR3L/LPDDR2-800 memory, Gigabit Ethernet, dual CAN, HDMI 1.4, MIPI CSI-2/DSI, and USB 2.0 OTG + three HS hosts - deployed in industrial HMI, portable medical devices, and IP phones requiring extended temperature operation.
For engineers reviewing the MCIMX6U5EVM10AB datasheet, MCIMX6U5EVM10AB pinout, MCIMX6U5EVM10AB application, or MCIMX6U5EVM10AB equivalent, key selection criteria include extended commercial temperature range (–20°C to +105°C), dual-core DVFS support, MLB interface for MOST networks, absence of EPDC, and MAPBGA 21×21 mm 0.8 mm pitch packaging.
Technical Context
The MCIMX6U5EVM10AB implements a symmetric dual-core Arm Cortex-A9 MPCore with 32 KB L1 instruction and data caches per core, shared 512 KB L2 cache, TrustZone security, and NEON MPE co-processor. Its memory subsystem supports 16/32/64-bit DDR3-800, DDR3L-800, and LPDDR2-800 with interleaving mode enabled.
It integrates dedicated hardware accelerators including VPU (H.264/MPEG-4 decode/encode), GPU3Dv5 (OpenGL ES 2.0), GPU2Dv2 (BitBlt), IPUv3H (image processing), ASRC (asynchronous sample rate conversion), and CAAM (cryptographic acceleration with NIST-certified PRNG and 16 KB secure RAM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm Cortex-A9 @ 1 GHz - enables concurrent real-time OS tasks and multimedia workloads with TrustZone isolation. |
| Memory Interface | 16/32/64-bit DDR3/DDR3L/LPDDR2-800 - supports high-bandwidth external memory with interleaving for improved throughput in dual-channel configurations. |
| Graphics Acceleration | GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - delivers hardware-accelerated UI rendering and 2D compositing without CPU load. |
| Video Processing | VPU supporting H.264, MPEG-4, VC-1 decode/encode - offloads 1080p video processing from CPU, reducing power and latency. |
| Connectivity | 2× FlexCAN (1 Mbps), 1× PCIe v2.0 x1, 1× HDMI 1.4, 2× MIPI CSI-2/DSI lanes - enables automotive-grade communication and high-resolution display/camera integration. |
| Security | CAAM with AES/SHA/RSA engines + 16 KB secure RAM + A-HAB v4 boot - provides certified cryptographic acceleration and secure boot chain for DRM and firmware integrity. |
| Temperature Range | Extended commercial: –20°C to +105°C - qualified for use in fanless industrial enclosures and outdoor-connected devices. |
| Package | MAPBGA, 21 mm × 21 mm, 0.8 mm pitch, 484-ball - compatible with standard BGA reflow profiles and automated optical inspection. |
Pinout & Package
MCIMX6U5EVM10AB uses a 484-ball MAPBGA package (21 mm × 21 mm, 0.8 mm pitch), designated as Case 2240 per NXP documentation. Pin assignments follow the i.MX 6DualLite signal naming convention defined in IMX6SDLCEC Rev. 9, with ball map detailed in Section 6.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core voltage supply | 1.2 V ±3% input for Arm Cortex-A9 cores - requires low-noise regulation and local decoupling for stable 1 GHz operation. |
| VDD_SOC | SoC logic voltage | 1.2 V ±3% supply for L2 cache, CCM, GPC, and interconnect - shares regulator domain with VDD_ARM in many reference designs. |
| VDD_DDR | DDR interface voltage | 1.5 V (DDR3), 1.35 V (DDR3L), or 1.2 V (LPDDR2) - must be sequenced after VDD_SOC and before VDD_ARM during power-up. |
| CLKIN | Primary clock input | 24 MHz crystal oscillator input - mandatory for USB PHY operation and system clock derivation via internal PLLs. |
| BOOT_MODE[1:0] | Boot configuration | Strapped pins determining boot source (eMMC, NAND, SPI NOR, SD) - sampled at reset and latched for ROM bootloader initialization. |
| MLB_CLK / MLB_DATA | MediaLB physical layer | Differential pair supporting MOST25/50/150 networks - enables time-triggered audio/video transport with DTCP cipher acceleration. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core DVFS | Independent voltage/frequency scaling per core - reduces dynamic power by up to 40% during asymmetric workloads (e.g., background audio decode + foreground UI). |
| MLB interface with DTCP | Hardware-accelerated Digital Transmission Content Protection over MOST150 - enables secure in-vehicle infotainment streaming without software overhead. |
| ASRC with 10-channel concurrency | Asynchronous sample rate conversion up to 192 kHz stereo - eliminates jitter and clock domain mismatches between audio codecs and system clocks. |
| CAAM with NIST-certified PRNG | Cryptographic acceleration for AES-128/256, SHA-256, RSA-2048 - meets FIPS 140-2 Level 1 requirements for secure boot and encrypted storage. |
| Smart DMA (SDMA) | Programmable controller managing 32 channels across peripherals - offloads memory-mapped transfers (e.g., camera frame capture → DDR → VPU) without CPU intervention. |
| Gigabit Ethernet with IEEE 1588 | Hardware timestamping and PTP support - enables sub-microsecond time synchronization for industrial control and audio/video network timing. |
Applications
| Industrial HMI | Portable Medical Device |
|---|---|
Use Scenario: Fanless panel PC in factory automation with touch interface, real-time sensor monitoring, and local data logging. IC Role / Device Role / Timing Role: Main applications processor executing Linux-based HMI stack, driving dual LVDS displays, and managing CAN bus communication with PLCs. Use Value: Dual-core 1 GHz performance ensures responsive UI under concurrent video playback and CAN message handling; extended temperature rating (-20°C to +105°C) guarantees reliability in unconditioned enclosures. | Use Scenario: Battery-powered ultrasound imaging handheld with color display, Wi-Fi upload, and secure patient data encryption. IC Role / Device Role / Timing Role: Central SoC coordinating image acquisition (via MIPI CSI-2), GPU-accelerated rendering, VPU-based DICOM compression, and CAAM-secured data export. Use Value: Integrated VPU and GPU eliminate need for discrete video/compute chips; CAAM's NIST-certified crypto engine satisfies HIPAA-compliant data-at-rest encryption requirements. |
| IP Phone with Video | Home Energy Gateway |
Use Scenario: VoIP endpoint with HD video calling, Bluetooth headset pairing, and SIP signaling over Ethernet. IC Role / Device Role / Timing Role: Applications processor running Android-based telephony stack, managing HDMI output, USB audio, dual Fast UARTs for modem control, and Gigabit Ethernet MAC. Use Value: Hardware ASRC synchronizes microphone input and speaker output across independent clock domains; dual CAN ports unused but available for future building management integration. | Use Scenario: Smart home hub aggregating Zigbee, Z-Wave, and Wi-Fi sensor data, displaying energy usage on e-ink display, and uploading to cloud via LTE. IC Role / Device Role / Timing Role: System controller interfacing with multiple wireless co-processors via UART/I2C, managing secure OTA updates, and hosting web UI on local display. Use Value: Extended temperature range ensures stable operation in attic-mounted installations; MLB interface remains unused but preserves design flexibility for future MOST-based smart meter integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCIMX6U5DVM10AB | Identical silicon, commercial temperature grade (0°C to +95°C) instead of extended commercial (–20°C to +105°C). | Suitable for indoor consumer electronics only; not rated for industrial ambient extremes. | Select when cost sensitivity outweighs environmental ruggedness and thermal derating is acceptable. |
| MCIMX6U5EVM10AC | Same package, speed, and feature set; differs only in silicon revision (Rev 1.3 vs Rev 1.2) and minor maskset-level optimizations. | No functional or qualification difference; identical extended temperature rating and pin compatibility. | Prefer for new designs requiring latest maskset stability and errata coverage per IMX6SDLCE document. |
Compared with MCIMX6U5DVM10AB, the MCIMX6U5EVM10AB enables deployment in wider thermal environments without derating, while MCIMX6U5EVM10AC offers marginal silicon maturity improvements - both alternatives retain full software and hardware compatibility, making them drop-in replacements where temperature or revision alignment is the sole differentiator.
Availability
MCIMX6U5EVM10AB is available at Aetrix Electronics and suitable for industrial HMI, portable medical devices, and IP phones requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCIMX6U5EVM10AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with headquarters in Eindhoven, Netherlands.
The i.MX 6Solo/6DualLite product line was designed specifically for cost-sensitive, power-efficient consumer and industrial applications requiring rich multimedia, robust connectivity, and hardware-enforced security - targeting tablets, HMIs, medical devices, and smart home gateways.
FAQ
What is the maximum operating temperature for MCIMX6U5EVM10AB?
The MCIMX6U5EVM10AB is qualified for extended commercial operation from –20°C to +105°C junction temperature. This rating allows reliable use in sealed industrial enclosures without active cooling, unlike the commercial-grade MCIMX6U5DVM10AB (0°C to +95°C). Thermal design must maintain die temperature within this range under worst-case power dissipation, verified using the on-die temperature sensor and SNVS-SRTC.
Does MCIMX6U5EVM10AB include an E-INK display controller (EPDC)?
No, MCIMX6U5EVM10AB does not include the EPDC module. Per Table 1 in IMX6SDLCEC Rev. 9, the "U5" suffix indicates VPU, GPU, and MLB support but explicitly excludes EPDC - unlike "U8" variants (e.g., MCIMX6U8DVM10AB) which integrate EPDC for E-INK color/monochrome panels up to 1650×2332 resolution.
Which memory types are supported by MCIMX6U5EVM10AB?
The MCIMX6U5EVM10AB supports 16/32/64-bit DDR3-800, DDR3L-800, and LPDDR2-800 memory with interleaving mode enabled for dual-channel configurations. It also supports NAND Flash (SLC/MLC, BCH ECC up to 40-bit), NOR Flash, PSRAM, and eMMC 4.41 - all managed through the MMDC and GPMI controllers with configurable timing parameters.
Is MCIMX6U5EVM10AB pin-compatible with other i.MX 6DualLite packages?
Yes, MCIMX6U5EVM10AB uses the same 484-ball MAPBGA 21×21 mm 0.8 mm pitch package (Case 2240) as all i.MX 6DualLite variants listed in IMX6SDLCEC Rev. 9, including MCIMX6U5DVM10AB and MCIMX6U5EVM10AC. Ball mapping, power sequencing, and signal definitions are identical across these parts, enabling PCB reuse across temperature grades and silicon revisions.
What security features are implemented in MCIMX6U5EVM10AB?
The MCIMX6U5EVM10AB integrates CAAM (Cryptographic Acceleration and Assurance Module) with AES-128/256, SHA-256, RSA-2048, and NIST-certified PRNG; A-HAB v4 secure boot with SHA-256 and 2048-bit RSA keys; TrustZone-enabled memory isolation; and SNVS with secure RTC. These features enable secure firmware updates, encrypted storage, and DRM-compliant content playback - all verified in the i.MX 6Solo/6DualLite Security Reference Manual (IMX6DQ6SDLSRM).
MCIMX6U5EVM10AB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 624-LFBGA
- Series:
- i.MX6DL
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A9
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 1.0GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR2, LVDDR3, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- Keypad, LCD
- Ethernet:
- 10/100/1000Mbps (1)
- SATA:
- -
- USB:
- USB 2.0 + PHY (4)
- Voltage - I/O:
- 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature:
- -20°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 624-MAPBGA (21x21)
- Additional Interfaces:
- CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
MCIMX6U5EVM10AB FAQ
1.How can I place an order for MCIMX6U5EVM10AB through Aetrix?
Please submit a Request for Quotation (RFQ) for MCIMX6U5EVM10AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCIMX6U5EVM10AB reliable?
The price and inventory of MCIMX6U5EVM10AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6U5EVM10AB is usually 5 days.
3.What payment methods are accepted for MCIMX6U5EVM10AB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6U5EVM10AB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCIMX6U5EVM10AB?
MCIMX6U5EVM10AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCIMX6U5EVM10AB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCIMX6U5EVM10AB?
For technical support, including MCIMX6U5EVM10AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6U5EVM10AB requirements.
6.How does Aetrix verify that MCIMX6U5EVM10AB is sourced from the original manufacturer or authorized distributors?
All MCIMX6U5EVM10AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6U5EVM10AB meets industry standards.
7.What is the process for return or replacement of MCIMX6U5EVM10AB?
All MCIMX6U5EVM10AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6U5EVM10AB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCIMX6U5EVM10AB part is unused and in its original packaging.
Return procedure for MCIMX6U5EVM10AB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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