Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Embedded > Microprocessors

NXP Semiconductors MCIMX6U6AVM08AB

Name: MCIMX6U6AVM08AB
Brand: NXP Semiconductors
SKU: MCIMX6U6AVM08AB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: MCIMX6U6AVM08AB

Manufacturer:: NXP Semiconductors

Category:: Microprocessors

Package:: 624-LFBGA

Datasheet:: MCIMX6U6AVM08AB.pdf

Description:: IC MPU I.MX6DL 800MHZ 624MAPBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,846

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

MCIMX6U6AVM08AB from NXP Semiconductors is an automotive-grade i.MX 6DualLite applications processor featuring dual Arm® Cortex®-A9 cores (64-bit DDR), 800 MHz operation, integrated VPU, GPU, and MLB interface, housed in a 21 mm × 21 mm MAPBGA package with 0.8 mm pitch - deployed in infotainment head units, digital instrument clusters, and telematics gateways requiring real-time multimedia processing and CAN-based vehicle networking.

For engineers reviewing the MCIMX6U6AVM08AB datasheet, MCIMX6U6AVM08AB pinout, MCIMX6U6AVM08AB application, or MCIMX6U6AVM08AB equivalent, key selection criteria include dual-core A9 performance at automotive temperature range (−40°C to +125°C), hardware-accelerated video decode/encode (VPU), OpenGL ES 2.0 3D graphics (GPU3Dv5), dual FlexCAN 1 Mbps interfaces, and MLB150/50 support for MOST network integration.

Technical Context

The MCIMX6U6AVM08AB implements a symmetric dual-core Arm Cortex-A9 MPCore platform with 512 KB shared L2 cache, TrustZone security, and NEON MPE co-processor - enabling concurrent high-throughput tasks such as HDMI 1.4 video rendering, multi-channel audio processing via ESAI/ASRC, and real-time CAN bus communication. Its memory subsystem supports 64-bit DDR3/DDR3L/LPDDR2-800 with interleaving mode.

Architecturally, it integrates dedicated accelerators including VPU (H.264 BP/MP/HP, MPEG-4 ASP, VC-1 AP), IPUv3H for image scaling/compositing, GPU3Dv5 (OpenGL ES 2.0) and GPU2Dv2 (BitBlt), plus CAAM for cryptographic acceleration (AES-128/256, SHA-256, RSA-2048) and SNVS for secure RTC and non-volatile storage - all coordinated by a centralized GPC power controller and CCM clock management unit.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Dual Arm Cortex-A9 MPCore, 64-bit DDR, 800 MHz - delivers deterministic real-time response for HMI and cluster rendering under ASIL-B–aligned system design.
Temperature Grade	Automotive: −40°C to +125°C junction - qualified per AEC-Q100 Grade 2, enabling deployment in engine bay–adjacent modules and dashboard ECUs.
Video Acceleration	VPU supporting 1080p60 decode (H.264/MPEG-4/VC-1) and encode (H.264 BP/MP) - offloads CPU for seamless video-in-video-out routing in rear-seat entertainment systems.
Graphics Engine	GPU3Dv5 (OpenGL ES 2.0) + GPU2Dv2 - enables smooth 3D navigation UIs and 2D layer compositing across dual displays (HDMI + LVDS or MIPI DSI).
Automotive Interfaces	Dual FlexCAN 1 Mbps + MLB150/50 - provides native connectivity to CAN FD–capable gateways and MOST25/50/150 audio networks without external bridge ICs.
Security Hardware	CAAM (AES/SHA/RSA), SNVS, CSU, A-HABv4 boot - enables secure boot with SHA-256 signature verification, encrypted firmware updates, and DRM-compliant media playback.
Memory Interface	64-bit DDR3/DDR3L/LPDDR2-800 with interleaving - sustains >3.2 GB/s bandwidth for simultaneous 1080p video decode, 3D rendering, and OS execution.

Pinout & Package

MCIMX6U6AVM08AB is packaged in a 224-ball MAPBGA (21 mm × 21 mm, 0.8 mm pitch), compliant with JEDEC MO-271AB. Ball map includes dedicated power domains (VDD_ARM, VDD_SOC, VDD_GPU), high-speed differential pairs (HDMI TMDS, LVDS, PCIe), and automotive-critical signal groups (CAN_H/L, MLB_CLK/DATA, ESAI).

Pin/Terminal	Circuit Role	Design Meaning
B12, B13	FlexCAN1_TX / FlexCAN1_RX	Differential CAN bus interface compliant with ISO 11898-2 - supports 1 Mbps arbitration and error handling per AUTOSAR stack requirements.
E1, E2	MLB_CLK / MLB_DATA	MediaLB physical layer interface for MOST25/50/150 networks - enables time-synchronized audio streaming and control messaging without external transceiver.
J1, J2, K1, K2	HDMI_D0+/−, D1+/−	TMDS differential pairs for HDMI 1.4 output - supports 1080p60 RGB/YUV444 with HDCP 1.4 content protection enabled via CAAM key provisioning.
R1, R2, T1, T2	LVDS_CLK+/−, DATA0+/−	LVDS serial pixel interface - drives WUXGA (1920×1200) displays at 60 Hz with embedded sync, reducing EMI vs parallel RGB.
U10, U11	PCIe_REFCLK+/−	Differential 100 MHz reference clock input - enables Gen2 x1 PCIe endpoint operation for cellular modems or Wi-Fi/BT combo chips.

Key Features

Feature	Design Value
Dual-core Cortex-A9 with 512 KB L2 cache	Enables asymmetric task partitioning - e.g., one core for AUTOSAR Classic OS (CAN gateway logic), second for Android Automotive (HMI rendering) - with cache coherency maintained by SCU.
VPU + IPUv3H hardware acceleration	Reduces CPU load to <5% during 1080p60 decode + deinterlacing + color space conversion - freeing cores for speech recognition and navigation path planning.
CAAM cryptographic engine	Accelerates AES-128-GCM encryption at >100 MB/s and RSA-2048 signing in <5 ms - meets UNECE R155 CSMS requirements for secure OTA update integrity.
ASRC with 10-channel concurrency	Supports simultaneous sample rate conversion across multiple audio sources (e.g., Bluetooth A2DP @ 44.1 kHz, FM tuner @ 48 kHz, USB DAC @ 96 kHz) into unified 192 kHz I2S stream for amplifier DSP.
ESAI + SSI + SPDIF interfaces	Provides three independent audio transport paths - ESAI for multichannel (7.1) car audio, SSI for voice assistant mic array, SPDIF for legacy CD changer - eliminating need for external audio matrix switches.

Applications

Automotive Infotainment Head Unit	Digital Instrument Cluster
Use Scenario: Central touchscreen unit integrating navigation, media, phone projection, and vehicle settings in premium vehicles. IC Role / Device Role / Timing Role: Primary application processor executing Android Automotive OS, managing HDMI/LVDS display outputs, decoding video streams, and interfacing with CAN bus for vehicle data. Use Value: Dual Cortex-A9 + VPU + GPU enables fluid 60 fps UI animation while concurrently decoding rear-camera video and rendering 3D map views - all within 2.5 W typical power envelope.	Use Scenario: Real-time driver information display behind steering wheel, showing speed, ADAS alerts, and energy flow in EVs. IC Role / Device Role / Timing Role: Safety-enhanced graphics processor driving dual 1280×480 TFTs via LVDS, sourcing CAN/FlexRay data, and executing ASIL-B–compliant graphics compositing. Use Value: IPUv3H hardware overlay blending and GPU2D acceleration ensure sub-16 ms latency for critical warning overlays - meeting ISO 26262 timing constraints without software fallback.
Telematics Control Unit (TCU)	Connected Rear-Seat Entertainment
Use Scenario: Cellular-connected gateway aggregating CAN, LIN, and Ethernet data for cloud telemetry, remote diagnostics, and OTA updates. IC Role / Device Role / Timing Role: Secure host processor running Linux-based telematics middleware, managing dual CAN ports, Gigabit Ethernet, and PCIe-connected LTE modem. Use Value: CAAM + A-HABv4 ensures cryptographically signed firmware validation before boot; dual CAN enables simultaneous powertrain and chassis domain monitoring without arbitration delay.	Use Scenario: Dual-screen passenger entertainment system with wireless screen mirroring, local video playback, and Bluetooth headphones. IC Role / Device Role / Timing Role: Multimedia SoC decoding 1080p HEVC streams, driving HDMI and MIPI DSI displays, and processing multi-channel audio via ESAI/ASRC. Use Value: VPU + ASRC + ESAI co-processing allows simultaneous 1080p decode, 7.1 upmixing, and Bluetooth A2DP streaming - all with <100 ms end-to-end audio-video sync deviation.

Automotive Infotainment Head Unit

Digital Instrument Cluster

Use Scenario: Central touchscreen unit integrating navigation, media, phone projection, and vehicle settings in premium vehicles.

IC Role / Device Role / Timing Role: Primary application processor executing Android Automotive OS, managing HDMI/LVDS display outputs, decoding video streams, and interfacing with CAN bus for vehicle data.

Use Value: Dual Cortex-A9 + VPU + GPU enables fluid 60 fps UI animation while concurrently decoding rear-camera video and rendering 3D map views - all within 2.5 W typical power envelope.

Use Scenario: Real-time driver information display behind steering wheel, showing speed, ADAS alerts, and energy flow in EVs.

IC Role / Device Role / Timing Role: Safety-enhanced graphics processor driving dual 1280×480 TFTs via LVDS, sourcing CAN/FlexRay data, and executing ASIL-B–compliant graphics compositing.

Use Value: IPUv3H hardware overlay blending and GPU2D acceleration ensure sub-16 ms latency for critical warning overlays - meeting ISO 26262 timing constraints without software fallback.

Telematics Control Unit (TCU)

Connected Rear-Seat Entertainment

Use Scenario: Cellular-connected gateway aggregating CAN, LIN, and Ethernet data for cloud telemetry, remote diagnostics, and OTA updates.

IC Role / Device Role / Timing Role: Secure host processor running Linux-based telematics middleware, managing dual CAN ports, Gigabit Ethernet, and PCIe-connected LTE modem.

Use Value: CAAM + A-HABv4 ensures cryptographically signed firmware validation before boot; dual CAN enables simultaneous powertrain and chassis domain monitoring without arbitration delay.

Use Scenario: Dual-screen passenger entertainment system with wireless screen mirroring, local video playback, and Bluetooth headphones.

IC Role / Device Role / Timing Role: Multimedia SoC decoding 1080p HEVC streams, driving HDMI and MIPI DSI displays, and processing multi-channel audio via ESAI/ASRC.

Use Value: VPU + ASRC + ESAI co-processing allows simultaneous 1080p decode, 7.1 upmixing, and Bluetooth A2DP streaming - all with <100 ms end-to-end audio-video sync deviation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive multimedia processor applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MCIMX6U6AVM10AC	Same dual-core Cortex-A9 architecture but rated for 1 GHz operation (vs. 800 MHz); identical VPU/GPU/MLB feature set and automotive temp grade.	Targeted at higher-performance infotainment with heavier UI loads (e.g., 3D navigation with live traffic) where thermal headroom permits 1 GHz sustained operation.	Select MCIMX6U6AVM10AC only if system-level thermal design validates >1 GHz operation with 24 MHz USB clock constraint (max 996 MHz).
MCIMX6S6AVM08AB	Solo variant: single Cortex-A9 core, 32-bit DDR interface, no VPU, same GPU/MLB/CAN features and automotive qualification.	Suitable for cost-sensitive clusters or entry-level head units where 1080p video decode is not required but dual-display 2D graphics and CAN/MLB remain essential.	Choose MCIMX6S6AVM08AB when VPU is unnecessary and BOM cost reduction is prioritized over multimedia throughput - retains identical pinout and software compatibility.

Compared with MCIMX6U6AVM08AB, MCIMX6U6AVM10AC offers higher CPU frequency at identical feature depth, while MCIMX6S6AVM08AB reduces core count and removes VPU to lower cost and power - both share the same MAPBGA package, automotive qualification, and peripheral set except video acceleration.

Availability

MCIMX6U6AVM08AB is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and telematics control units requiring stable component supply across extended product lifecycles and AEC-Q100–compliant manufacturing traceability.

Supply support for MCIMX6U6AVM08AB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications - with deep expertise in Arm-based application processors and automotive functional safety.

The i.MX 6DualLite product line, including MCIMX6U6AVM08AB, was engineered specifically for automotive infotainment and digital cluster applications - integrating multimedia acceleration, automotive networking (CAN/MLB), and hardware security into a single die optimized for ASIL-B system compliance.

FAQ

What is the maximum operating frequency of the MCIMX6U6AVM08AB, and how does USB clocking affect it?

The MCIMX6U6AVM08AB is rated for 800 MHz operation. However, when a 24 MHz crystal is used for USB functionality - which is mandatory for HS USB OTG and host PHYs - the maximum achievable SoC frequency is limited to 792 MHz due to internal PLL constraints. This derating ensures stable USB 2.0 timing while maintaining full functionality of all other peripherals including CAN, MLB, and HDMI. The MCIMX6U6AVM08AB datasheet (IMX6SDLAEC Rev. 9) specifies this condition in Table 1 footnote.

Does the MCIMX6U6AVM08AB support secure boot, and what cryptographic algorithms are accelerated in hardware?

Yes, the MCIMX6U6AVM08AB supports Advanced High Assurance Boot (A-HABv4) with SHA-256 hash verification and 2048-bit RSA signature validation. Its CAAM module accelerates AES-128/256 (ECB/CBC/CTR/GCM), SHA-1/256, MD5, DES/3DES, and RSA operations - enabling secure firmware authentication, encrypted storage, and DRM-compliant media playback without CPU overhead. These capabilities are documented in the i.MX 6Solo/6DualLite Security Reference Manual (IMX6DQ6SDLSRM).

Can the MCIMX6U6AVM08AB drive two independent displays simultaneously, and what interfaces are supported?

Yes, the MCIMX6U6AVM08AB supports concurrent dual-display operation using any combination of its four display interfaces: parallel RGB (up to 225 Mpixels/sec), LVDS (dual-port up to 170 Mpixels/sec), HDMI 1.4 (1080p60), or MIPI DSI (2-lane, 1 Gbps). The IPUv3H handles hardware composition, scaling, and blending between layers - allowing independent resolution, refresh rate, and color space per display. This capability is confirmed in Section 6.1 of the IMX6SDLAEC datasheet.

What automotive networking interfaces are integrated into the MCIMX6U6AVM08AB, and are they AEC-Q100 qualified?

The MCIMX6U6AVM08AB integrates two FlexCAN 2.0B controllers (1 Mbps each) and a full MediaLB (MLB150/50) interface - both qualified per AEC-Q100 Grade 2 (−40°C to +125°C). FlexCAN supports CAN FD framing in software-defined modes, while MLB enables time-triggered audio/video streaming over MOST networks. These interfaces meet ISO 11898 and MOST Cooperation specifications, and their qualification status is verified in NXP's i.MX 6DualLite automotive product documentation.

Is the MCIMX6U6AVM08AB pin-compatible with other i.MX 6DualLite variants such as MCIMX6U4AVM08AB or MCIMX6U1AVM08AB?

Yes, all i.MX 6DualLite automotive-grade MAPBGA variants - including MCIMX6U6AVM08AB, MCIMX6U4AVM08AB, and MCIMX6U1AVM08AB - share identical 224-ball packaging, mechanical footprint, and ball assignment. Functional differences (e.g., presence of VPU or GPU) are implemented via fuse settings and do not affect PCB layout. This pin-to-pin compatibility is explicitly stated in NXP's i.MX 6Solo/6DualLite Package Information document (Rev. 9, Section 6.2).

MCIMX6U6AVM08AB Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Package/Case:: 624-LFBGA

Series:: i.MX6DL

Packaging:: Tray

Product Status:: Not For New Designs

Core Processor:: ARM® Cortex®-A9

Number of Cores/Bus Width:: 2 Core, 32-Bit

Speed:: 800MHz

Co-Processors/DSP:: Multimedia; NEON™ SIMD

RAM Controllers:: LPDDR2, LVDDR3, DDR3

Graphics Acceleration:: Yes

Display & Interface Controllers:: Keypad, LCD

Ethernet:: 10/100/1000Mbps (1)

SATA:: -

USB:: USB 2.0 + PHY (4)

Voltage - I/O:: 1.8V, 2.5V, 2.8V, 3.3V

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: -

Qualification:: -

Security Features:: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Mounting Type:: Surface Mount

Supplier Device Package:: 624-MAPBGA (21x21)

Additional Interfaces:: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

MCIMX6U6AVM08AB FAQ

1.How can I place an order for MCIMX6U6AVM08AB through Aetrix?

Please submit a Request for Quotation (RFQ) for MCIMX6U6AVM08AB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCIMX6U6AVM08AB reliable?

The price and inventory of MCIMX6U6AVM08AB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCIMX6U6AVM08AB is usually 5 days.

3.What payment methods are accepted for MCIMX6U6AVM08AB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCIMX6U6AVM08AB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCIMX6U6AVM08AB?

MCIMX6U6AVM08AB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCIMX6U6AVM08AB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCIMX6U6AVM08AB?

For technical support, including MCIMX6U6AVM08AB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCIMX6U6AVM08AB requirements.

6.How does Aetrix verify that MCIMX6U6AVM08AB is sourced from the original manufacturer or authorized distributors?

All MCIMX6U6AVM08AB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCIMX6U6AVM08AB meets industry standards.

7.What is the process for return or replacement of MCIMX6U6AVM08AB?

All MCIMX6U6AVM08AB units undergo pre-shipment inspection (PSI). If there is an issue with MCIMX6U6AVM08AB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCIMX6U6AVM08AB part is unused and in its original packaging.

Return procedure for MCIMX6U6AVM08AB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…